Thiol-Functionalized Covalent Organic Frameworks as Thermal History Indictor for Temperature and Time History Monitoring

Various products, including foods and pharmaceuticals, are sensitive to temperature fluctuations. Thus, temperature monitoring during production, transportation, and storage is critical. Facile indicators are required to monitor temperature conditions via color changes in real time. This study aimed to prepare and apply thiol-functionalized covalent organic frameworks (COFs) as a novel indicator for monitoring thermal history and temperature abuse. The COFs underwent obvious color changes from bright yellow to purple after exposure to different temperatures for varying durations. The reaction kinetics are analyzed under isothermal conditions, which reveal that the order of reaction rates is k_−20°C < k_4°C < k_20°C < k_35°C < k_55°C. The activation energy (E_a) of the COFs is calculated using the Arrhenius equation as 50.71 kJ moL⁻¹. The COFs are capable of sensitive color changes and offer a broad temperature tracking range, thereby demonstrating their application potential for the monitoring of temperature and time exposure history during production, transportation, and storage. This excellent performance thermal history indicator also shows promise for expanding the application field of COFs.     

Interfacial microstructure and mechanical properties of Ti3SiC2 ceramic and TC11 alloy joint diffusion bonded with a Cu interlayer

Reliable joints of Ti₃SiC₂ ceramic and TC11 alloy were diffusion bonded with a 50 μm thick Cu interlayer. The typical interfacial structure of the diffusion boned joint, which was dependent on the interdiffusion and chemical reactions between Al, Si and Ti atoms from the base materials and Cu interlayer, was TC11/α-Ti + β-Ti + Ti₂Cu + TiCu/Ti₅Si₄ + TiSiCu/Cu(s, s)/Ti₃SiC₂. The influence of bonding temperature and time on the interfacial structure and mechanical properties of Ti₃SiC₂/Cu/TC11 joint was analyzed. With the increase of bonding temperature and time, the joint shear strength was gradually increased due to enhanced atomic diffusion. However, the thickness of Ti₅Si₄ and TiSiCu layers with high microhardness increased for a long holding time, resulting in the reduction of bonding strength. The maximum shear strength of 251 ± 6 MPa was obtained for the joint diffusion bonded at 850 °C for 60 min, and fracture primarily occurred at the diffusion layer adjacent to the Ti₃SiC₂ substrate. This work provided an economical and convenient solution for broadening the engineering application of Ti₃SiC₂ ceramic.     

Research on optimization design of PWR flow distribution device based on numerical simulation

ABSTRACT

In the lower chamber of pressurized water reactor (PWR), the flow distribution device is the core module to distribute coolant into the core. It has complex structure and numerous design parameters. Therefore, it has important theoretical and practical significance to optimize the device. The mesh independence verification, turbulence model selection, and data processing all can influence the numerical simulation results of the lower chamber, in order to research the influence, a numerical simulation method based on the original model of CNP1000 reactor lower chamber is proposed in this paper. In the method, an optimization design method of flow distribution device is established based on surrogate model. The main design variables and optimization objectives are determined based on the device’s structure and function characteristics. And then it respectively adopts Kriging algorithm and multi-objective genetic algorithm to establish a surrogate model of flow distribution device and optimize it globally. Finally, the optimal design variables are obtained. Compared with the device’s performance before optimization, the after optimization has smaller total pressure loss and more uniform flow. The effectiveness and practicability of proposed optimization design method can be verified.     

A review on ultrasonic spot welding of copper alloys

As a solid state joining process, ultrasonic spot welding has been proven to be a promising technique for joining copper alloys. However, challenges still remain in employing ultrasonic spot welding to join copper alloys. This article comprehensively reviews the current state of ultrasonic spot welding of copper alloys with a number of critical issues including materials flow, plastic deformation, temperature distribution, vibration, relative motion, vertical displacement, interface friction coefficient, online monitoring technique, coupled with the macrostructure and microstructure, the mechanical properties and electrical conductivity. In addition, the future trends in this field are provided.