Assessment of local strain field in adhesive layer of an unsymmetrically repaired CFRP panel using digital image correlation

The present study focuses on experimental investigation of through the thickness displacement and strain field in thin adhesive layer in single sided (unsymmetrical) patch repaired CFRP (carbon fiber reinforced polymer) panel under tensile load. Digital image correlation (DIC) technique is employed to acquire the displacement and strain (longitudinal, peel and shear) field. Experimental determination of shear transfer length based on shear strain field obtained from DIC is introduced to estimate the optimum overlap length which is an essential parameter in patch design for the repair of CFRP structures. Further, DIC experiment with magnified optics is performed to get an insight into complex and localized strain field over thin adhesive layer especially at critical zones leading to damage initiation. The failure mechanism, load displacement behavior, damage initiation and propagation are closely monitored using DIC. The influence of patch edge tapering on strain distribution in adhesive layer is also investigated. The DIC successfully captures the global and localized strain field at critical zones over thin adhesive layer and further helps in monitoring the damage based on strain anomalies. Strains are found to have maximum magnitude at the patch overlap edge and the shear strain level in adhesive layer is higher than the peel strain. Normal tapering increases the peel strain and has negligible influence on shear strain level in adhesive layer. The recommended overlap length is found to be consistent with the recommendation in the literature. Whole field strain pattern and the overlap length obtained from experiment are further compared with the finite element analysis results and they appear to be in good coherence.     

Synthesis and properties of peroxy derivatives of epoxy resins based on Bisphenol A: Effects of the presence of boron trifluoride ethereate

Oligomers containing peroxy groups have been synthesized on the basis of epoxides reacting with tert–butylhydroperoxide in the presence of boron trifluoride etherate. Dependence of reaction rates upon the quantity of catalyst, temperature and also nature of hydroperoxide has been investigated: A kinetic equation for the process has been formulated and also a kinetic scheme for the reaction taking into account the presence of boron trifluoride etherate is proposed. Structures of the synthesized peroxy oligomers have been confirmed by IR- and NMR-spectroscopy. The reaction initiating properties of the oligomers so synthesized were studied using as the example the styrene polymerization reaction. Electronic Publication     

Fluorescence and IR characterization of epoxy cured with aliphatic amines

Cure reactions of the stoichiometric mixtures of diglycidyl ether of bisphenol A (DGEBA) and two very low molecular weight aliphatic polyether diamines (PED) were studied by using fluorescence and mid- and near-IR spectroscopic techniques. As the cure proceeded, the primary amine groups in PED are converted to the secondary and the tertiary amines. Near-IR spectral analysis was used to calculate the concentration of the three amine groups as a function of cure time. The decrease in the fluorescence intensity of DGEBA at about 307 nm was observed due to more effective quenching of the tertiary amine groups in PED, in comparison to the primary and the secondary amine groups. A large decrease in fluorescence intensity at 75 and 95 °C cure was observed. The amount of all the amine species was estimated from NIR spectra to shed light on the cure kinetics of PPO (polypropylene oxide) in comparison with PEO (polyethylene oxide) epoxy, as well as to explain their fluorescence behavior.The fluorescence intensity changes were correlated to the extent of epoxy reaction obtained by mid- and near-IR spectroscopy.     

Optimized species growth in epoxy polymerization with real-coded NSGA-II

Satisfaction of twin objectives of maximization of M_n along with minimization of PDI do not necessarily guarantee the maximization of concentration of desired species in a semibatch epoxy polymerization process. As the final product consists of a number of polymer species, a need is felt to perform an advanced optimization study to come up with such process conditions for which the selective growth of a particular polymer species is maximized in minimum possible processing time and the population of other species should be at their lowest values. These above-mentioned conflicting objectives frame the platform for a multi-objective optimization problem, which is solved here using a real-coded non-dominated sorting genetic algorithm or NSGA II and Pareto optimal solutions are obtained. The decision variables are discrete addition rates of various ingredients, e.g. the amount of addition of bisphenol-A (a monomer), sodium hydroxide and epichlorohydrin at different time steps. All species balance equations, bounds on M_n, PDI and addition amounts are treated as constraints. Results are very promising in terms of optimized operations for selective enhancement of desired polymer species for the epoxy polymerization process. Total additions are kept very close to available experimental conditions to minimize probable extrapolation errors. It has been observed that preferential oligomer production is extremely difficult for epoxy polymerization. Lower chain polymers are the only choice for a good quality, stable polymer product.     

Epoxy paint failure in B-52 fuel tanks: Part II. Influence of DIEGME concentration in the fuel on the failure process

A model has been proposed to explain the failure of the original BMS10-39 epoxy paint on upper vertical surfaces in B-52 fuel tanks. The model involves interaction of the paint with DIEGME, a fuel system ice inhibitor (FSII) in jet fuel, that is distilled from the liquid fuel. In this communication, distillation experiments used to support the model are refined to better match the mass transfer of vapor from fuel in a B-52 fuel tank at close to room temperature. The interaction of these lower temperature distillates with the paint affirms the earlier model. On the basis of these experiments it is proposed that paint failure may be controlled or eliminated by reducing the level of DIEGME in the fuel. Proposed changes in military jet fuel composition are detailed.     

Recent advances in isotropic conductive adhesives for electronics packaging applications

Isotropic conductive adhesives (ICAs) have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-bearing solders. Numerous studies have shown that ICAs possess many advantages over conventional soldering such as environmental friendliness, finer pitch printing, lower temperature processing and more flexible and simpler processing. However, complete replacement of soldering by ICAs is yet not possible owing to several limitations of ICAs which are mainly related to reliability aspects like limited impact resistance, unstable contact resistance, low adhesion and conductivity etc. Continued efforts for last 15 years have resulted in development of ICAs with improved properties. This review article is aimed at providing a better understanding of ICAs, their principles, performance and significant research and development work addressing the technological utility of ICAs.     

Use of rheology, dielectric analysis and differential scanning calorimetry for gel time determination of a thermoset

Measurements of gel time of the epoxy system DGEBA(n=0)/m-XDA were carried out using rheometry and dielectric analysis with the objective of checking the validity of Mangion-Johari equation (DEA) and Harran-Laudouard criterium (rheometry) for gel time determination. In this work, gel times obtained by rheometry and dielectric analysis are compared and conversions at gel time calculated. From the experimental results obtained for gel times it was found a reasonable agreement between the two techniques that lead to gel conversion values very close to those obtained using Flory equation.     

Preparation of polyimide-epoxy composites

The formation of a three dimensional network of crosslinked epoxy leads all unmodified epoxies to have inherent brittleness and relatively low degradation temperatures. Polyimides, on the other hand, are widely used for applications that require high degrees of flexibility and thermal resistance. Here, we have focused on the preparation of epoxy systems cured with polyamic acids instead of traditional amino-group-containing hardening agents. The cure behavior and potential reaction mechanisms of EPON 828 resin and polyamic acid mixtures were evaluated by DSC and TGA. Thermal analysis showed a complex reaction sequence taking place in the mixture and also determined the extent of reaction of the polyamic acid with itself and the competitive reaction of the polyamic acid with the epoxy. The compositions of the mixtures were varied to see the dependence of the cure behavior on component concentrations. Solutions of the two components did not phase separate and also phase separation was not apparent either optically or microscopically in the cured samples. This phase behavior was attributed to a unique in situ reaction. A novel solvent system for the polyamic acid precursor was also used.     

辐射剂量对环氧树脂电子束固化行为的影响

分析了电子束剂量对环氧树脂体系辐射固化行为的影响规律。研究结果表明，电子束辐射过程中，温度由树脂辐射体系表面向内部逐渐降低，随着辐射剂量提高，树脂体系温度上升，辐射表面与内部的温度梯度加大，高辐射剂量下的温度变化缓慢。树脂辐射固化层厚度以及在相同厚度的固化程度均随辐射剂量增加，但增幅逐渐变小，树脂辐射固化度沿固化深度会加速下降。