激光在塑性变形测量中的应用

本文将激光应用于云纹法，研究了缺口滚压强化后根部区域的位移场及应变分布规律。结果表明，本方法是提高塑性变形测量精度的有效手段。     

Digital image capture — Filmless camera technology and techniques

Summaries  The digital imaging revolution continues apace, affecting the whole spectrum of the photographic industry. In many part of the world digital cameras now outsell conventional film cameras, and many of the disadvantages associated with digital image capture in the very recent past^1.2 have been nulified. As the digital industry grows, the various technologies involved continue to be ever innovative. With respect to digital cameras, the image sensor performance criteria have improved immeasurably since the launch of the first solid-state camera in the early 1980s. The charge-coupled semiconductor device (CCD), for so long the unrivalled image-capture component in digital cameras, is now being challenged by complementary metal oxide semiconductor (CMOS) technology and the innovatively re-designed Fujifilm Super CCD. In addition, the recent introduction of the Foveon full-colour imaging sensor has added a new dimension to digital image capture. This paper reviews current image-capture sensors and the way that the various digital imaging camera designs are able to record and reproduce colour images.

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Techniques et technologie de l’appareil sans pellicule et a capteur d’image numérique

Résumé  La révolution provoquée par l’imagerie numérique devient de plus en plus importante et a une influence sur le spectre entier de l’industrie photographique. Il y a beaucoup d’endroits dans le monde ou l’on vend plus d’appareils photo numériques que d’appareils photo de tradition, et beaucoup des inconvenients qui étaient relatifs à la capture d’image numérique dans le passé recent récent ont été supprimés. Au fur et à mesure que l’industrie photographique s’accroft, les plusieurs technologies relatives continuent d’être de plus en plus innovatrices. Quant aux appareils photo numériques, les critères de la performance du capteur d’image ont amélioré infiniment depuis le lancement du premier appareil photo à semi-conducteurs tot dans les annees 80. Le dispositif à transfert de charges (CCD), depuis si longtemps le composant sans pareil en ce qui concerne la capture d’image, est remis en question par la technologie du métal-oxyde-semi-conducteur complémentaire (CMOS) et par le Fujifilm Super CDD qui a été repensé d’une manière tres innovatrice. En plus, l’introduction récente du capteur Foveon pour image couleur a ajouté une nouvelle dimension à la capture d’image numérique. Cet article examine les capteurs d’image courants aussi bien que la fa?on dont les plusieurs conceptions d’appareils photo à imagerie numérique sont capables d’enregistrer et de reproducire des images en couleur.

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Digitale Fotografie — Technologie und Technik der film-losen Kamera

Zusammenfassung  Die digitale Revolution geht weiter voran und hat das ganze Spektrum der fotografischen Industrie ergriffen. In vielen Teilen der Welt werden heute mehr digitale Kameras als konventionelle Filmkameras verkauft, und viele der anfaenglichen Nachteile der digitalen Bilderfassung bestehen heute nicht mehr. Viele Innovationen treiben die Digitalindustrie voran. Bei Digitalkameras hat sich die Bildsensorleistung von den ersten Modellen in den fruehen 80er Jahren enorm entwickelt. Die Charge-coupled Device (CCD), so lange der unangefochtene K?nig der digitalen Bilderfassung, bekommt heute von komplimentĂren Metalloxidhalbleitern (CMOS) und von der innovativ neu-entwickelten Fujifilm Super CCD Konkurrenz. Dazu hat die Einführung des Foveron Vollfarbbildsensors der Digitalfotografie eine neue Dimension verliehen. Diese Arbeit vergleicht die gegenwartigen Bilderfassungssensoren, und wie verschiedene Digitalkamera-Varianten Farbbilder aufnehmen und wiedergeben.

     

泰伯-莫尔法测量长焦距系统的焦距

焦距是透镜最重要的光学参数，应用泰伯-莫尔法测量长焦距透镜焦距具有重要的实践价值。本文介绍了泰伯-莫尔法的原理，详细分析了各种实验方法，进行分类比较，并提出了改进措施。     

用moire技术测量平板玻璃折射率

本文描述了使用moire技术测量平板玻璃折射率的理论并进行了实验论证。测量方法简单且快捷。可精确测量任何透明材料的折射率。测量精确度可达10~(-5)。     

傅里叶变换莫尔偏折术用于自动测量气体温度场

将傅里叶变换条纹位相分析方法用于莫尔偏折术，实现了对轴对称温度场的高精度和自动化测量     

钢结构在地震荷载作用下的大塑性交变应变测试方法研究

针对钢结构在抗震性能试验中，测试大塑性交变应变时存在一些问题研制出了一种新型试件光栅-胶性超微粒光栅，使交变性大应变可用云纹法准确而方便的获得．通过实验验证，其应变测试范围为-40％-40％，并应用到工字型钢柱的抗震性能试验中去，获得了满意的结果．     

LED显示屏在数码照相或摄像时出现的若干问题及解决方案探讨

LED显示屏已成为演艺行业背景效果的主角,而如今绝大部分照相和摄像设备都已经进入数字化时代,大家会发现我们的摄影设备用同样的设置方式能拍摄到很完美的普通实物的影像,而在拍摄到LED显示屏的图像时,经常会出现一些不理想的影像效果。文章就此问题展开探讨,使摄影师了解其中的真正原因,使设计人员在LED显示屏的设计中了解怎样设定显示屏的规格,避免此类问题出现,提高LED屏体的整体性价比。     

High Resolution Optical Interference Measurements of Changes in Bond-Line Thickness—A Review

A novel moire optical interference method, originally developed¹ to measure the swelling displacement normal to the plane of a simple butt joint during water uptake at the joint edge, was subsequently used to investigate the unexpected occurrence of shrinkage and, at the same time, swelling during exposure to organic solvents. In later experiments, synergistic displacement fields generated during simultaneous exposure to water and organic solvents were studied. The same method has also been used to investigate the origin of adhesion failures at copper plated-through holes in thermally cycled multi-layer circuit boards.

The method employs a thin glass cover slip as one adherend. Changes in bondline thickness flex the cover slip thereby changing the gap between the latter and a nearby optical flat. By using monochromatic light to illuminate the specimen, interference between incident and reflected light is achieved. The small displacements of individual fringes associated with changes in gap size are used to generate moire patterns which bear a 1:1 relationship to the local changes in bondline thickness. Application of thin plate elasticity theory to the flexing of the cover slip yields the stress acting normal to the joint. The magnitude of this normal stress is strongly inhomogeneous, oscillating in sign and reaching compressive values as high as 50MNm^?2 for water uptake by a simple butt joint, and exceeding the yield strength of oxygen-free high conductivity copper (1MNm^?2) for the thermal expansion that accompanies simulated soldering of a multi-layer circuit board.

Attention is drawn to the high resolution achievable with the method. Changes in bond-line thickness of the order of Δ/10, where Δ is the wavelength of the light giving rise to the interference pattern, are readily resolved. It is pointed out that the method may well be sufficiently sensitive to detect the effects of different physical properties (thermal conductivity, specific heat capacity) of adherend surface on the nature of the cured adhesive and hence on the mechanical behaviour of the bond-line.     

投影云纹偏转法用于DKDP晶体生长研究

溶液晶体生长与溶液的过饱和度及浓度有关。本文用投影云纹偏转法实时显示和定量测量DKDP晶体的浓度扩散层内的浓度梯度和晶面浓度，以决定生长所采用的方法。     

Internal Stresses Adjacent to a Hole Through a Multilayer Wiring Board

The normal displacement field close to copper plated-through holes (PTH) in multilayer laminated circuit boards that is generated during thermal expansion is strongly inhomogeneous. By adhering a thin, and therefore flexible, microscope cover slip to the top surface of the laminate, Fizeau optical interference fringes can be generated between the cover slip and an adjacent optical flat and used to map the displacement field; the precise distribution of these fringes changes when the distance between the two is changed by thermally expanding or contracting the laminate. Thin plate elasticity theory applied to the cover slip permits the distribution of normal stress in the laminate to be estimated. Moving radially outwards from the centre of a PTH the normal stress is found to oscillate in sign in a highly damped manner such that the amplitude is insignificant beyond the first cycle. The largest normal stresses in the laminate are found to act at a radial distance corresponding to the outer edge of the copper surface pad. Thus, with increase of temperature, there develops a circular locus of tensile normal stress in the laminate\pad combination at a radius less than, but immediately adjacent to, the edge of the pad and a locus of normal compression in the laminate alone at a radius slightly greater than that for the outside edge of the pad. Both the tensile and compressive peaks increase at a rate of 1.6 MPa/K. With decrease of temperature the opposite holds true except that the stressing rate is lower at 0.6 MPa/K. The fact that, independent of whether the temperature is increased or decreased from room temperature, there exist annular regions of tensile stress within and normal to the plane of the laminate explains the occurrence during changes of temperature of hidden delaminations, including, in multilayer circuit boards, debonding of interlayer copper conductors. The similarity of this configuration to bolt holes in composite structures is discussed.