钼酸铵复合缓蚀剂对LY12铝合金的缓蚀作用

采用电化学方法研究了钼酸盐、锌盐和苯并三氮唑 (BTA)对LY12铝合金在 3 5 %NaC1溶液中的缓蚀作用。结果表明 ,随着钼酸盐浓度的增大 ,缓蚀效率增大 ,达到一个最大的值后基本保持不变。钼酸盐通过抑制铝合金的阴极反应和阳极溶解实现缓蚀作用。钼酸盐与锌盐和BTA复合后 ,明显提高了对铝合金的缓蚀作用 ,表现出良好的协同效应     

磁场作用下苯并三氮唑对黄铜的缓蚀性能研究

采用极化曲线和交流阻抗谱研究了苯并三氮唑(BTA)对黄铜/模拟水腐蚀体系的缓蚀作用,以及电磁场作用下BTA对黄铜电极缓蚀性能的变化.结果显示,BTA对该体系有较好的缓蚀作用;电磁处理和BTA联合作用时,腐蚀电流密度较缓蚀剂单独作用时进一步下降;电磁处理促进了缓蚀剂BTA在金属表面的吸附;在一定时间范围内,磁处理时间越长,BTA对黄铜电极的缓蚀性能越好.     

新型复合型铜缓蚀剂的实验研究

用电化学和失重法，研究了一种以DG1和BTA为成分的复配缓蚀剂对黄铜的缓蚀作用，并同BTA单独使用时的缓蚀效果比较，发现这种复配缓蚀剂有更优的缓蚀性能，并通过实验找出了两种缓蚀剂的最佳配比：在总浓度为５ mg/L和质量比DG1∶BTA=3∶2时缓蚀效果最好，使用最经济，通过极化曲线分析，复配缓蚀剂为偏阳极混合型缓蚀剂.     

溴化锂溶液中苯并三氮唑对碳钢缓蚀作用研究

为降低溴冷机中碳钢的腐蚀,通过失重法和电化学方法研究了含有0.07 mol/L LiOH和150mg/L Na2MoO4的55%LiBr、60%LiBr溶液中苯并三氮唑(BTA)对碳钢的缓蚀作用.结果表明,在溴化锂溶液中添加BTA时可显著降低碳钢腐蚀;55%LiBr、60%LiBr溶液中BTA的最佳添加量为100 mg/L;55%LiBr溶液中,BTA通过与铁离子形成Fe-BTA型配合物覆盖在金属表面阻碍浸蚀性Br-吸附而起缓蚀作用;60%LiBr溶液中,BTA则与MoO42-共同作用,在碳钢表面形成MoO2、MoO3和Fe-BTA致密钝化膜减缓金属活性溶解.     

复合型深孔加工机床的研究

现代深孔加工机床加工方式分为外排屑（枪钻）和内排屑（BTA钻）两种,他们的供油通道和排屑通道相反、钻孔直径范围大小不同。研究了双主轴双导向型、单主轴双导向型、单主轴单导向型3种结构的复合型深孔加工机床,比较了这3种结构机床的优缺点。采用BTA和枪钻两种加工方式,可完成复杂机械零件较大孔径范围的深孔加工。     

深孔加工切削液造成BTA钻杆涡动分析

利用BTA钻杆内切削液的Reynolds方程,得出钻杆所受流体力与钻杆转速、涡动和挤压效应之间的关系。分析深孔加工钻杆产生涡动的原理,指出促进钻杆正进动的流体分力是钻杆发生涡动的根本原因。模拟并分析了在不同时刻钻杆圆涡动形态,指出在只受到流体力时,钻杆可以稳定地运动。研究钻杆的反进动,揭示挤压油膜阻尼器的工作原理。利用MATLAB软件模拟分析添加挤压油膜阻尼器前、后钻杆的运动情况,证明挤压油膜阻尼器可以显著减小钻杆涡动。     

Theoretical and experimental study on rifling mark generating phenomena in BTA deep hole drilling process (generating mechanism and countermeasure)

Boring and Trepanning Association (BTA) deep hole drilling is used for producing holes with high aspect ratios. In this process, chatter vibration sometimes occurs, and a rifling mark is formed on the bore surface. The rifling mark generating phenomenon is considered to be a result of self-excited vibration caused by time delay. An analytical model is proposed considering the supporting condition of the boring bar in detail. In a real machine for BTA drilling, the boring bar is supported at the oil pressure head and the supporting pad, as well as at the base. The stability of the self-excited vibration is analyzed numerically, and the result is compared with the experiment. The theoretical and experimental results agree well with each other. Furthermore, the effect of an additional guide pad proposed by the authors as a countermeasure is evaluated theoretically and experimentally.     

基于稳健设计理论的深孔加工孔直线度研究

针对BTA深孔加工中孔中心线容易产生偏斜的问题,用稳健优化设计理论研究了当加工条件参数变化时被加工孔直线度误差的变化情况.将稳健设计理论用于讨论BTA深孔加工时控制因素的选择,得到了控制因素的优化设计结果.通过试验证明使用稳健设计法对控制因素的分析和预测是正确的.该研究结果可为BTA深孔加工控制因素的分析和选择提供参考.     

Benzotriazole as the additive for ionic liquid lubricant: one pathway towards actual application of ionic liquids

In this paper, we report on the first tribological evaluation of the room temperature ionic liquids (RTILs) compatible lubricant additive. Benzotriazole (BTA) was chosen for study in that it shows good miscibility with imidazole ionic liquids because of similar molecular structure. BTA can greatly improve the tribological behaviors of ionic liquids carrying hexafluorophosphate anions for Steel/Cu–Sn alloy sliding pair mainly because of the alleviation of corrosion. The worn surface of the bronze was investigated by X-ray photoelectron spectroscopy (XPS), which revealed complex tribochemical reactions during the sliding process. A protective film comprised of [Cu(–C₆H₅N₃)] and Cu₂O is formed. Strong interaction between benzotriazole and the surface of Cu alloy was proposed to account for the excellent anti-wear and anti-corrosion improvement capability.     

Synergetic effect of chelating agent and nonionic surfactant for benzotriazoleremoval on post Cu-CMP cleaning

The cleaning of copper interconnects after chemical mechanical planarization (CMP) process is a critical step in integrated circuits (ICs) fabrication. Benzotriazole (BTA), which is used as corrosion inhibitor in the copper CMP slurry, is the primary source for the formation of organic contaminants. The presence of BTA can degrade the electrical properties and reliability of ICs which needs to be removed by using an effective cleaning solution. In this paper, an alkaline cleaning solution was proposed. The alkaline cleaning solution studied in this work consists of a chelating agent and a nonionic surfactant. The removal of BTA was characterized by contact angle measurements and potentiodynamic polarization studies. The cleaning properties of the proposed cleaning solution on a 300 mm copper patterned wafer were also quantified, total defect counts after cleaning was studied, scanning electron microscopy (SEM) review was used to identify types of BTA to confirm the ability of cleaning solution for BTA removal. All the results reveal that the chelating agent can effectively remove the BTA residual, nonionic surfactant can further improve the performance.