Investigation of formaldehyde-free wood adhesives from kraft lignin and a polyaminoamide–epichlorohydrin resin

A formaldehyde-free wood adhesive system consisting of kraft lignin and a polyaminoamide-epichlorohydrin (PAE) resin (a paper wet strength agent) has been investigated in detail. The lignin-PAE adhesives were prepared by mixing an alkaline kraft lignin solution and a PAE solution. Mixing times longer than 20 min had little impact on the shear strength of the wood composites bonded with the lignin-PAE adhesives. The shear strength of the wood composites bonded with the lignin-PAE adhesives increased and then flattened out when the press time and the press temperature increased. The shear strength and water resistance of the wood composites bonded with the lignin-PAE adhesives depended strongly on the lignin/PAE weight ratio. Of the weight ratios studied, the 3:1 lignin/PAE weight ratio resulted in the highest shear strength and the highest water resistance of the resulting wood composites. The wood composites bonded with the lignin-PAE adhesives did not delaminate and retained very high strengths even after they underwent a boiling-water test. The lignin-PAE adhesives could be stored at room temperature for two days without losing their adhesion ability. PAE was the crosslinking agent in this lignin-PAE adhesive. Possible reactions between lignin and PAE are discussed in detail.     

Modification of epoxy resins for improvement of adhesion: a critical review

Modification of epoxy resins for improvement of adhesion has been the subject of intense research throughout the world. Unlike for thermoplastics, physical blending is not successful for improvement of bond strength and impact strength of epoxy resins. The bond strength of an epoxy resin can be improved only by chemical modification with a suitable flexible modifier. Such chemical modification may either plasticize the epoxy matrix or lead to a two-phase microstructure. Both methods of chemical modifications are discussed critically in the present review.     

Strength and finite element analyses of single-lap joints with adhesively-bonded columns

This paper introduces a novel approach to increase the loading ability of adhesive joints by incorporating adhesively-bonded columns. Strengths of single-lap adhesive joints with adhesively-bonded columns were measured experimentally. Stress and strain distributions at selective positions in the adhesive layer were analyzed using the Finite Element Method (FEM). Failure mechanisms of the joints were analyzed. It was found that the metal-adhesive columns increased the joint strength and also the joint strength increased with increasing length of the metal-adhesive columns. Therefore, using metal-adhesive columns in adhesive joints is an effective approach for enhancing the strength of bulk adhesive joints.     

Effects of different metals on adhesive wear behaviour of alloy surface produced by TIG process

Abstract

Low carbon steel surfaces were alloyed with composite powders using the tungsten inert gas welding method. After the alloying process, the effects of cladding surface on the microstructural characteristics and adhesive wear of the alloyed samples were examined. The sliding wear behavior of samples was investigated in a block on ring apparatus under the loads of 20, 40, 60 and 80 N respectively. In the experimental investigation, a low carbon steel surface was alloyed with austenitic stainless steel powder and austenitic stainless steel powder mixed with 4·5% Co, Mo and Ti particles respectively. Following surface alloying, conventional characterisation techniques, such as optical microscopy, scanning electron microscopy, energy dispersive spectrograph and X-ray diffraction, were used to study the microstructure of the alloyed zone. Examination of the microstructure revealed the presence of M₂₃C₆ carbides, solid melt phases and intermetallic phases, such as Ni₃Ti, depending on the alloying element in the composite. As the amount of the reinforcing material increased, the saturation rates for the samples decreased, while their hardness increased. The adhesive abrasion tests conducted revealed that temperature input plays a significant role on the microstructure characteristics, which positively affected the adhesive abrasion values of the samples. Consequently, the tungsten inert gas welding method was successfully used for the surface alloying of low carbon steels.     

Durability of metal joints bonded with aluminium powder filled epoxy adhesive

Abstract

Durability of the metal joints bonded with aluminium powder filled epoxy adhesive was investigated by measuring the joint strength by the single lap shear test before and after exposure to distilled water and the hot and humid Arabian Gulf atmosphere. Fractured specimens were examined by photography. The epoxy adhesive retained its strength with as much as 50 wt-% addition of aluminium filler. Moreover, varying the Al filler content in the adhesive did not have a significant effect on adhesive behaviour in either of the two environments studied. Exposure to atmosphere for as long as 6 months did not cause a deterioration of strength for metal joints bonded with aluminium powder filled epoxy. They failed almost completely within the adhesive, similar to the cohesive mode of unexposed specimens. However, a significant strength decrease was observed in adhesive joints after exposure to distilled water for 6 months. The joints failed in more than a single mode. The interior part of the adhesive lap area failed in cohesive mode while an adhesion failure mode was observed near the edges of the adhesive lap area, which is believed to be a result of moisture diffusion through the edges.     

Improvement of the Adhesive Fracture Toughness of Bonded Aluminum Joints Using E-Glass Fibers at Cryogenic Temperature

Fracture toughness and crack resistance of aluminum adhesive joints were measured at the cryogenic temperature of ?150°C, with respect to the orientation and volume fraction of the E-glass fibers in the epoxy adhesive. Cleavage tests on the DCB (Double Cantilever Beam) adhesive joints were performed using two different test rates of 1.67 × 10^?2 and 8.33 × 10^?4 mm/s to observe the crack propagation trends. From the experiments, it was found that the DCB joints bonded with the epoxy adhesive reinforced with E-glass fibers not only showed a stable crack propagation with a low crack propagation speed, but also higher fracture toughness and crack resistance than those of the DCB joints bonded with the unreinforced epoxy adhesive at a cryogenic temperature of ?150°C.     

Effects of Polystyrene Block Content on Morphology and Adhesion Property of Polystyrene Block Copolymer

Effects of polystyrene block content on adhesion property and phase structure of polystyrene block copolymers were investigated. Polystyrene-block-polyisoprene-block-polystyrene triblock and polystyrene-block-polyisoprene diblock copolymers with different polystyrene block contents in the range from 13 to 35 wt% were used. In the case of the low polystyrene block content (below 16 wt%), a sea-island structure was observed: near-spherical polystyrene domains having a mean diameter of about 20 nm were dispersed in polyisoprene matrix. The phase structure changed from a sea-island structure to a cylindrical structure with an increase of polystyrene block content (over 18 wt%). Peel strength decreased with an increase of polystyrene block content and the pure triblock copolymers had lower peel strength than their blends with the diblock copolymers. Pulse nuclear magnetic resonance studies indicated that molecular mobility of polyisoprene phase decreased with an increase of polystyrene block content, and the molecular mobility was lower in the pure triblock than in the blend. Thus, the peel strength was found to be related to molecular mobility. The adhesion strength of the block copolymer depended on the molecular mobility: high molecular mobility can promote interfacial adhesion.     

Adhesion of UV-Cured Laminates of Poly(ethylene-2,6-naphthalate) (PEN) and Poly(ethylene terephthalate) (PET) films

This paper describes the properties of an ultraviolet (UV) curable laminating adhesive system that can be used with PEN, PET and UV-stabilized PET films. The adhesive system that contains (2,4,6-trimethylbenzoyl) diphenylphosphine oxide (TPO) as photoinitiator was optimally cured with a V-bulb fitted ultraviolet irradiator. The laminated structures built with this adhesive system and PEN, PET and UV-stabilized PET films showed a large manufacturing operating window, both in terms of adhesive layer thickness, initial peel strengths above 1500 N/m, V- and D-bulb UV sources and curing speeds from 5– 10 m/min. The 600-h dry heat aging tests indicated that the UV-stabilized PET films underwent less than approximately 1% decrease in light transmission and less than a 1% gain in color. The UV-stabilized PET film and its laminate showed particularly strong retention of optical properties under damp aging and QUV weathering, compared to PEN and non-UV-stabilized PET films. Finally, the peel strengths of the laminates were retained to greater than 1300 N/m for laminate structures of 50 μm film thickness, whereas structures made from thicker films retained approx. 40–60% (700–1100 N/m) of their initial peel strength.     

Strength Improvement of Adhesively-Bonded Joints Using a Reverse-Bent Geometry

Adhesive bonding of components has become more efficient in recent years due to the developments in adhesive technology, which has resulted in higher peel and shear strengths, and also in allowable ductility up to failure. As a result, fastening and riveting methods are being progressively replaced by adhesive bonding, allowing a big step towards stronger and lighter unions. However, single-lap bonded joints still generate substantial peel and shear stress concentrations at the overlap edges that can be harmful to the structure, especially when using brittle adhesives that do not allow plasticization in these regions. In this work, a numerical and experimental study is performed to evaluate the feasibility of bending the adherends at the ends of the overlap for the strength improvement of single-lap aluminium joints bonded with a brittle and a ductile adhesive. Different combinations of joint eccentricity were tested, including absence of eccentricity, allowing the optimization of the joint. A Finite Element stress and failure analysis in ABAQUS^® was also carried out to provide a better understanding of the bent configuration. Results showed a major advantage of using the proposed modification for the brittle adhesive, but the joints with the ductile adhesive were not much affected by the bending technique.     

Effect of Non-conductive Film on the Reliability of Multi-chip Package Bonded Using Ultrasonic Energy

As silicon semiconductor technologies need to achieve smaller dimensions, the development of System-onChip (SOC) devices with a large variety of functional blocks becomes very difficult to realize. A 3-D stacked package is a promising alternative to improve the performance and density of devices beyond traditional package scaling limits. However, there are many issues related to process integration, thermal management, and reliability of 3-D stacked packages. In this study, the printed circuit board (PCB), silicon carrier and silicon chip are integrated with the ultrasonic bonding method. Die shear tests on the joints were carried out with increasing bonding time and input power to optimize the bonding conditions. The integrated chips were successfully bonded with and without non-conductive film (NCF) using ultrasonic energy. The measured electrical resistance of multi-chip package bonded with NCF was lower than that of multi-chip package bonded without NCF. Thermal cycle and high temperature storage tests were carried out to see if the interface was vulnerable. Cross-sectional features of the bonded interface were inspected using a scanning electron microscope.