Phase-field approach to simulate BCC-B2 phase separation in the AlnCrFe2Ni2 medium-entropy alloy

Journal of Materials Science - Phase separation is a relevant mode of transformation for microstructure development in multicomponent alloys. Its occurrence can drastically alter the composition...     

Comparative evaluation of extraction of tetra- and hexa-valent neptunium ions by CMPO in a room temperature ionic liquid

ABSTRACT

Solvent extraction studies were performed to understand the extraction behavior of Np⁴⁺ and NpO₂ ²⁺ from acidic feeds with CMPO (octyl (phenyl)-N,N-diisobutyl carbamoyl methyl phosphine oxide) dissolved in 1-butyl-3-methylimidazolium bis(trifluoromethane sulfonyl)imide, a water immiscible ionic liquid. Slope analyses on the distribution data revealed the extraction of ML₂ type species, where M = Np⁴⁺ or NpO₂ ²⁺, and L = CMPO. Studies were also carried out with Pu⁴⁺ and UO₂ ²⁺ under identical conditions. The nature of the extracted species was found to vary with the nature of the ionic species.     

Experimental investigation of Co and Fe-Doped CuO nanostructured electrode material for remarkable electrochemical performance

The current research work presents a facile and cost–effective co-precipitation method to prepare doped (Co & Fe) CuO and undoped CuO nanostructures without usage of any type of surfactant or capping agents. The structural analysis reveals monoclinic crystal structure of synthesized pure CuO and doped-CuO nanostructures. The effect of different morphologies on the performance of supercapacitors has been found in CV (cyclic voltammetry) and GCD (galvanic charge discharge) investigations. The specific capacitances have been obtained 156 (±5) Fg^?1, 168(±5) Fg^?1 and 186 (±5) Fg^?1 for CuO, Co-doped CuO and Fe-doped CuO electrodes, respectively at scan rate of 5 mVs^?1, while it is found to be 114 (±5) Fg^?1, 136 (±5) Fg^?1 and 170 (±5) Fg^?1 for CuO, Co–CuO and Fe–CuO, respectively at 0.5 Ag^-1 as calculated from the GCD. The super capacitive performance of the Fe–CuO nanorods is mainly attributed to the synergism that evolves between CuO and Fe metal ion. The Fe-doped CuO with its nanorods like morphology provides superior specific capacitance value and excellent cyclic stability among all studied nanostructured electrodes. Consequently, it motivates to the use of Fe-doped CuO nanostructures as electrode material in the next generation energy storage devices.     

An energy-efficient cloud system with novel dynamic resource allocation methods

The Journal of Supercomputing - In the last decade, cloud computing has brought enormous changes to people’s lives. Cloud computing gives a client-driven computational model. In this case,...     

Escherichia coli,Salmonella spp., and Staphylococcus aureus susceptibility to antimicrobials of human and veterinary importance in poultry sector of India

In India, little attention has been paid on antimicrobial resistance (AMR) in the context of developing “One Health” approach. Hence, utilizing multi-disciplinary approach, we assess the AMR level and dynamics/pattern of multi-drug resistance (MDR) in Escherichia coli, Salmonella spp., and Staphylococcus aureus circulating over the different stages of poultry in India. A total of 342 isolates including E. coli (n = 143), Salmonella spp. (n = 104), and S. aureus (n = 95) were recovered from fecal (n = 80) and cecal (n = 80) samples of chicken, collected across the different poultry-retail shops and poultry-farms located at urban and rural areas of Rajasthan, India, respectively. High rates of AMR to drugs that are critically/highly important both in human and veterinary medicine were observed among all the isolates. Upward trends in AMR prevalence was observed in poultry-retail shops than in poultry-farms. Notably, >90% of all the isolates were MDR, of particular, pattern/prevalence of MDR was substantially varied across the poultry-farms vs. poultry-retail shops. Our results indicate AMR including MDR to be common in E. coli, Salmonella spp., and S. aureus distributed frequently in poultry. The study encourages the formulation of national policy, programmes and further research with a “One Health” approach that can benefits to the human/animal and the environment.     

Evaluation of standard and real fire exposures on thermal response of rail car floor assembly

This work developed a computational methodology to evaluate and compare standard fire exposures such as those outlined in ASTM E119 with real fire exposures and determine the difference in the temperature rise of a rail car floor assembly. The real fire exposures simulated in this work were identified in a review of incidents and consisted of a constantly-fed diesel fuel spill, a localized trash fire, and a gasoline spill simulated from a collision of the railcar with an automobile. These realistic fire exposures were applied to a variety of exemplar rail cars representative of single-level and bi-level passenger cars. These floor assembly models exposed to realistic fires were simulated in Fire Dynamics Simulator (FDS). The thermal exposure at the underside of railcar provided by FDS was coupled with a thermal model in ABAQUS, which provided the evolution of temperature in different components of the floor assembly. The standard scenarios were simulated for 2 hours instead of the typical 30 minutes to identify the appropriate exposure duration in ASTM E119, which can better represent a real fire scenario. The average and maximum temperatures predicted at the unexposed surface for both scenarios were compared with the threshold values given in NFPA 130.     

Atomic layer chemical vapour deposition of copper

Copper films with (1 1 1) texture are of crucial importance in integrated circuit interconnects. We have deposited strongly (1 1 1)-textured thin films of copper by atomic layer deposition (ALD) using [2,2,6,6-tetramethyl-3,5-heptadionato] Cu(II), Cu(thd)₂, as the precursor. The dependence of the microstructure of the films on ALD conditions, such as the number of ALD cycles and the deposition temperature was studied by X-ray diffraction, scanning electron microscopy (SEM), and transmission electron microscopy. Analysis of (1 1 1)-textured films shows the presence of twin planes in the copper grains throughout the films. SEM shows a labyrinthine structure of highly connected, large grains developing as film thickness increases. This leads to low resistivity and suggests high resistance to electromigration.     

The hot blow forming of AZ31 Mg sheet: Formability assessment and application development

The hot blow forming of magnesium sheet offers significant opportunity for forming complex, lightweight parts for automotive applications. This paper characterizes the elevated-temperature formability of AZ31 magnesium sheet materials and the effect of processing conditions on the performance of these materials. In addition, magnesium sheet application development at General Motors Corporation is reviewed.