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电子器件的小型化发展使得焊点尺寸变小,导致焊点中界面化合物的比例增加,甚至整个焊点转变为全化合物焊点。文中通过改变液态回流时间、温度,研究了厚度为50μm的焊点的组织、拉伸载荷下的形变与断裂。结果发现,随着液态回流时间的延长、回流温度的升高,化合物焊点由焊料/IMC结构转变为全IMC结构;焊点强度降低;断裂形貌由脆性主导的混合断口转变为化合物脆性断口。 相似文献
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以邯钢某高炉扩容工程的岩土工程勘察为例,结合高炉扩容工程的特点,对与扩容设计有关的岩土工程问题进行了分析、探讨。 相似文献
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The microstructure and tensile properties of Sn-9Zn solder under different cooling and aging condition were studied.During solidification, the distribution of Zn-rich phases and grain size in the microstructure of Sn-9Zn solder were decided by the cooling rate.The Zn-rich phase in Sn-9Zn solder under furnace cooling, air cooling and water cooling media was separately existed as coarsen dendritic and needle like shape, fine needle like shape and very fine rod-like shape, respectively.After aging, the coarsen dendritic was broken and the coarsen needle like Zn-rich phase was partly changed into fine distribution of Zn-rich phase for Sn-9Zn solder with furnace cooling, and the rod-like Zn phase in the Sn-9Zn solder under water cooling was changed to conglomerated Zn with needle shape.During tensile testing on Sn-9Zn solder, tensile strength and ductility reached the best with water cooling, but decreased with aging effect.Meanwhile, the ductility of solder with air cooling and the strength of solder with furnace cooling increased with aging.The fracture mode was ductile and was independent of cooling media and aging effect.The size and depth of dimples decreased from water, furnace to air cooling.After aging, number and size of dimples increased on the solder with furnace cooling and air cooling.The change on the size of dimples for the Sn-9Zn solder under different cooling condition and with aging effect was accordance to the tensile properties. 相似文献
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Cu基钎料电弧钎焊接头强度及断口分析 总被引:2,自引:0,他引:2
研究用钨极氩弧焊作为热源,用Cu3Si1Mn钎料、56Cu8Mn26Zn钎料分别钎焊A3钢板及1Cr18Ni9Ti不锈钢板。试验结果表明,在钎料/母材界面分别存在Si、Mn富集带,经XRD分析表明,Si是以Fe2Si相形式存在,而Mn是以固溶体形式存在;用Cu3Si1Mn、56Cu8Mn26Zn钎料钎焊A3钢板接头抗拉强度试样均断在母材,抗拉强度为308.2~308.7MPa,钎焊1Cr18Ni9Ti不锈钢板,拉伸均断在钎缝,其抗拉强度分别是331.5 MPa、382.9 MPa;拉伸断口分析发现,断裂起裂点在搭接钎缝的根部,主要是母材成分与少量的钎料成分混合、溶解而成,是脆性断口;止裂点在钎缝金属中(Cu3Si1Mn钎料)或在近界面上(Cu3Si1Mn钎料),是塑性断口。 相似文献
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本研究选用Cu70 Ti2 5 Zr5 活性钎料钎焊Al2 O3/Nb .通过对Al2 O3/Cu70 Ti2 5 Zr5 /Nb界面结构及接头性能研究 ,旨在进一步揭示Al2 O3/含Ti活性钎料间界面反应机制 ,并为指导工程应用提供最佳工艺参数 .借助扫描电镜、能谱、X射线衍射探讨了Al2 O3/Cu70 Ti2 5 Zr5 /Nb钎焊接头界面结构 ,并采用拉剪试验评价了接头强度 .研究结果表明 ,时间 0 .6ks ,温度小于 12 2 3K ,界面产生了 3种新相 :Cu2 Ti4O ,Ti0 .5 Zr0 .5 O0 .1 9,CuTi,界面结构为Al2 O3/Cu2 Ti4O +Ti0 .5 Zr0 .5 O0 .1 9/CuTi/Cu固溶体 +CuTi;温度大于 12 93K ,界面产生了Cu2 Ti4O ,Ti,CuTi 3种新相 ,界面结构为Al2 O3/Cu2 Ti4O/Ti固溶体 /CuTi/Cu固溶体 +CuTi.在 12 93K ,0 .6ks条件下 ,接头剪切强度最高达到 162MPa ,温度大于或小于12 93K ,强度下降 相似文献