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1.
Two-dimensional transistors are promising candidates for the next generation of nanoscale devices. Like the other alternatives, they also encounter problems such as instability under standard condition (STP), low channel mobility, small band gaps, and difficulty to integrate metal contacts. The latter poses a great challenge since metal/semiconductor interface significantly affects the transistor‘s performance. Some of these obstacles can be solved by using two-dimensional transition metal di-chalcogenides (TMDC) materials. In this study, we performed charge transport calculation based on density functional theory (DFT) followed by wave dynamics to evaluate the performance of six two-dimensional TMDC metal/semiconductor/metal systems. Each semiconductor monolayer was laterally connected, at both ends to metal contacts consisting of VS2 or FeS2 monolayers. We found that charge transport was more efficient in systems containing a CrS2 semiconductor monolayer compared to systems with MoS2 or WS2 as the semiconductor monolayer. The electronic characterization of the monolayer TMDC materials by DFT estimates well the trend in charge transport efficiency calculated using wave packet dynamics.  相似文献   
2.
Pristine and (SiC+Te)-added MgB2 powders, green and spark plasma sintered (SPS) compacts were investigated from the viewpoint of quasi-static and dynamic (Split-Hopkinson Pressure Bar, SHPB) compressive mechanical properties The amount of the additive (SiC+Te) was selected to be the optimum one for maximization of the superconducting functional parameters. Pristine and added MgB2 show very similar compressive parameters (tan δ, fracture strength, Vickers hardness, others) and fragment size in the SHPB test. However, for the bulk SPSed samples the ratio of intergranular to transgranular fracturing changes, the first one being stronger in the added sample. This is reflected in the quasi-static KIC that is higher for the added sample. Despite this result, sintered samples are brittle and have roughly similar fragmentation behavior as for brittle engineering ceramics. In the fragmentation process, the composite nature of our samples should be considered with a special focus on MgB2 blocks (colonies) that show the major contribution to fracturing. The Glenn-Chudnovsky model of fracturing under dynamic load provides the closest values to our experimental fragment size data.  相似文献   
3.
Theoretical treatments forecast that bistable CMOS devices using electronic charge as a state variable will operate at their maximum thermal dissipation limit possibly as early as 2012. The problem is further compounded by increasing manufacturing challenges associated with the ever decreasing logic switch dimensions. These challenges require the development of new fabrication strategies that replace or complement current top-down lithography with bottom-up protocols using controlled self-assembly of nanomaterial building blocks. To answer some of these issues, this paper focuses on a new device paradigm consisting of an arene-metal-arene conformational switch, addressable through capacitive, inductive, or resonant-tunneling field coupling. The operating principle is based on voltage-tunable modulation in quantum electron transmission. The switch is open (off) when the metal ion is displaced to a position at a C-H bond on the arene ring due to an externally applied bias. Conversely, when the external bias is removed, the metal ion moves to an axis- symmetric position on the arene ring, and the switch is closed (on). The paper presents a summary of the architecture, operating principle, and advantages of the conformational switch, along with associated findings from proof-of-concept theoretical and experimental studies of its target specifications and performance. The paper also discusses opportunities and challenges related to the integration of conformational switches into hybrid CMOS-molecular and monolithic (all molecular) circuits.  相似文献   
4.
After the break-up of Czechoslovakia in 1993 the primary metrological standards authority almost fully remained in Slovakia. So we had to build our primary vacuum metrology anew. But we could do it using uptodate techniques that are more effective and they enable us to fulfil our task more effectively and in a shorter time.The steady demand to widen the lower pressure range and a steady demand for maximal accuracy collide with the financial possibilities open to a small country. So it is impossible to follow the classical pattern for the vacuum standards: liquid columns, static expansion system and dynamic expansion system. But it is possible to utilize contemporary progress in construction of piston manometers. This enables us to discard liquid column and static expansion techniques in favour of piston technique [Tesar J, Prazak D. Vacuum 2002; 67: 311, Tesar J, Prazak D, Krajicek Z. In:Proceedings of international symposium on Pressure and Vacuum, 2003. p. 169, Tesar J, Repa P, Prazak D, Krajicek Z, Peksa L. Vacuum 2004; 76: 491.]. Such system fulfils all the needs of a little industrial country and is economically acceptable.  相似文献   
5.
Never before have regional scientists had access to individual census data for an entire country. The paper describes the application of a taxonomic procedure to classify the 15.6 million households identified by the 1971 Italian census. The results are important both for what they reveal about Italian social structure and because they provide a basis for a constructing aggregate census data so that within area variations are retained.  相似文献   
6.
Catalyst instabilities during the liquid phase partial oxidation of methane   总被引:2,自引:0,他引:2  
A promising catalytic system for the low temperature oxidation of methane to a methanol derivative has been investigated under both batch and semi-continuous operation in two different reactor types. The system comprises of a bimetallic palladium and copper(II) chloride catalyst contained in a trifluoroacetic acid (TFA) and an aqueous phase. Methane, oxygen and a co-reductant carbon monoxide constitute the gas phase. Typical operating conditions were a temperature of 85 °C and a pressure of 83 bar.

The yields of the methyl trifluoroacetate product observed in this present work were less than those obtained in other batch autoclave works, which employed only 4 ml of liquid phase, compared with 50 ml in this study. Furthermore, an encouraging initial product formation rate of ca. 40 mol/m3 h, quickly decreased after the first hour, and came to an apparent end after only 2 h. This observation had not been reported previously.

Work performed in a semi-continuous porous tube reactor (300 ml of re-circulating liquid phase) also showed the same reaction characteristics as in the batch reactor. Thus, the deteriorating product formation rate cannot be attributed to gaseous reactant depletion (batch operation). The results suggest problems associated with catalyst instabilities, e.g. with the previously elucidated Wacker chemistry.  相似文献   

7.
A new definition of the testability transfer factor for circuit components that provides better sensitivity with respect to parametric deviations is presented. New equations for the testability measures in a mixed-signal core are given. Testability analysis is used for test-pattern generation and for consideration of inserting wrapper cells. The simulation results show the effectiveness of the approach.  相似文献   
8.
This paper employs dissipativity theory for the global analysis of limit cycles in particular dynamical systems of possibly high dimension. Oscillators are regarded as open systems that satisfy a particular dissipation inequality. It is shown that this characterization has implications for the global stability analysis of limit cycle oscillations: i) in isolated oscillators, ii) in interconnections of oscillators, and iii) for the global synchrony analysis in interconnections of identical oscillators  相似文献   
9.
HotSpot: a compact thermal modeling methodology for early-stage VLSI design   总被引:3,自引:0,他引:3  
This paper presents HotSpot-a modeling methodology for developing compact thermal models based on the popular stacked-layer packaging scheme in modern very large-scale integration systems. In addition to modeling silicon and packaging layers, HotSpot includes a high-level on-chip interconnect self-heating power and thermal model such that the thermal impacts on interconnects can also be considered during early design stages. The HotSpot compact thermal modeling approach is especially well suited for preregister transfer level (RTL) and presynthesis thermal analysis and is able to provide detailed static and transient temperature information across the die and the package, as it is also computationally efficient.  相似文献   
10.
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