Energieinformatik

Due to the increasing importance of producing and consuming energy more sustainably, Energy Informatics (EI) has evolved into a thriving research area within the CS/IS community. The article attempts to characterize this young and highly dynamic field of research by describing current EI research topics and methods and provides an outlook of how the field might evolve in the future. It is shown that two general research questions have received the most attention so far and are likely to dominate the EI research agenda in the coming years: How to leverage information and communication technology (ICT) to (1) improve energy efficiency, and (2) to integrate decentralized renewable energy sources into the power grid. Selected EI streams are reviewed, highlighting how the respective research questions are broken down into specific research projects and how EI researchers have made contributions based on their individual academic background.     

Silicon‐containing heterocyclic polymers and thin films made therefrom

Thin films, in the range of tens of micrometers thickness, have been prepared by casting onto glass plates the chloroform or N‐methylpyrrolidone solutions of polyimides or poly(imide‐amide)s containing silicon and phenylquinoxaline units in the main chain. The polymers have been synthesized by solution polycondensation reaction of aromatic diamines having preformed phenylquinoxaline rings with bis(3,4‐dicarboxyphenyl)dimethylsilane dianhydride or with a diacid chloride resulting from the reaction of this dianhydride with p‐aminobenzoic acid. The polymers were easily soluble in polar aprotic solvents and showed high thermal stability. The free‐standing films exhibited good mechanical properties with tensile strengths in the range of 48–86 MPa, tensile modulus in the range of 1.25–2.22 GPa and elongation at break in the range of 3–37%. Electrical insulating properties of some polymer films were evaluated on the basis of dielectric constant and dielectric loss and their variation with frequency and temperature. The values of the dielectric constant at 10 kHz were in the range of 2.94–3.08 for polyimides and 3.89–4.49 for poly(imide‐amide)s. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 3062–3068, 2006     

Einfluß der Konfiguration der Fettsäuren auf die Eigenschaften von Seife

Effect of Fatty Acid Configuration on the Properties of Soap The effect of configuration of the hydrophobic chain of fatty acids C₁₀–C₁₈ on the properties of their alkali salts was studied. Furthermore, the effect of temperature on critical micelle concentration (CMC) and on alteration of surface tension at CMC, as well as the effect of chain length of the hydrophobic part on CMC were determined. At the same time, the effect of double and cis-trans configuration on CMC was studied. Also the foaming ability of the individual soaps and foam stability as well as the stability of the soaps were investigated.     

High-pressure catalytic and thermal cracking of polyethylene

The thermal cracking and catalytic cracking processes of low-density polyethylene were studied in a closed autoclave. The compositions of gaseous and liquid products were analysed by means of GC/FID and GS/MS chromatographic methods. The fractional composition of liquid products was found by distillation. Increased temperature of PE depolymerisation process increases the production of gaseous products and low-boiling liquid compounds; more aromatic hydrocarbons are formed instead of alkenes. When a lower temperature and longer time are adopted for the process to reach the assumed conversion, more straight chained hydrocarbons are produced. The acidic aluminosilicate catalyst yields more low-boiling liquid fractions, more isoalkanes and more aromatics. The neutral alumina is favourable for the production of alkenes and vacuum gas oil fraction in comparison to a non-catalytic process. The Ni–Mo/Al₂O₃ catalyst is efficient in hydrogenation of depolymerisation products. The reaction products contain only saturated compounds then and no aromatics are formed.     

Studies on the synthesis of fiber-forming block copolymers of polyacrylonitrile and poly(ethylene oxide)

Modified PEO (MW 6000) containing xanthate groups was used for the synthesis of block copolymers of PAN and PEO. Principal parameters affecting the synthesis were examined. To confirm the segmental structure of the obtained products, precipitation fractionation, gel permeation chromatography, infrared, and ¹H nuclear magnetic resonance methods were used. The fiber-forming properties were investigated by means of rheological examination of concentrated solutions of PAN–PEO and confirmed by spinning the fibers under laboratory conditions. The physical and mechanical properties of the fibers were also determined.     

An approach to reduce energy consumption and performance losses on heterogeneous servers using power capping

Journal of Scheduling - Rapid growth of demand for remote computational power, along with high energy costs and infrastructure limits, has led to treating power usage as a primary constraint in...     

Pb-Free solders: Part 1. Wettability testing of Sn−Ag−Cu alloys with Bi additions

Maximum bubble pressure, dilatometric, and meniscographic methods were used in the investigations of the surface tension, density, wetting time, wetting force, contact angle, and interfacial tension of liquid alloys of Sn−Ag−Cu eutectic composition with various additions of Bi. Density and surface tension measurements were conducted in the temperature range 250–900 °C. Surface tensions at 250 °C measured under a protective atmosphere of Ar−H₂ were combined with data from meniscographic studies done under air or with a protective flux. The meniscographic data with a nonwetted teflon substrate provided data on interfacial tension (solder-flux), surface tension in air, and meniscographic data with a Cu substrate allowed determinations of wetting time, wetting force, and calculation of contact angle. The calculated wetting angles from meniscographic studies for binary Sn−Ag eutectic and two ternary Sn−Ag−Cu alloys were verified by separate measurements by the sessile drop method under a protective atmosphere with a Cu substrate. Additions of Bi to both ternary alloys improve the wettability and move the parameters somewhat closer to those of traditional Sn−Pb solders.     

Pb-Free solders: Part II. Application of ADAMIS database in modeling of Sn−Ag−Cu alloys with Bi additions

The ADAMIS database was used for calculation of the surface tension of the quaternary Sn−Ag−Cu−Bi liquid alloys by Butler's model. The resultant data were compared with those from the maximum bubble pressure measurements from Part I. The same thermodynamic database was next applied for the calculation of various phase equilibria. It was established that the Bi addition to the ternary Sn−Ag−Cu alloys (Sn-2.6Ag-0.46Cu and Sn-3.13Ag-0.74Cu in at.%; Sn-2.56Ag-0.26 Cu and Sn-2.86Ag-O.40Cu in mass%) causes lowering of the melting temperature and the surface tension to make the tested alloys closer to, traditional Sn−Pb solders. The simulation of the solidification by Scheil's model showed that the alloys with the higher Bi concentration are characterized by the lifting-off failure due to the segregation of Bi at the solder/substrate boundary. Thus, in modeling of new Pb-free solders, a compromise among various properties should be taken into consideration.     

Empathy and Modern Technology: A Neuroergonomics Perspective

The primary purpose of this paper is to discuss the role of empathy in the design of advanced systems in manufacturing and service industries in order to ensure suitable working conditions for employees from the social and technological point of view. The origins and components of empathy are briefly reviewed. The neural underpinnings of three components of empathy, including cognitive, emotional, and behavioral aspects, are considered in the context of human–human and human–machine interactions, as well as design of working environments. Finally, the potential advantages of applying empathy‐related knowledge to the design and development of human‐centered technology are discussed.