剪切型调距式密炼机的性能研究

对啮合型、剪切型和剪切调距型3种密炼机的混烁实验结果进行了比较分析,对剪切调距型密炼机的性能进行了研究,实验表明：新开发的剪切型调距式密炼机能够混炼均匀,分散度高,能量消耗少,排胶温度低,可通过改变间隙实现优化混炼,尤其适合于快速混烁作业和难以分散而又快速生热的胶料的混烁,应用前景比较广淘.     

电子陶瓷材料研究的一些新进展

随着电子科学技术的发展，用作电子材料的陶瓷的研究和开发十分引人注目，许多工厂和科研人员正在研究开发电子陶瓷新材料、新工艺和新器件，以满足电子科学技术的发展对高性能陶瓷材料的要求。本文简要介绍了电子陶瓷系统中绝缘体、介电质、压电体及铁电薄膜材料及其制备工艺和应用方面的一些新进展。     

配合物Zn(Him)2(OAc)2的室温固相合成及表征

乙酸锌与咪唑 (Him)通过室温固相反应一步合成配合物Zn(Him) 2 (OAc) 2 ,反应不需溶剂 ,2 0min即可完成 ,产率达 96% ,并用元素分析、红外光谱、热重分析、X -射线粉末衍射和X -射线单晶衍射对产物进行了表征。     

氮化制度对Si-Al-Al2O3体系合成Sialon的影响

以SiC、α-Al2O3微粉、Si粉、Al粉为原料,在1450℃流动氮气中制备Sialon/SiC材料。研究了不同温度保温氮化对Sialon合成的影响。研究结果表明:有部分硅粉残余没有氮化;在1100℃保温氮化的氮化率高于在1150℃、1200℃保温氮化;1100℃保温氮化,残余Si量少、分布均匀,残余硅熔聚现象较轻,利于Sialon的合成。     

In-Plane Cracking Behavior and Ultimate Strength for 2D Woven and Braided Melt-Infiltrated SiC/SiC Composites Tensile Loaded in Off-Axis Fiber Directions

The tensile mechanical properties of ceramic matrix composites (CMC) in directions off the primary axes of the reinforcing fibers are important for the architectural design of CMC components that are subjected to multiaxial stress states. In this study, two-dimensional (2D)-woven melt-infiltrated (MI) SiC/SiC composite panels with balanced fiber content in the 0° and 90° directions were tensile loaded in-plane in the 0° direction and at 45° to this direction. In addition, a 2D triaxially braided MI SiC/SiC composite panel with a higher fiber content in the ±67° bias directions compared with the axial direction was tensile loaded perpendicular to the axial direction tows (i.e., 23° from the bias fibers). Stress–strain behavior, acoustic emission, and optical microscopy were used to quantify stress-dependent matrix cracking and ultimate strength in the panels. It was observed that both off-axis-loaded panels displayed higher composite onset stresses for through-thickness matrix cracking than the 2D-woven 0/90 panels loaded in the primary 0° direction. These improvements for off-axis cracking strength can in part be attributed to higher effective fiber fractions in the loading direction, which in turn reduces internal stresses on weak regions in the architecture, e.g., minicomposite tows oriented normal to the loading direction and/or critical flaws in the matrix for a given composite stress. Both off-axis-oriented panels also showed relatively good ultimate tensile strength when compared with other off-axis-oriented composites in the literature, both on an absolute strength basis as well as when normalized by the average fiber strength within the composites. Initial implications are discussed for constituent and architecture design to improve the directional cracking of SiC/SiC CMC components with MI matrices.     

无铅压电陶瓷的研究进展

在压电陶瓷领域，无铅压电陶瓷从环保的角度考虑越来越引起人们的注意。本文主要综述了以BNT为基的3类无铅压电陶瓷体系。它们都是很好的无铅压电陶瓷的侯选材料，其中BNBT－6，BNTN－3和BNST－2的机电耦合常数K33分别为0．55，0．43，而且具有较高的频率常数和较小的介电系数，适用于众多高频超声换能检测领域以及压电致动装置等方面，所以作为无铅压电陶瓷它们是很有潜力的。     

无铅焊膏在电子封装组装中的应用

随着人们对环境的日益重视和电子封装组装焊接技术的发展，合金焊膏的无铅化和质量的要求越来越高，开发无铅、无毒焊膏成为焊膏开发的重要方向，本文论述了几种无铅焊膏Sn-Ag系，Sn-Bi和Sn-Zn系的特点，同时，也检测和评价了一种Sn-Ag免洗焊膏，其绝缘抗阻性，抗腐蚀性，产品清洁度和产品可靠性等均符合要求。     

Coloring effect of the organic hybrid of polyamide 6 and N,N′‐ethylene‐bis(tetrabromophthalimide)

Coloring study in organic hybrid of polyamide (PA6) and N,N′‐ethylene‐bis(tetrabromophthalimide) (EPT), where the chromophore was self‐assembled by hydrogen bonding formed between PA6 molecular chains and EPT compound, have been characterized by several techniques. CS930 double wavelength lamella scanner was employed to measure the change of color. The existence of hydrogen bonding in PA6/N‐N′‐ethylene‐bis (tetrabromophthalimide) (PA6EPT) was investigated with Fourier transform infrared (FTIR), the results of which were compared with that of PA6 with the same thermal history. FTIR spectra at room temperature revealed that there is essentially hydrogen bonding between PA6 and EPT. The crystallization behavior of PA6EPT affected by hydrogen bonding was studied by using FTIR. The temperature‐dependent behavior of both PA6 and PA6EPT was studied by temperature‐FTIR spectroscopy and differential scanning calorimetry (DSC). With temperature increasing, changes in sensitive, high‐resolution absorbance spectra are observed as dissolve‐volatilizing thin film. Temperature‐FTIR results showed that the hydrogen bonding in PA6EPT attenuated and dissociated considerably at a smaller rate than PA6, that is to say, hydrogen bonding in PA6EPT is more stable than that in PA6. DSC showed that the melting temperature of PA6EPT and PA6 are similar. However, the crystalline degree and crystalline temperature and melting enthalpy of PA6 and PA6EPT are different. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 594–600, 2007     

碘仿电解合成的工艺研究

开发了一种以石墨为阳极、铅为阴极、采用旋转阳极和离子膜分隔电解槽的碘仿电解合成的先进工艺 ,经过 5因素 4水平的正交试验 ,发现影响电流效率的各工艺因素中 ,阳极电流密度的影响最大 ,其次分别为阳极液温度 ,阳极液 p H值 ,阳极液中碘化钾的浓度和阳极转速。优化得到碘仿电合成的最佳工艺条件为 :碘化钾浓度 2 0 0 g· L- 1 ,阳极电流密度 2 5 A· dm- 2 ,阳极液温度为 2 0℃ ,阳极液 p H值为 9.5,阳极转速为2 0 0 r· min- 1 ,在此最佳工艺条件下 ,电流效率可达 97.2 3%。