The perceived quality of in-vehicle auditory signals: a structural equation modelling approach

Abstract

The current study applied Structural Equation Modelling to analyse the relationship among pitch, loudness, tempo and timbre and their relationship with perceived sound quality. Twenty-eight auditory signals of horn, indicator, door open warning and parking sensor were collected from 11 car brands. Twenty-one experienced drivers were recruited to evaluate all sound signals with 11 semantic differential scales. The results indicate that for the continuous sounds, pitch, loudness and timbre each had a direct impact on the perceived quality. Besides the direct impacts, pitch also had an impact on loudness perception. For the intermittent sounds, tempo and timbre each had a direct impact on the perceived quality. These results can help to identify the psychoacoustic attributes affecting the consumers’ quality perception and help to design preferable sounds for vehicles. In the end, a design guideline is proposed for the development of auditory signals that adopts the current study’s research findings as well as those of other relevant research.

Practitioner Summary: This study applied Structural Equation Modelling to analyse the relationship among pitch, loudness, tempo and timbre and their relationship with perceived sound quality. The result can help to identify psychoacoustic attributes affecting the consumers’ quality perception and help to design preferable sounds for vehicles.     

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Characterisation of electroplated Sn/Ag solder bumps

Environmental concerns as well as legal constraints have been pushing research on flip chip technology towards the development of lead-free solders and also to new deposition techniques [Z.S. Karim, R. Schetty, Lead-free bump interconnections for flip-chip applications, in: IEEE/CPMT 1nternational Electronics Manufacturing Technology Symposium, 2000, pp. 274-278, P. Wölflick, K. Feldmann, Lead-free low-cost flip chip process chain: layout, process, reliability, in: IEEE International Electronics Manufacturing Technology (IEMT) Symposium, 2002, pp. 27-34, M. McCormack, S. Jin, The design and properties of new, pb-free solder alloys, in: IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1994, pp. 7-14, T. Laine-Ylijoki, H. Steen, A. Forsten, Development and validation of a lead-free alloy for solder paste applications. IEEE Transactions on Components, Packaging, and Manufacturing technology, 20(3) (1997) 194-198, D. Frear, J. Jang, J. Lin, C. Zhang, Pb-free solders for flip-chip interconnects, JOM, 53(6) (2001) 28-32].Binary and ternary tin alloys are promising candidates to substitute lead-content components. In this paper, we describe an electroplating technique for high density FlipChip packaging [M. Bigas, E. Cabruja, Electrodeposited Sn/Ag for flip chip connection, CDE (2003)]. An analysis using Auger Electron Spectroscopy (AES) together with additional Energy Dispersive Xray analysis (EDS) tests and Scanning Electron Microscope (SEM) analysis have been performed to optimize the reflow process of the electrodeposited bumps.     

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