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Interface structure and mechanical property of the brazed joint of graphite and copper 总被引:1,自引:1,他引:0
A kind of self-made AgCuTiSn braze alloy powder was used to join graphite and copper. The whole brazing process was performed under vacuum circumstances at different temperatures (1033-1193 K) for several holding time (300-1800 s). According to scanning electron microscope (SEM), energy dispersive spectrometer (EDS) and electron probe X-ray microanalysis (EPMA) results, the reaction products of the interface are TiC, Ti3Sn, Cu(s. s), Ag(s. s) and Cu-Sn compound. As the brazing parameters increase, the quantity of Ag(s. s) in the braze alloy and C fibers on graphite/AgCuTiSn interface reduce, while that of Cu (s. s) in the braze alloy improves. When the brazing temperature is 1093 K and holding time is 900 s, the joint can obtain the maximum room temperature shear strength 24 MPa. 相似文献
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Oxygen-free copper and pre-metalized graphite were brazed using CuNiSnP braze alloy by high frequency induction heating method.
Interfacial microstructures and reaction phases were analyzed by scanning electron microscopy (SEM) and energy dispersive
X-ray spectroscopy (EDS). The strength and resistance of the joints were tested. It is found that when the brazing parameters
are optimized, the structures of the joints are graphite/(Cu,Ni)/Ni(s.s)+Ni
x
P
y
/Cu3P+Cu(s.s) (including Sn)+eutectic structures (Cu3P+Ni3P+Cu(s.s)/Cu (s.s)/Cu). When the temperature increases to 750 °C or the holding time prolongs to 300 s, the eutectic structures
disappear and the amount of Cu3P increases. The maximum shear strength of the joints is 5.2 MPa, which fracture at the interface of graphite and metallization.
The resistance of the joints is no more than 5 mΩ. 相似文献
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对石墨与铜采用非晶态TiZrNiCu钎料进行了真空钎焊.采用光学显微镜(OM OLMPUS)、扫描电镜(SEM,S-4700)、电子探针(EPMA,JXA8600)等分析手段对接头的界面微观组织进行观察分析,研究结果表明,钎缝中主要是金属间化合物生成相,如Cu-Ti,Cu-Zr,Ni-Ti系等,裂纹易产生于焊缝中尺寸较大的一个金属间化合物相上,Cu基固溶体的存在可以阻碍或延缓裂纹的扩展,对提高接头性能有利.在该实验条件下在950℃/15min工艺参数下获得的接头的电阻率低于5 mΩ,平均电阻为3.3mΩ,接头的抗剪强度为16.34MPa满足该接头作为换向器接头的使用要求. 相似文献
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