21世纪通信网络及其支撑技术

阐述了支撑通信网络的几种关键技术，并通过对这些技术的介绍，说明未来的通信网络是一个国际标准化的、综合化的、宽带化的多媒体数据通信网。     

300脚MSA 10 Gbit/s Transponder模块

分析了开发10Gbit/sTransponder模块的必然性，介绍了10Gbit/sTransponder模块的原理、特点和参数指标。并且用开发出的两只40km300脚10Gbit/sTransponder模块成功地进行了43km的无误码传输试验和测试。     

RS码频域纠错编码在激光对潜通信信道中的实现方法

介绍了信道编码在激光对潜通信系统中的重要作用，介绍了频域编译ＲＳ码的基本方法，并给出了脉冲位置调制信道的ＲＳ码频域编译码的计算机模拟方法和结果。     

The INTELSAT VII/VIIA generation of global communications satellites

Developed primarily to provide continuation of services from the INTELSAT V satellites in the Pacific Ocean Region, this latest generation of satellites also has utility for operation in other roles. Several new technologies are combined to give cost-effective international satellite communications on a global, regional and domestic basis. This new higher power satellite will form a fundamental part of the INTELSAT global network, having been designed to match the projected traffic demands and future service requirements.     

高性能IGBT模块的设计考虑

本文对ＩＧＢＴ模块中功率芯片（ＩＧＢＴ和续流二极管）的优化设计进行了讨论。通过优化几个重要的工艺参数并改进器件的结构，ＩＧＢＴ不仅有足够的短路容量，而且正向压降与电流下降时间之间可实现最佳折衷。另外，续流二极管的反向恢复特性也有明显改善。通过采用衬底控制技术，ＩＧＢＴ模块的输出特性不受温度的影响，输出电流更稳，输出阻抗更高。本文详细介绍了整个设计考虑。     

模拟电路的模块级故障诊断

本文以多端口元件或子网络为基本单元，提出了一种模块级故障诊断方案，这种方案的故障模型更符合电路的实际情况，因而具有更广泛的实际意义，文中首先推导了模块故障诊断议程，并对模块故障可测性问题进行了一般性讨论。然后，给出了模块故障可测的几个拓扑条件，并通过定义广义独立通路使这些拓扑条件适用于一般的非互易网络。     

4×622Mb／sWDM40km光通信系统实验

本文完成了我国第一个４×６２２Ｍｂ／ｓ波分复用（ＷＤＭ）光通信系统实验，使单根光纤线路通信容量达２．４Ｇｂ／ｓ。该系统以ＤＦＢ－ＬＤ为光源，工作波长在１．５５μｍ附近，ＬＤ的工作频率稳定度优于±１５０ＭＨｚ，信道间隔２ｎｍ左右，无中继传输距离为４３．６ｋｍ，采用Ｆ－Ｐ调谐光滤波器作为解复用器，接收机灵敏度达－３０ｄＢｍ。     

膜萃取器设计及应用研究进展

简要阐述了膜萃取的特点和基本类型;重点介绍了轴对称、纤维、片状等３种膜器的设计原理、特征以及膜过程设计．总结了膜萃取技术在金属离子分离、旋光化合物的分离、发酵萃取、医药萃取等方面的应用现状和最新进展;展望了膜萃取技术的发展趋势。     

IC卡在电信领域的应用模式

本文列举了ＩＣ卡在电信领域及一些国家和地区的应用之后，给出了国际ＩＣ卡的应用发展模式，以供有关部门参考。     

Modeling Temperature in Coupled Electrical and Thermal Simulations of the Electroconsolidation® Process

Electroconsolidation® is a process for densifying complex-shaped parts by using electrically conductive particulate solids as a pressure-transmitting medium. The part is immersed in a bed of the particulate medium contained in a die chamber. Sintering temperature is achieved by resistive heating of the medium while applying compaction pressure. The process is capable of ultrahigh temperatures and short cycle times and offers the potential for low processing costs.

Control of the process and selection of process conditions require knowledge of the temperatures within the die. Temperature gradients exist because of the high heating rate and because of variations of density and electrical resistivity of the medium due to the presence of the part. Direct measurement of temperature with thermocouples or other conventional means is impractical because of the high temperatures, high currents, and high pressures that are involved. Therefore, a computer model was developed to predict temperature as a function of time and applied voltage for any location in the die. The computer model is composed of three parts: a geometrical model to approximate the density and resistivity variations in the medium, a finite-element model to calculate the rate of resistive heating within each element, and a finite-difference model to calculate the temperature distribution based on solution of the heat-transfer equations. Predicted temperatures have been shown to be in excellent agreement with measurements, and numerical simulation provided encouraging consistency and reasonably accurate predictions of temperature profiles within the die. The model demonstrated the feasibility of a new process to achieve simultaneous application of pressure and heat to powder densification in Electroconsolidation.