中国首例缓倾铋铜金矿脉--曙光(小西南岔)铜金矿床研究新进展

据现场深入研究，结合多年生产实践，首次系统地描述了小西南岔矿床北山矿段缓倾斜铋铜金支矿脉的地质产状、规模、铜和金品位、自然铋与自然金的交生关系。在此基础上，进一步阐述了缓倾铋铜金矿脉对理论、应用研究及矿山确保铜和金入选品位的重要意义。     

甲磺酸铜催化合成草酸二异戊酯

制备了甲磺酸铜催化剂,对其结构进行了IR和热重分析,并用于催化草酸和异戊醇的酯化反应。结果表明,甲磺酸铜具有催化活性高、稳定,易分离,重复使用性能优良,对环境友好的特点。最佳酯化工艺条件为:n(异戊醇):n(草酸)=2．8:1,w(甲磺酸铜)=0．3％,以过量的异戊醇为带水剂,回流反应2．0 h,酯化率可达到96．8％。     

Cu基络合物催化甲醇液相氧化羰化反应

针对甲醇液相氧化羰基化法合成碳酸二甲酯(DMC)工艺,开发了新型Cu基络合催化剂(CuB rnLm)。对CuB rnLm催化剂的活性及其稳定性进行了研究。实验结果表明,采用该催化剂,甲醇转化率和DMC选择性较高;元素价态和物质结构分析表明,CuB rnLm催化剂循环使用5次后仍保持较好的稳定性。采用正交设计和中心响应曲面法设计实验,并使用S tatistica软件进行统计分析,寻求出反应的主要影响因素,并得到优化的工艺条件:反应温度100~110℃、反应压力3.0~3.5M Pa、反应时间4~6h、CuB rnLm催化剂质量浓度(以甲醇的体积计)0.15~0.20g/mL。在此工艺条件下,甲醇转化率可达23%以上,DMC的选择性为96%~98%。     

流变仪在覆铜板工序中的应用

本文简要叙述利用流变仪对覆铜箔层压板生产工序中的胶液和半固化片参数进行控制,从而更好地保证胶液和 半固化片性状的一致性,以有利于控制板材流胶和品质。     

A Donor–Acceptor Polymer with a Peculiar Negative‐Charge‐“Trapping” Characteristic

Voltammetric and spectrophotometric measurements of poly(3,3″‐dipentoxy‐3′‐dicyanoethenyl‐2,2′:5′,2″‐terthiophene) (polyCN) films, in connection with other experimental evidence, reveal a normal oxidative, but a peculiar reductive behavior consisting of trapping of the negative charge during the cathodic scan. Another interesting property of polyCN films is the tendency to form strong intramolecular and intermolecular associations, probably charge‐transfer (CT) complexes. These properties could account for the fact that the photovoltaic performance does not improve when polyCN is blended with a polythiophene donor.     

Cu-Mg/Al_2O_3催化乙醇和乙二胺合成N-乙基乙二胺

在固定床反应器内,乙醇和乙二胺经分子间催化胺化反应合成了N-乙基乙二胺(NEED),考察了一系列铜系催化剂的活性,并筛选出催化性能较好的Cu-Mg/A l2O3催化剂;通过X射线衍射和透射扫描电子显微镜方法表征了助剂Mg对Cu/A l2O3催化剂的改性作用;考察了助催化剂Mg含量、反应温度、反应压力、进料量和乙二胺含量等对Cu-Mg/A l2O3催化剂性能的影响。实验结果表明,Cu-Mg/A l2O3催化剂具有很好的活性和选择性;在200℃、3.0MPa、质量分数20%的乙二胺乙醇溶液、进料量1.0mL/m in的条件下,乙二胺的转化率为71.56%,产物NEED的选择性和收率分别为92.62%和69.86%;经过20 d的连续使用表明,Cu-Mg/A l2O3催化剂具有良好的稳定性。     

An application of chemometric techniques to analyze the effects of the wave function modifications on the intermolecular stretching frequencies of the hydrogen-bonded complexes

Factorial design and principal component models are used to determine how ab initio H-bond stretching frequencies depend on characteristics of the molecular orbital wave functions of acetylene–HX, ethylene–HX and cyclopropane–HX π-type hydrogen complexes with X=F, Cl, CN, NC and CCH. The results obtained for the three sets of complexes show that factorial design and principal component analyses complement each other. Factorial design calculations clearly show that these frequencies are affected mostly by inclusion of electron correlation on the calculation level. On average, their values are increased by about 25 cm⁻¹ due to a change from the Hartree–Fock (HF) to Möller–Plesset 2 (MP2) level. Valence, diffuse and polarization main effects as well as valence–diffuse, diffuse–correlation and polarization–correlation interaction effects are also important to better describe a factorial model to the H-bond stretching frequencies of these hydrogen complexes. This simplified model has been successful in reproducing the complete ab initio results, which correspond to two hundred and forty calculations. Principal component analyses applied only to hydrogen-bonded complexes whose experimental frequencies are known, has revealed that the six-dimensional original space can be accurately represented by a bidimensional space defined by two principal components. Its graphical representation reveals that the experimental intermolecular stretching frequencies are in closest agreement with the MP2/6–31+G and MP2/6–311+G ab initio results.     

Characterization and optimization of copper chemical mechanical planarization

The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors (ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements, the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node.     

Synthesis of heterocyclic metal complexes and their evaluation as marine antifoulants

4-Amino-3-thio-1,24-triazolidine (L₁) and 4-amino-5-thio-1,3,4-thiadiazole (L_II) as well as their metal complexes of the general formulae ML_I·2H₂O and ML_IICl (M; Pb(II), Cd(II) and Zn(II)) were prepared. With Sn(II), we obtained Sn(L_I)₂·2H₂O and SnL_IICl, respectively. The structures of the compounds were identified through elemental analysis, and IR and UV spectra measurements, in addition to thermal analysis in case of the metal complexes. The antifouling properties of the compounds were tested by their incorporation into paint formulations which were applied to PVC substrates and tested in water from Alexandria western harbour. When the compounds were added at 17·5% by volume, the coated panels were fouled after 3 months of immersion. The addition of 6·7% by volume of tributyltin oxide to 15·8% of the prepared compounds in one formulation elevated the paint efficiency and prevented fouling for 11 months. Paint containing solely tributyltin oxide at the same concentration was inactive against algae.     

铜线材酸性高速电镀致密光亮锡、锡铜合金

为了寻找低成本、低腐蚀、低污染高速电镀锡、锡铜合金工艺 ,在含光亮剂、柔软剂DL0 1、0 2、0 3的硫酸槽中在不同的电流密度、不同的搅拌速度下 ,在Φ0 .5mm的铜线上电镀Sn和Sn Cu合金镀层。DL0 1、0 2的主要成分是无芳香族的希夫碱 ,DL0 3的主要成分是醇醛缩合物。结果表明 ,在含有DL0 1、0 2、0 3和 35g/LSnSO4 ,137g/LH2 SO4 的镀液中 ,在Jc=10～ 90A/dm2 ,v=16 0～ 314m/min时 ,所得镀层致密、柔软、光亮。在含CuSO4 ·5H2 O 0 .5 ,3.5g/L的硫酸镀槽中 ,在Jc=9,18A/dm2 ,v=16 0m/min时获得了致密、柔软、光亮的Sn (0 .3%～ 0 .6 % )Cu合金镀层。