Microstructures and properties of welded joint of TiNi shape memory alloy and stainless steel

The fracture characteristics of the joint were analyzed by means of scanning electron microscope(SEM).Microstructures of the joint were examined by means of optical microscope, SEM and an image analyzer. The results show that the tensile strength of the inhomogeneous joint of TiNi shape memory alloy and stainless steel is lower than that of the homogeneous joint and a plastic field appears in the heat affected zone on the side of TiNi shape memory alloy. Because TiNi shape memory alloy and stainless steel melted, a brittle as-cast structure was formed in the weld. The tensile strength and the shape memory effect of the inhomogeneous joint are strongly influenced by the changes of composition and structure of the joint. Measures should be taken to reduce the base metal melting and prevent the weld metal from the invasion by O for improving the properties of the TiNi shape memory alloy and stainless steel inhomogeneous joint.     

钛表面处理对增强钛/瓷结合强度的影响

为了提高钛/瓷结合强度,通过不同方法对钛表面进行处理,研究了钛表面处理后钛/瓷界面组织及结合强度。试验结果表明,烤瓷前进行钛表面喷砂处理,对增强钛/瓷结合强度的影响并不显著,但对抑制钛/瓷界面裂纹的扩展起到积极作用;钛表面预氧化处理能够在钛表面形成一层均匀的氧化膜,使参与界面反应的TiO2增多,反应层增厚,但预氧化温度对钛/瓷结合强度有重要影响;钛表面磁控溅射Zr中间层能够抑制钛表面生成过厚氧化层,而中间层厚度对钛/瓷结合强度也有较大影响。     

非连续增强铝基复合材料连接新工艺

介绍几种非连续增强铝基复合材料连接的新工艺，从不同途径改善了接头显微结构和提高接头力学性能，但仍存在一定问题，其目的旨在更多的工作者参与工艺完善和开发研究，加速先进材料焊(连)接技术革新，促进新材料应用．     

Zn基钎料钎焊烧结NdFeB与DP1180钢接头微观组织及性能

采用Zn-5Sn-2Cu-1.5Bi(ZSCB)钎料实现了烧结NdFeB永磁材料(NdFeB)与DP1180钢的钎焊连接。在惰性气氛控制的高频感应炉中进行钎焊,采用OM、SEM、EDS、微区XRD和NIM-2000H磁性测试仪等手段分析了接头界面的微观组织结构、NdFeB的磁性能和接头剪切强度。结果表明,NdFeB与ZSCB钎料形成Nd-Fe-Zn和Fe-Zn冶金结合,FeZn13和Fe3Zn10相在DP1180钢侧的界面处形成。焊接温度对NdFeB的磁性能影响较小。与传统方法的粘接相比,接头的剪切强度从32.50MPa提高到44.00MPa,提高了35.38%。由于NdFeB和ZSCB钎料之间的热膨胀系数差异很大,在接近NdFeB的反应层处产生较高的残余应力,导致接头从NdFeB界面处断裂。     

湿度对铝合金接头裂纹敏感性的影响规律及机理

采用能谱、扫描电镜和X射线衍射等测试方法,研究了湿度对铝合金接头裂纹敏感性的影响规律及机理. 结果表明,在40% ~ 80%相对湿度的条件下,改良的铝合金鱼骨试件接头表面可见结晶裂纹和液化裂纹;随着湿度的增大,接头裂纹敏感性逐渐提高,其中结晶裂纹的敏感性逐渐降低,液化裂纹的敏感性逐渐提高;湿度增大,铝合金焊缝晶粒逐渐细化,裂纹扩展阻力升高,焊缝组织细化导致结晶裂纹敏感性降低;同时提高湿度,电弧温度降低,焊接热输入量减少,液态金属越发不易在晶界处形成连续的网状薄膜结构,也导致结晶裂纹敏感性降低.     

用纯金属Ni作中间层扩散连接铝基复合材料

采用纯金属Ni作中间层扩散连接氧化铝颗粒增强铝基复合材料(Al2O3P/6061Al),探究了连接温度和保温时间对接头显微结构与力学性能的影响.结果表明,连接温度610～620℃时,连接区主要由Al3Ni和Ni在Al中固溶体组成,Al3Ni含量随连接温度升高、保温时间延长而减少;连接温度630℃时,连接区主要由Al2O3颗粒和Ni在Al中固溶体组成,Al2O3颗粒偏聚于接头中心.连接温度620℃、保温时间5～120min条件下,接头抗剪强度68～93MPa,断裂于连接区与母材界面;连接温度630℃、保温时间5～120min条件下,接头抗剪强度93～97MPa,断裂于增强相偏聚区.     

真空钎焊中晕环现象的研究

通过试验研究发现,晕环是由于Cu,Ag,Sn,Mn和Au等几种元素导先钎料整体沿晶界或毛细磨痕润湿母材的结果,从而提高钎料的润湿性。液态钎料与母材的性能以及在钎焊温度下相互作用情况是影响晕环形成的主要因素。     

Ag基钎料钎焊立方氮化硼的焊接性与微观结构

在不同真空钎焊温度和保温时间条件下,研究了Ag基活性钎料钎焊立方氮化硼的焊接性与微观结构。试验结果表明:钎料中Ti的质量分数为12%、钎焊温度为950℃、保温时间为20 min时可实现Ag-Cu-Ti活性钎料与立方氮化硼的牢固连接。Ag-Cu-Ti活性钎料对c-BN的润湿性较好,界面结合紧密,并在界面处形成反应层。微观分析表明:钎焊过程中Ag-Cu-Ti合金钎料中的Ti向c-BN磨粒表面富集,并与c-BN磨粒表面N和B元素发生反应,形成TiN和TiB2,实现了Ag-Cu-Ti活性钎料与立方氮化硼磨粒的化学冶金结合。     

Effects of Bi and rare earth metal on the microstructure and properties of Zn-based high-temperature solder

A novel Zn-based high-temperature solder was developed to join copper/steel at moderate temperature. The effects of Bi and rare earth metal on the microstructures, wettability of solders as well as the mechanical properties of solder joints were investigated. The results indicated that with the addition of Bi into Zn-Cu-Sn (ZCS) alloy, significant improvement in wettability is realized. When the content of Bi element is 1.5 wt. % in the solder, the spreading area researched over 200 mm². Further more, with the addition of RE, refined primary ε-CuZn₅ phases were formed and the shear strength of the solder joint was largely improved.