Surface Modification of Polyimide Film by Dielectric Barrier Discharge at Atmospheric Pressure

In this paper,polyimide(PI)films are modified using an atmospheric pressure plasma generated by a dielectric barrier discharge(DBD)in argon.Surface performance of PI film and its dependence on exposure time from 0 s to 300 s are investigated by dynamic water contact angle(WCA),field emission scanning electron microscopy(FESEM),and Fourier transform infrared spectroscopy in attenuated total multiple reflection mode(FTIR-ATR).The study demonstrates that dynamic WCA exhibits a minimum with 40 s plasma treatment,and evenly distributed nano-dots and shadow concaves appeared for 40 s and 12 s Ar plasma treatment individually.A short period of plasma modification can contribute to the scission of the imide ring and the introduction of C-O and C=O(-COOH)by detailed analysis of FTIR-ATR.