This study focused on the incompatible behaviors of cleaning materials used in the wet bench stage. These results can be applied to determine the causes of fires in the wet bench stage from using reactive chemicals for cleaning purposes.
Another purpose of this study was to investigate the potential hazards of widely used chemicals (hydrogen peroxide, concentrated sulfuric acid, hydrochloric acid and isopropyl alcohol) within similar processes in semiconductor plants. Experimental data were also verified in order to establish a concentration triangular diagram, which could be used to identify a combustion, deflagration or even detonation zone. Finally, this study can provide basic design data for an inherently safer process to avoid potential hazards caused by dangerous mixtures, which may result in large property loss in semiconductor plants. 相似文献