Using I2P (Invisible Internet Protocol) Encrypted Virtual Tunnels for a Secure and Anonymous Communication in VANets: I2P Vehicular Protocol (IVP)

Wireless Personal Communications - The Invisible Internet Project (I2P) as a secure protocol uses robust mechanisms and strong algorithms to reinforce the security and the anonymity of the...     

Known good die meets chip size package

The increasing density, functionality, and high speed performance of integrated circuit components are fueling demands for smaller and faster portable electronic systems. Designers are becoming more experienced at cutting size, delays, and costs wherever possible. One area that offers attractive benefits for reducing size and improving performance is in the IC package itself, either eliminating it altogether, or reducing the size to the point where it takes up very little more space than the IC. In that context, chip size packages (CSPs) offer a viable solution to the problem. The electrical performance of a circuit is degraded by any capacitance, inductance, and lead length added to the IC bond pads. In addition to the performance limitations of the IC package itself, the larger footprint of the package implies that the next level of interconnect will also be sub optimal due to size and fanout of the IC interconnections. CSPs address these problems, too     

Known Good Die

Advances in reducing size and increasing functionality of electronics have been due primarily to the shrinking geometries and increasing performance of integrated circuit technologies. Recently, development efforts aimed at reducing size and increasingfunctionality have focused on the first level of the electronicpackage. The result has been the development of multichip packaging,technologies in which bare IC chips are mounted on a single high density substrate that serves to package thechips, as well as interconnect them. A number of benefits accruebecause of multichip packaging, namely, increased chip density,space savings, higher performance, and less weight. Therefore, thesetechnologies are attractive for today's light weight, portable, highperformance electronic equipment and devices.In spite of these benefits, multichip packaging has not shown the kind of explosive growth and expansion that was predicted[1]. A major inhibitor for these technologies has been theavailability of fully tested and conditioned bare die, orknown good die. This paper reviews the issues and technologies associated with test and burn-in of bareor minimally packaged IC products.     

Book reviews

Nationality and Planning in Scotland and Wales. R. Macdonald & H. Thomas (Eds). Cardiff, University of Wales Press, 1997, 312 pp., hb £35.00, ISBN 0–7083–1398–1.

Urban Land and Property Markets in Sweden. Thomas Kalbro & Hans Mattsson. London, UCL Press, 1995, 208 pp., £48.00 hb, ISBN 1–85728–052–0.

Contested Countryside Cultures: Otherness, Marginalisation and Rurality. P. Cloke & J. Little (Eds). London, Routledge, 1997, 304 pp., £15.99 hb, ISBN 0–415–14075–7.     

Reviews

VISUAL SIMULATION: A Users Guide for Architects, Engineers and Planners, Stephen R. J. Sheppard, Van Nostrand Reinhold, New York/Chapman Hall, London, 1989, 215pp, ISBN 0-442-27827-6, £30.00.

MAPS OF MEANING: An introduction to Cultural Geography, Peter Jackson, London, Unwin Hyman, 1989, ISBN 0-04-445366-3, 213pp., £30.00 HB, £8.95 PB.

THE POWER OF PLACE: BRINGING TOGETHER GEOGRAPHICAL AND SOCIOLOGICAL IMAGINATIONS,John A. Agnew and James S. Duncan (Eds), Boston: Unwin Hyman, 1989, 231pp., ISBN 0-04-445281. $28.00 HB.

DESIGN FOR MOUNTAIN COMMUNITIES: A LANDSCAPE AND ARCHITECTURAL GUIDE by Sherry Dorward, London: Chapman and Hall, 1989, £31.50. 0-442-22095-2.     

Architecture for modeling and simulation of technical systems along their lifecycle

Modeling and simulation is an established scientific and industrial method to support engineers in their work in all lifecycle phases—from first concepts or tender to operation and service—of a technical system. Due to the fact of increasing complexity of such systems, e.g. plants, cyber-physical systems and infrastructures, system simulation is rapidly gaining impact. In this paper, a simulation architecture is presented and discussed on three different industrial applications, which offers a client–server concept to master the challenges of a lifecycle spanning simulation framework. Looking ahead, open software concepts for modeling, simulation and optimization will be required to cover new co-simulation techniques and to realize distributed, for example web-based simulation environments and tools.     

Pelvic fracture with shock-inducing retroperitoneal bleeding and concomitant lower extremity ischemia syndrome: discussion of management exemplified by a case report

BACKGROUND: Initial treatment of severe pelvic fracture consists of appropriate resuscitation and early pelvic reposition and stabilization. Concomitant retroperitoneal arterial bleeding in a hemodynamically unstable patient in combination with lower extremity ischemia make early management decisions very difficult and the mortality rate of this entity of injuries is extremely high. CASE REPORT: We report on a successful treatment of a 36 year old skier, referred in hemorrhagic shock, who had sustained a severely displaced both column fracture of the right acetabulum, an unstable pelvic ring injury on the left and a retroperitoneal bladder rupture. He developed complete ischemia of the right lower extremity. Angiography revealed an obliteration without extravasation of the external iliac artery and allowed treatment of a right superior gluteal artery disruption by embolization. The right lower extremity ischemia was revascularized with a subcutaneous femoro-femoral bypass graft. Delayed internal fixation of the right acetabulum and exploration of the iliac vasculature was done through an ilio-inguinal approach. Simultaneously, the cross-over bypass could be removed. After 18 months, the patient recovered without any ischemic symptoms, but continues with a mixed sciatic nerve lesion. DISCUSSION AND CONCLUSIONS: The combination of severe retroperitoneal arterial bleeding and total ischemia of the lower extremity requires immediate surgical therapy. Direct exploration of the retroperitoneum, however, can be fatal and should be avoided if the iliac vessels are angiographically intact or if a hemorrhage is controllable by an embolization procedure. Extraanatomic temporary revascularization of the lower extremity should be envisaged when a lower leg ischemia due to obliteration or compression of major intrapelvic vessels cannot be directly and immediately treated.     

Timing recovery in high bit-rate transmission systems over copperpairs

This letter proposes a timing recovery scheme for transmission systems with baud-rate sampling allowing the use of an all digital phase-locked loop. The impact of the numerically controlled oscillator on the attainable signal-to-noise ratio and jitter under conditions of the European Telecommunications Standardization Institute (ETSI) HDSL standard is discussed     

Reviews

Right Before Your Eyes: Penetrating The Urban Environment, by Grady Clay, Chicago: Planners Press, 1987 (American Planning Association, 1313 E 60th Street, Chicago, II. 60637 hb $45.95 pb $24.95 241 pp

Signs of Hope: Working Towards Our Common Future by Linda Starke (1990) Oxford/Oxford University Press; Out of Place: Restoring Identity to the Regional Landscape by Michael Hough (1990) New Haven and London/Yale University Press.

Transatlantic Manners: Social patterns in nineteenth-century Anglo-American travel literature, by Christopher Mulvey, Cambridge: Cambridge University Press, 1990. pp. xii + 244. £27.50 hb. ISBN 0 521 30366 4

Mountain Environments: An examination of the physical geography of mountains, by A.J. Gerrard, London: Belhaven Press, 1990. £30.00 hb.

Roads in Upland Areas — A Design Guide by the Highways Directorate, Welsh Office