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1.
The mechanical property of age‐hardenable Al‐alloys is governed by the state of ageing, which determines the microstructure and consequently, their corrosion behavior which is a vital aspect for a number of applications. This article presents a comparative assessment of corrosion behavior of under‐, peak‐ and over‐aged Al‐Mg‐Si alloy. Corrosion characteristics have been determined via immersion tests in 0.1 M ortho‐phosphoric acid solution and intergranular corrosion (IGC) tests. Corroded surfaces are examined by field emission scanning electron micrographs‐energy dispersive spectroscopy and 3D optical profilometer. The obtained results reveal that the corrosion rate at a specific immersion time as well as the depth of IGC increases in the order for under‐, peak‐, and over‐aged states. Irrespective of the state of ageing, corrosion loss increases linearly but the rate of corrosion decreases rapidly with increasing immersion time. The dominant mode of corrosion in under‐aged alloy is identified as localized pitting, while peak‐aged is highly susceptible to IGC in contrast extensive pitting corrosion is observed for over‐aged alloy. The observed differences in corrosion behavior are explained considering characteristics of precipitates. Formation of β (Mg2Si) in case of over‐aged alloy and presence of inclusions like AlFeMnSi particles are found to accelerate pitting corrosion.  相似文献   
2.
Expressed sequence tags, abbreviated as ESTs, are DNA molecules experimentally derived from expressed portions of genes. Clustering of ESTs is essential for gene recognition and for understanding important genetic variations such as those resulting in diseases. We present the algorithmic foundations and implementation of PaCE, a parallel software system we developed for large-scale EST clustering. The novel features of our approach include 1) design of space-efficient algorithms to limit the space required to linear in the size of the input data set, 2) a combination of algorithmic techniques to reduce the total work without sacrificing the quality of EST clustering, and 3) use of parallel processing to reduce runtime and facilitate clustering of large data sets. Using a combination of these techniques, we report the clustering of 327,632 rat ESTs in 47 minutes, and 420,694 Triticum aestivum ESTs in 3 hours and 15 minutes, using a 60-processor IBM xSeries cluster. These problems are well beyond the capabilities of state-of-the-art sequential software. We also present thorough experimental evaluation of our software including quality assessment using benchmark Arabidopsis EST data.  相似文献   
3.
Multidimensional binary search tree (abbreviated k-d tree) is a popular data structure for the organization and manipulation of spatial data. The data structure is useful in several applications including graph partitioning, hierarchical applications such as molecular dynamics and n-body simulations, and databases. In this paper, we study efficient parallel construction of k-d trees on coarse-grained distributed memory parallel computers. We consider several algorithms for parallel k-d tree construction and analyze them theoretically and experimentally, with a view towards identifying the algorithms that are practically efficient. We have carried out detailed implementations of all the algorithms discussed on the CM-5 and report on experimental results  相似文献   
4.
An accelerated boundary cloud method (BCM) for boundary‐only analysis of 3D electrostatic problems is presented here. BCM uses scattered points unlike the classical boundary element method (BEM) which uses boundary elements to discretize the surface of the conductors. BCM combines the weighted least‐squares approach for the construction of approximation functions with a boundary integral formulation for the governing equations. A linear base interpolating polynomial that can vary from cloud to cloud is employed. The boundary integrals are computed by using a cell structure and different schemes have been used to evaluate the weakly singular and non‐singular integrals. A singular value decomposition (SVD) based acceleration technique is employed to solve the dense linear system of equations arising in BCM. The performance of BCM is compared with BEM for several 3D examples. Copyright © 2004 John Wiley & Sons, Ltd.  相似文献   
5.
Carbon nanotube–based membranes have gained significant attention due to their transport efficiency and wide range of applications, including molecular sieving and sensing. Recently, in order to attain high transport rates, many studies have focused on reducing membrane thickness. A reduction in membrane thickness results in the dominance of entrance/exit effects over surface effects, particularly for carbon nanotubes (CNTs), due to their hydrophobicity. However, experimentally obtained nanoscale flow rate data span a wide range, and entrance/exit effects are often neglected when analyzing these data. In this study, we modeled the water flow rate through various lengths and radii of CNTs using molecular dynamics simulations while also taking entrance/exit effects into consideration. Based on viscosity and slip length calculations, a water flow model is proposed that covers various lengths and radii of CNTs. Moreover, the enhancement factor of CNT membranes is reassessed using entrance/exit effects. The results of this study can be used for the optimal design of ultraefficient CNT membranes for potential applications such as water filtration.  相似文献   
6.
7.
Molecular dynamics simulations are used to investigate the mechanical properties of a silicon nanofilm covered with graphene. Our results show that graphene can enhance the mechanical properties of a silicon nanofilm. The Young’s modulus of the silicon structure covered with graphene decreases as the thickness of the silicon nanofilm increases. We also investigate the fracture process of the silicon structure covered with graphene. The results in this paper suggest that silicon structures covered with graphene open up opportunities for design of micro and nanoelectromechanical systems.  相似文献   
8.
An efficient black-box algorithm for self-consistent analysis of three-dimensional (3-D) microelectromechanical systems (MEMS) is described. The algorithm is matrix-free based and employs a multilevel Newton technique to solve the coupled electromechanical equations. The new approach is shown to converge very rapidly and is much faster than relaxation algorithm for tightly coupled cases. While this paper focuses on coupled electromechanical analysis, the proposed algorithm can be extended to include several coupled domains typically encountered in MEMS  相似文献   
9.
We present faster sequential and parallel algorithms for computing the solvent accessible surface area (ASA) of protein molecules. The ASA is computed by finding the exposed surface areas of the spheres obtained by increasing the van der Waals radii of the atoms with the van der Waals radius of the solvent. Using domain specific knowledge, we show that the number of sphere intersections is only O(n), where n is the number of atoms in the protein molecule. For computing sphere intersections, we present hash-based algorithms that run in O(n) expected sequential time and O(n/p) expected parallel time and sort-based algorithms that run in worst-case O(n log n) sequential time and O(n log n/p) parallel time. These are significant improvements over previously known algorithms which take O(n2) time sequentially and O(n2/p) time in parallel. We present a Monte Carlo algorithm for computing the solvent accessible surface area. The basic idea is to generate points uniformly at random on the surface of spheres obtained by increasing the van der Waals radii of the atoms with the van der Waals radius of the solvent molecule and to test the points for accessibility. We also provide error bounds as a function of the sample size. Experimental verification of the algorithms is carried out using an IBM SP-2  相似文献   
10.
A numerical study is undertaken to investigate solder joint failure under fast loading conditions. The finite element model assumes a lap-shear testing configuration, where the solder joint is bonded to two copper substrates. A progressive ductile damage model is incorporated into the rate-dependent elastic-viscoplastic response of the tin (Sn)–silver (Ag)–copper (Cu) solder alloy, resulting in the capability of simulating damage evolution leading to eventual failure through crack formation. Attention is devoted to deformation under relative high strain rates (1–100 s−1), mimicking those frequently encountered in drop and impact loading of the solder points. The effects of applied strain rate and loading mode on the overall ductility and failure pattern are specifically investigated. It is found that, under shear loading, the solder joint can actually become more ductile as the applied strain rate increases, which is due to the alteration of the crack path. Failure of the solder is very sensitive to the deformation mode, with a superimposed tension or compression on shear easily changing the crack path and tending to reduce the solder joint ductility.  相似文献   
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