A Self-Healing Nanofiber-Based Self-Responsive Time-Temperature Indicator for Securing a Cold-Supply Chain

Perishable foods at undesired temperatures can generate foodborne illnesses that present significant societal costs. To certify refrigeration succession in a food-supply chain, a flexible, easy-to-interpret, damage-tolerant, and sensitive time-temperature indicator (TTI) that uses a self-healing nanofiber mat is devised. This mat is opaque when refrigerated due to nanofiber-induced light scattering, but becomes irreversibly transparent at room temperature through self-healing-induced interfibrillar fusion leading to the appearance of a warning sign. The mat monitors both freezer (−20 °C) and chiller (2 °C) successions and its timer is tunable over the 0.5–22.5 h range through control of the polymer composition and film thickness. The thin mat itself serves as both a temperature sensor and display; it does not require modularization, accurately measures localized or gradient heat, and functions even after crushing, cutting, and when weight-loaded in a manner that existing TTIs cannot. It also contains no drainable chemicals and is attachable to various shapes because it operates through an intrinsic physical response.     

Correction to: A note on the three methods of item analysis

Behaviormetrika - In the original publication of the article, Appendix A was published incorrectly.     

Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications

A highly reliable conductive adhesive obtained by transient liquid‐phase sintering (TLPS) technologies is studied for use in high‐power device packaging. TLPS involves the low‐temperature reaction of a low‐melting metal or alloy with a high‐melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag‐coated Cu, a Sn96.5‐Ag3.0‐Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 °C, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.     

A New Potent and Selective Monoamine Oxidase-B Inhibitor with Extended Conjugation in a Chalcone Framework: 1-[4-(Morpholin-4-yl)phenyl]-5-phenylpenta-2,4-dien-1-one

The general blueprint for the design of monoamine oxidase-B (MAO-B) inhibitors has been based on two phenyl or heteronuclei linked via a spacer of appropriate length. In this study, 1-[4-(morpholin-4-yl)phenyl]-5-phenylpenta-2,4-dien-1-one (MO10) was prepared by the condensation of 4′-morpholinoacetophenone and cinnamaldehyde in basic alcoholic medium. MO10 was assessed for inhibitory activity against two human MAO isoforms, MAO-A and MAO-B. Interestingly, MO10 showed a remarkable inhibition against MAO-B with an IC₅₀ value of 0.044 μM along with a selectivity index of 366.13. The IC₅₀ value was better than that of lazabemide (IC₅₀ value of 0.063 μM), which was used as a reference. Kinetics studies revealed that MO10 acted as a competitive inhibitor of MAO-B, with a K_i value of 0.0080 μM. The observation of recovery of MAO-B inhibition, compared to reference levels showed MO10 to be a reversible inhibitor. MTT assays showed that MO10 was nontoxic to normal VERO cells with an IC₅₀ value of 195.44 μg/mL. SwissADME predicted that MO10 provided advantageous pharmacokinetics profiles for developing agents acting on the central nervous system, that is, high passive human gastrointestinal absorption and blood–brain barrier permeability. Molecular docking simulations showed that MO10 properly entered the aromatic cage formed by Y435, Y398, and FAD of the active site of MAO-B. On the basis of these results, MO10 can be considered a promising starting compound in development of agents for the treatment of various neurodegenerative disorders.     

N-doped anodic titania nanotube arrays for hydrogen production

Titanium dioxide (TiO₂) nanotube arrays are grown in a mixed electrolyte by anodizing process. The anodic nanotubes for N-doping were calcinated at 773 K in a tube furnace with a mixture of NH₃ and Ar gas. The photocatalytic activity of N-doped TiO₂ nanotubes was carried out in a water-splitting reaction under UV and visible light irradiation. Various characterization techniques (Scanning electron microscopy, X-ray diffractometry, X-ray photo-electron spectroscopy, etc.) are used to study the surface morphology, phase of structure, and binding energy.     

Design and manufacture of a toroidal-type SMES for combination with real-time digital simulator (RTDS)

The authors designed and manufactured a toroidal-type superconducting magnetic energy storage (SMES) system. The toroidal-type SMES was designed using a 3D CAD program. The toroidal-type magnet consists of 30 double pancake coils (DPCs). The single pancake coils (SPCs), which constitute the double pancake coils, are arranged at an angle of 6° from each other, based on the central axis of the toroidal-type magnet. The cooling method used for the toroidal-type SMES is the conduction cooling type. When the cooling method for the toroidal-type SMES was designed, the two-stage Gifford–McMahon (GM) refrigerator was considered. The Bi-2223 HTS wire, which was made by soldering brass on both sides of the superconductor, is used for the magnet winding. Finally, the authors connected the toroidal-type SMES to a real-time digital simulator (RSCAD/RTDS) to simulate voltage sag compensation in a power utility.     

Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy‐dispersive X‐ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre‐existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.