Synthesis and characterizations of a polyimide containing a triphenylamine derivative as an interlayer in polymer light-emitting diode

Polyimide containing triphenylamine derivative (TPD-PI) was synthesized to prepare a polymer interlayer having insolubility in common nonpolar solvent for light-emitting polymers. N,N′-diphenyl-N,N′-bis(4-aminophenyl)-1,1-biphenyl-4,4′-diamine, as a new triphenylamine-containing diamine monomer, was synthesized by the palladium-catalyzed amination reaction between 4-nitrodiphenylamine and 4,4′-dibromobiphenyl and subsequent reduction of the nitro-intermediate. The TPD-PI was prepared from the synthesized diamine monomer and 4,4′-(hexafluoropropylidene)-diphthalic anhydride by the standard two-step polymerization method, which involved ring-opening polymerization and subsequent cyclodehydration. The structures and properties of the monomer and the resulting polyimide were characterized with ¹H and ¹³C NMR, elemental analysis, gel permeation chromatography, UV-visible spectroscopy, etc. The TPD-PI is readily soluble in aprotic polar solvents such as N-methyl-2-pyrrolidinone and N,N-dimethylformamide and insoluble in nonpolar solvents such as toluene and xylene. The highest occupied molecular orbital (HOMO) level of the TPD-PI was measured to be 5.5 eV by a photoelectron spectrometer in air, and the band gap was calculated as 3.1 eV from the onset of UV-vis spectrum. The polymer light-emitting diode with the thin TPD-PI layer between a hole injection layer and an emitting polymer layer was fabricated to examine the performance of the polyimide as an polymer interlayer. Although the luminous efficiency of the device is lowered by the introduction of the TPD-PI interlayer, the lifetime of the device is improved.     

Experimental analysis of bubble mode in a plate-type absorber

An experimental analysis of ammonia-water absorption was performed in a plate-type absorber. The flow of water and ammonia gas was performed in the bubble mode. The experiments were made to examine the effects of solution flow rate and gas flow rate on the performance of the absorber. It was found that the increase of solution flow rate rarely affected the mass transfer, but improved the heat transfer. As the gas flow rate increased, slugging occurred in the bubble mode and influenced the thermal boundary layer. Finally, the results were converted into dimensionless numbers to elucidate physical phenomena and plotted as Sherwood number versus Reynolds number for mass transfer performance and Nusselt number versus Reynolds number for heat transfer performance.     

Biodegradability of cellulose fabrics

Biodegradability of cellulose fabrics was evaluated by use of a soil burial test, an activated sewage sludge test, and an enzyme hydrolysis. Surface changes after biodegradation were observed by optical microscopy. From X‐ray diffraction analysis (XRD), changes in the crystallinities and the internal structures as a result of degradation were also investigated. It was shown that biodegradability decreased in the following order: rayon > cotton ? acetate. Rayon fibers, which have a low crystallinity and a low degree of orientation, showed the highest biodegradability in most cases. However, in spite of its low crystallinity, acetate fibers exhibited very low biodegradability, probably because of the presence of hydrophobic groups in its structure. On the other hand, linen showed an inconsistent behavior in that it had the highest biodegradability in the soil burial test, but a lower biodegradability than that of cotton in the activated sewage sludge test. XRD analysis revealed that there was a slight increase in the crystallinity of linen, cotton, and rayon fabrics at the initial stage, but a continuous decrease thereafter. From the correlation analysis, it was revealed that the biodegradability of cellulose fabrics was closely related to the moisture regain of the fibers, which reflects the hydrophilicity and internal structure of the fibers at the same time. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 248–253, 2004     

Determination of Inversion Temperature of Sb2O3-Doped BaTiO3 Positive Temperature Coefficient of Resistivity (PTCR) Ceramics by the Finite Difference Method

The effect of the cooling rate on the PTCR (positive temperature coefficient of resistivity) characteristics of 0.1 mol% Sb₂O₃-doped BaTiO₃ ceramics has been investigated. Resistances both below and above the Curie temperature were increased by slow cooling, which indicated that the resistive layer width at the grain boundary increased as the cooling rate decreased. Concentration profiles of the Ba vacancies as a function of distance from the grain boundary have been simulated by the finite difference method. The inversion temperature of the 0.1 mol% Sb₂O₃-doped BaTiO₃ system was determined to be 1160°C from the measured electrical properties and computed concentration profiles.     

Preparation of high molecular weight poly(vinyl pivalate) with high yield and high molecular weight poly(vinyl alcohol) by emulsion polymerization of vinyl pivalate and saponification

To prepare high molecular weight (HMW) poly(vinyl pivalate) (PVPi) with high yield and high linearity which is a promising precursor for syndiotactic poly (vinyl alcohol) (PVA), vinyl pivalate (VPi) was emulsion polymerized, using 2,2′‐azobis(2‐amidinopropane) dihydrochloride (AAPH) as an initiator and sodium dodecyl sulfate (SDS) as an emulsifier. The effect of the polymerization conditions on the conversion, molecular weight, and degree of branching was investigated. PVA with maximum number‐average degree of polymerization (P_n) of 6200 could be prepared by complete saponification of PVPi, with P_n of 13,300–16,700 obtained at polymerization temperature of 50°C, using SDS and AAPH concentration of 2.0 × 10^?3 mol/L of water and 1.0 × 10^?3 mol/L of water, respectively, and the maximum conversion was about 90%. From the emulsion polymerization of VPi, spherical PVPi with high yield was effectively prepared, which might be useful for the precursor of syndiotactic PVA micro‐ and nano‐spheres with various surface properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 410–414, 2007     

Determining node duty cycle using Q-learning and linear regression for WSN

Wireless sensor network(WSN)is effective for monitoring the target environment,which consists of a large number of sensor nodes of limited energy.An efficient medium access control(MAC)protocol is thus imperative to maximize the energy efficiency and performance of WSN.The most existing MAC protocols are based on the scheduling of sleep and active period of the nodes,and do not consider the relationship between the load condition and performance.In this paper a novel scheme is proposed to properly determine the duty cycle of the WSN nodes according to the load,which employs the Q-leaming technique and function approximation with linear regression.This allows low-latency energy-efficient scheduling for a wide range of traffic conditions,and effectively overcomes the limitation of Q-learning with the problem of continuous state-action space.NS3 simulation reveals that the proposed scheme significantly improves the throughput,latency,and energy efficiency compared to the existing fully active scheme and S-MAC.     

Thermal stability of lamellar structure of PST crystal and lamellar boundary design for creep resistant TiAl alloy

The stability of lamellar structure is crucial for the creep resistance of TiAl alloys, but degradation of the lamellar structure is unavoidable at high temperatures. The degradation of the lamellar structure in PST crystals of Ti-48mol.%Al was studied during high temperature exposure (annealing and creep testing) to examine how to make a stable lamellar structure with high creep deformation resistance. Since the six orientation variants of γ lamellae are nucleated independently of the adjoining lamellae, pseudo twin and 120° rotational fault boundaries are most frequently observed at the initial stage of lamellar formation. The preferential removal of high energy (pseudo twin and 120° rotational fault) boundaries during the evolution of lamellar structure results in the highly probable appearance of a true twin boundary at a later stage of lamellar evolution. The coarsening of lamellar spacing and the spheroidization of the lamellae are the major degradation events occurring during creep deformation, and the migration of the lamellar boundaries brings both of them about. The lamellar structures of TiAl alloy contain four types of lamellar boundaries. The stability of the four types of boundaries decreases in the following order: γ/α₂ > true twin > pseudo twin > or=120° rotational fault boundaries. The γ/α₂ boundary has the highest stability (lowest mobility), and the high density of γ/α₂ boundaries is proposed to make a stable lamellar structure with good creep resistance. A material having the high density of γ/α₂ boundaries was produced through the heat treatment of a PST crystal in the α+γ two-phase regime. The excellent creep properties of the material were proven through creep tests of hard oriented PST crystals made of the material. This article is based on a presentation made in the 2002 Korea-US symposium on the “Phase Transformations of Nano-Materials,” organized as a special program of the 2002 Annual Meeting of the Korean Institute of Metals and Materials, held at Yonsei University, Seoul, Korea on October 25–26, 2002.     

Effect of minor elements on hot cracking susceptibility of austenitic stainless steel welds

This research evaluates the effects of Si, N and REM on the hot cracking behavior of specially designed austenitic stainless steels. Varestraint hot cracking tests and microstructural examination revealed that solidification cracking of 304 can be minimized by a suitable addition of Si, N and control of the solidification mode. Further, the addition of N to “fully” austenitic 316 weld metal decreased solidification cracking susceptibility. REM additions were also effective in reducing solidification and weld metal HAZ liquation cracking in 347, but was ineffective for reduction in base metal HAZ liquation cracking.     

Micro-end-milling of single-crystal silicon

Ductile-regime machining of silicon using micro-end-mill is almost impossible because of the brittle properties of silicon, crystal orientation effects, edge radius of the cutter and the hardness of tool materials. Micro-end-milling can potentially be used to create desired three dimensional (3D) free form surface features using the ductile machining technology for single-crystal silicon. There is still a lack of fundamental understanding of micro-end-milling of single-crystal silicon using diamond-coated tool, specifically basic understanding of material removal mechanism, cutting forces and machined surface integrity in micro-scale machining of silicon. In this paper, further research to understand the chip formation mechanism was conducted. An analysis was performed to discover how the chips are removed during the milling process. Brittle and ductile cutting regimes corresponding to machined surfaces and chips are discussed. Experiments have shown that single-crystal silicon can be ductile machined using micro-end-milling process. Forces generated when micro-end-milling single-crystal silicon are used to determine the performance of the milling process. Experimental results show that the dependence of the cutting force on the uncut chip thickness can be well described by a polynomial function order n. As cutting regime becomes more brittle, the cutting force has more complex function.