Impact of temperature cycle profile on fatigue life of solder joints

In this paper the influence of the temperature cycle time history profile on the fatigue life of ball grid array (BGA) solder joints is studied. Temperature time history in a Pentium processor laptop computer was measured for a three-month period by means of thermocouples placed inside the computer. In addition, Pentium BGA packages were subjected to industry standard temperature cycles and also to in-situ measured temperature cycle profiles. Inelastic strain accumulation in each solder joint during thermal cycling was measured by high sensitivity Moire interferometry technique. Results indicate that fatigue life of the solder joint is not independent of the temperature cycle profile used. Industry standard temperature cycle profile leads to conservative fatigue life observations by underestimating the actual number of cycles to failure.     

An accelerated algorithm for full band electron–phonon scattering rate computation

Computing scattering rates of electrons and phonons stands at the core of studies of electron transport properties. In the high field regime, the interactions between all electron bands with all phonon bands need to be considered. This full band interaction implies a huge computational burden in calculating scattering rates. In this study, a new accelerated algorithm is presented for this task, which speeds up the computation by two orders of magnitude (100 times) and dramatically simplifies the coding. At the same time, it visually demonstrates the physical process of scattering more clearly.     

An investigation on wear behavior of UHMWPE/carbide composites at elevated temperatures

Ultra-high molecular weight polyethylene (UHMWPE) is extensively used in frictional applications due to its advanced wear resistance. This advanced polymer is reinforced with hard particulate fillers for further developments against wear conditions. Since elevated temperatures prevail in the service conditions, wear behavior of UHMWPE composites is an important issue for the engineering applications. In the present work, UHMWPE-based composites including silicon carbide (SiC) fillers were fabricated in a compression molding chamber. In the specimen preparation stage, molding pressure, filler amount, and filler particle size were varied to investigate the influence of these variables. Upon deciding the optimum parameters from the wear tests conducted at room temperature, the wear experiments were repeated for the optimum specimen at elevated temperatures, such as 40 and 60°C. According to the results, the wear behavior of the SiC/UHMWPE composites is heavily changed by the effect of elevated temperature. Adhesive effect is pronounced at elevated temperatures while the wear characteristics possess the abrasive effect in the sliding path. In addition, the composites exhibit an accelerated material loss as temperature increases during the frictional system.     

Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

Many analytical procedures are proposed for thermomechanical analysis of layered structures, mostly based on the perfectly bonded interfacial conditions. However, in the microelectronics industry, there is a strong desire to design packages with flexible interfaces to decrease interfacial stresses and interfacial delamination. In this paper, an analytical model based on flexible interfacial compliances is presented for multilayered microelectronic structures where loading can be a thermal gradient across the layers rather than uniform temperature. Interfacial stresses and the normal stresses in the layers can be calculated very efficiently and quickly compared to time-consuming finite-element analysis and following asymptotic analysis. The influence of interfacial compliance on thermomechanical stresses is investigated for different cases     

Dynamic soil–structure interaction analysis of layered unbounded media via a coupled finite element/boundary element/scaled boundary finite element model

In this paper, a coupled model based on finite element method (FEM), boundary element method (BEM) and scaled boundary FEM (SBFEM) (also referred to as the consistent infinitesimal finite element cell method) for dynamic response of 2D structures resting on layered soil media is presented. The SBFEM proposed by Wolf and Song (Finite‐element Modelling of Unbounded Media. Wiley: England, 1996) and BEM are used for modelling the dynamic response of the unbounded media (far‐field). The standard FEM is used for modelling the finite region (near‐field) and the structure. In SBFEM, which is a semi‐analytical technique, the radiation condition at infinity is satisfied exactly without requiring the fundamental solution. This method, also eliminates the need for the discretization of interfaces between different layers. In both SBFEM and BEM, the spatial dimension is decreased by one. The objective of the development of this coupled model is to combine advantages of above‐mentioned three numerical models to solve various soil–structure interaction (SSI) problems efficiently and effectively. These three methods are coupled (FE–BE–SBFEM) via substructuring method, and a computer programme is developed for the harmonic analyses of SSI systems. The coupled model is established in such a way that, depending upon the problem and far‐field properties, one can choose BEM and/or SBFEM in modelling related far‐field region(s). Thus, BEM and/or SBFEM can be used efficiently in modelling the far‐field. The proposed model is applied to investigate dynamic response of rigid and elastic structures resting on layered soil media. To assess the proposed SSI model, several problems existing in the literature are chosen and analysed. The results of the proposed model agree with the results presented in the literature for the chosen problems. The advantages of the model are demonstrated through these comparisons. Copyright © 2004 John Wiley & Sons, Ltd.     

Effect of replacing disc cutters with chisel tools on performance of a TBM in difficult ground conditions

A summary of a research program covering a period of two years on the performance of a TBM in a very complex and difficult geology is presented in this study. The formations in the study area varied from alluvium, sludge, mudstone, shale and limestone to quartzite with strengths from soft to very hard. The dykes frequently intruded the sedimentary rocks resulting in different degrees of weathering and fracturing in the country rock causing tremendous delays in progress rate of the TBM. The disc cutters started cutting inefficiently in clayey medium strength ground with extreme water income, at where also excessive disc consumptions started due to insufficient friction between the disc cutters and very soft (sludgy) formation, and it was decided to replace all disc cutters with chisel tools (ripper, scraper). Before making this important decision that could affect totally the excavation efficiency and production rate, some theoretical estimations were performed using the Evans’ cutting theory after some modifications based on the previous experimental studies for relieved cutting mode and wear flat, front ridge and vee-bottom angles found in complex shapes of chisel tools to estimate deterministically the torque and thrust requirements of the TBM.Field measurements of the torque and thrust requirements of the TBM equipped with the chisel tools validated the theoretical considerations and the deterministic model used for predicting the performance. Statistical analysis indicated that the model could be used reliably for performance prediction. This study also gave a unique opportunity to compare the performance of disc cutters and chisel tools used on the same TBM at variety of grounds and to analyze the effect of replacing disc cutters with chisel tools on the performance of the TBM. The field measurements indicated that the chisel tools were superior to the disc cutters in especially soft to medium strength rocks.     

Synthesis and Characterization of Ferromagnetic Nickel Nanoparticles

Nickel nanoparticles on mass production scale have been prepared using a modified polyol process with Ni(CH₃COO)₂?4H₂O, NaOH, 1,2 propandiol and hydrazinium hydroxide (N₂H₄?H₂O). A?mixture of face centered cubic (fcc) metallic nickel nanoparticles with 12 nm diameter were obtained. We have experimentally studied the structure of nanoparticle by X-ray and Scanning Electron Microscopy (SEM, EDS). The magnetic properties of the prepared Ni film have been studied by Ferromagnetic Resonance (FMR) technique, Vibrating Sample Magnetometer (VSM) and Vector Network Analyzer (VNA). The effective g-factor and magnetic anisotropy constant were determined as g _eff=2.25 and K _eff=85?Oe, respectively.