Effect of Cu-Rich Phase Precipitation on the Microstructure and Mechanical Properties of CoCrNiCux Medium-Entropy Alloys Prepared via Laser Directed Energy Deposition

CoCrNiCux (x=0.16,0.33,0.75,and 1) without macro-segregation medium-entropy alloys (MEAs) was prepared using laser directed energy deposition (LDED).The microstructure and mechanical properties of CoCrNiCux alloys with increas-ing Cu content were investigated.The results indicate that a single matrix phase changes into a dual-phase structure and the tensile fracture behaviors convert from brittle to plastic pattern with increasing Cu content in CoCrNiCux alloys.In addi-tion,the tensile strength of CoCrNiCux alloys increased from 148 to 820 MPa,and the ductility increased from 1 to 11％with increasing Cu content.The nano-precipitated particles had a mean size of approximately 20 nm in the Cu-rich phase area,and a large number of neatly arranged misfit dislocations were observed at the interface between the two phases due to Cu-rich phase precipitation in the CoCrNiCu alloy.These misfit dislocations hinder the movement of dislocations during tensile deformation,as observed through transmission electron microscopy.This allows the CoCrNiCu alloy to reach the largest tensile strength and plasticity,and a new strengthening mechanism was achieved for the CoCrNiCu alloy.Moreover,twins were observed in the matrix phase after tensile fracture.Simultaneously,the dual-phase structure with different elastic moduli coordinated with each other during the deformation process,significantly improving the plasticity and strength of the CoCrNiCu alloy.     

城市排水管网风险评估研究

总结了常见的城市排水管网风险评估的方法及软件,对污水管网的气体爆炸风险、雨水管网的内涝风险、综合风险这三类风险评估的文献进行了归纳整理,并对未来的研究重点及趋势做出了预测。     

Correction to: Two New Co(II) Complexes of Picolinate: Synthesis,Crystal Structure,Spectral Characterization, α-Glucosidase İnhibition and TD/DFT Study

Journal of Inorganic and Organometallic Polymers and Materials -     

玻璃纤维和硅酸钠复合对盐石膏性能的影响

盐石膏的水化强度极低,需通过添加外加剂来改善盐石膏的强度,本文通过在盐石膏中单掺玻璃纤维、硅酸钠及两者复合来改善盐石膏的性能.结果 表明,单掺玻璃纤维提高了盐石膏的强度,在纤维掺量为0.20％时,盐石膏的性能较佳;单掺硅酸钠缩短了盐石膏的凝结时间,提高了它的强度,在硅酸钠掺量为3％时,它的抗折强度和抗压强度较高;两者复合可显著改善盐石膏的强度等综合性能.分析表明,玻璃纤维像微钢筋一样穿插于石膏晶体中间,增加了晶体间的搭接;硅酸钠通过在石膏表面形成致密的硅酸钙层,使其硬化体结构变得致密,从而提高了盐石膏的强度.     

复合外加剂改性盐石膏的研究

盐石膏的主要成分为无水硫酸钙,其活性差、凝结硬化慢、强度低,需要添加活性剂来激发盐石膏的活性。通过复合外加剂对盐石膏加以改性,并通过XRD和SEM对其作用机理做了分析。结果表明,单掺脱硫石膏和建筑石膏均能缩短盐石膏的凝结时间,建筑石膏的效果较好,但掺量不宜过高。复掺建筑石膏和缓凝剂时,两者比例要控制得当,适宜的建筑石膏和缓凝剂掺量分别为50%和0.10%~0.12%（质量分数）。分析可知,大掺量建筑石膏会增加盐石膏硬化体中二水相和针棒状晶体的含量;缓凝剂掺量的增加,会降低盐石膏硬化体中二水相的含量,棱形晶体增多,从而降低了盐石膏的强度。     

Corrosion Protection of Aluminum Alloys AMg3 and D16 with Chromate-Free Conversion Coatings in a Tropical Marine Climate

Protection of Metals and Physical Chemistry of Surfaces - Abstract—In this paper, chromate-free conversion coatings on aluminum alloys D16 and AMg3 are studied in a tropical marine climate....     

热冲压工艺参数对22MnB5马氏体钢汽车B柱性能影响的有限元模拟

通过有限元仿真软件Autoform分析了热冲压过程中工艺参数的变化对22MnB5马氏体钢B柱起皱、回弹、减薄、马氏体量以及强度的影响。结果表明:22MnB5马氏体钢B柱热冲压最优化工艺参数为加热温度930 ℃,冷却速率80 ℃/s。该工艺参数下,热冲压过程各处均完成马氏体转变,硬度分布均匀,材料减薄率较低,热冲压成形效果好,尺寸精度高,冲压件强度均大于1400 MPa。     

High-Tg porous polyimide films with low dielectric constant derived from spiro-(adamantane-2,9′(2′,7′-diamino)-fluorene)

Porous polyimide (PI) films with low dielectric constants and excellent thermal properties have been a pressing demand for the next generation of high-performance, miniature, and ultrathin microelectronic devices. A series of novel porous PI films containing fluorenyl-adamantane groups were prepared successfully via thermolysis of poly(ethylene glycol) (PEG) added in the PI matrix. The cross-sectional morphologies of porous PI films showed closed pores with diameters ranging from 135 to 158 nm, which were uniform and regular in shape without interconnectivity. These porous PI films exhibited excellent thermal properties with a glass-transition temperature at 376 °C whereas the 5% weight loss temperature in air excess of 405 °C due to enhanced rigidity afforded by fluorenyl-adamantane groups. Accompanied by thermolysis content of PEG increasing from 0 to 20 wt %, the density of porous PI films decreased, and the corresponding porosity grew significantly from 0 to 11.48%. Depending on porosity, the dielectric constant and dielectric loss of porous PI films significantly declined from 2.89 to 2.37 and from 0.050 to 0.021, respectively. These excellent properties benefit the as-prepared porous PI films for application as interlayer dielectrics, integrated circuit chips, or multichip modules in microelectronic fields. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47313.