最优特征子集选择问题

机器学习和模式识别面临的一个重要问题，就是特征子集的选择问题，即从一个大的已生征特集合，选择一个子集合来一致地描述已知例。特别，最优特征子集选择问题，即最小的特征子集问题的 计算杂性至今学不清楚。     

65MnTi盘条拉拔过程中出现断裂的原因分析

分析检验拉拔过程中发生断裂的65MnTi盘条的金相组织和断口形貌，得出结论；65MnTi金条发生断裂的原因是热轧后冷却速度过快，金相组织中出现了低温转变组织──马氏体组织；而理想的组织应为京氏体；并且最佳冷却速度为5℃／s左右。     

煤气吹扫时惰性气体抑爆用量的优选

运用惰性气体消防抑爆理论，采用数学积分法计算出吹扫煤气设施时抑爆所需最少惰性气体需要量．     

A MULTIAXIAL FATIGUE DAMAGE MODEL FOR ORTHOTROPIC MATERIALS UNDER PROPORTIONAL LOADING

A new multiaxial fatigue damage model for orthotropic materials is proposed based on the strain vector. Six material constants are included in the model. These material constants represent the dependence of fatigue resistance on material orientation, and they can be obtained by conducting strain-controlled uniaxial fatigue tests along the three principal orthotropic directions of an orthotropic material. The model can also be transformed in new coordinate systems to predict the fatigue lives of new material orientations. Biaxial low-cycle fatigue tests are conducted to verify the model. The prediction of the model agrees with the experimental results reasonably well.     

流动注射分光光度法测定钴

研究了将ＰＡＮ用于流动注射（ＦＩＡ）分光光度法测定微量钴，在５６０ｎｍ处绘制标准曲线，线性范围为０～４５μｇ／ｍｌ，相关系数０．９９６，方法的相对标准偏差（ＲＳＤ）小于３％，加标回收率为９５％～１０５％，进样频率８０次／ｈ。本法简单快速，用于面粉、分子筛，铝合金测定结果令人满意。     

肝癌碘油栓塞后肝区平片所见碘油沉积量与疗效关系

本文分析了90例肝癌肝动脉灌注化疗碘油栓塞后,肝区平片所见碘油沉积量和疗效的关系。碘油沉积分为多,中,少三组,从ATP下降,肿瘤缩小率及一年生存率三方面比较。结果沉积多的与中等组三项都有显著差别;沉积中等的与少的组差别不明显。说明碘油沉积要达到一定的量后,疗效才会显著提高。同时分析了影响碘油沉积的几个因素。     

混酸PEG酯的合成及性能研究

用从大豆油脚水解制得的脂肪酸合成混酸聚乙二醇酯，通过测定酸值的方法确定了最佳反应时间为16h。与油酸聚乙二醇酯相比，混酸聚乙二醇酯具有更优良的乳化性、润湿性，可以替代油酸聚乙二醇酯用于纺织、农药和化妆品工业中。     

核测井仪器中的磁屏蔽研究

核测井仪器受套管剩磁的影响比较严重，常常用在探测器的周围缠绕多层坡莫合金带的方法进行磁屏蔽，由于缠绕的坡莫合金圆筒不能闭合，加上缠绕过程中坡莫合金带的形变造成材料本身磁导率的下降，传统的磁屏蔽方法的效果不好。本文介绍一种简单易行、磁屏蔽效果较好的方法，实验的结果说明用电工纯铁做探测器的外壳可以达到令人满意的效果。     

Inductively coupled plasma etching of InGaP, AllnP, and AlGaP in Cl2 and BCl3 chemistries

Dry etching of InGaP, AlInP, and AlGaP in inductively coupled plasmas (ICP) is reported as a function of plasma chemistry (BCl₃ or Cl₂, with additives of Ar, N₂, or H₂), source power, radio frequency chuck power, and pressure. Smooth anisotropic pattern transfer at peak etch rates of 1000–2000Å·min^?1 is obtained at low DC self-biases (?100V dc) and pressures (2 mTorr). The etch mechanism is characterized by a trade-off between supplying sufficient active chloride species to the surface to produce a strong chemical enhancement of the etch rate, and the efficient removal of the chlorinated etch products before a thick selvedge layer is formed. Cl₂ produces smooth surfaces over a wider range of conditions than does BCl₃.     

Synthesis and characterization of molybdenum disulphide formed from ammonium tetrathiomolybdate

An investigation has been carried out into the possibility of in situ formation of MoS2 within porous anodic films on aluminium, to improve subsequent tribological behaviour, by re-anodizing in thiomolybdate electrolyte. Acidification of thiomolybdate was employed to simulate the conditions for formation of the sulphide at the anodic film/electrolyte interface, followed by appropriate vacuum heat treatments to study possible temperature effects on the sulphide due to either friction or Joule heating during anodizing. The products of both acidification and heat treatment, characterized by X-ray powder diffraction and scanning electron microscopy, were compared with those formed by direct thermal decomposition of ammonium tetrathiomolybdate crystals. The precipitate formed by acidification was mainly amorphous molybdenum trisulphide (MoS3), which on heat treatment at 450 and 850°C yielded 3R-MoS2. 3R-MoS2 also formed by the thermal decomposition of thiomolybdate crystals. Thermogravimetric and differential thermal analyses showed that the decomposition of MoS3 to MoS2 occurred in the range 220–370°C and revealed the sequence of reaction steps. The findings suggest that mainly amorphous MoS3 is formed as a consequence of changes in the pH of the film/electrolyte interface during re-anodizing but the product is relatively easily transformed to crystalline MoS2 on moderate heating which may occur during wear processes.