Headspace fingerprinting approach to identify the major pathway influencing volatile patterns of vinasse-cured duck processed by high pressure,as well as its impact on physicochemical and sensory attributes

As a decisive attribute, flavour could be influenced by HP treatments through multiple physical and chemical pathways within the high pressure (HP)-assisted meat curing process. This investigation aimed to identify the major pathway influencing volatile flavour patterns of two representative vinasse-cured duck (VCD) products with HP treatments (150–300 MPa/15 min), including wet and dry types, by employing headspace fingerprinting as an untargeted approach. Results suggested that HP treatments greatly lowered moisture contents and increased Warner-Bratzler shear force and thiobarbituric acid reactive substances of the cured samples. According to multivariate models, the volatile flavour patterns of the HP-processed VCD could be clearly separated from the unprocessed samples, but the VCD pressurised at different intensities represented similar volatile fingerprinting, which was validated by e-nose analysis. The discriminant analysis (OPLS-DA) model outlined vinasse-derived ethanol, acetic acid, 3-methyl-1-butanol, 2-methyl-1-butanol, phenethyl alcohol and 2-methyl-3-octanone as the major discriminant aromas across the unpressurised and pressurised samples.     

Excellent Mechanical and Transparency Properties of Cationic Waterborne Polyurethane Films Modified by Boehmite Sol

The strategies for nanosol from metal alkoxide have enabled production of ultratransparent and mechanically robust polymer nanocomposites at extremely high loading. Herein, a simple approach to fabricate high‐performance polyurethane‐based nanocomposites via unmodified boehmite nanoparticles is reported. Evaluating their physical properties, the uniform dispersion of boehmite in the matrix caused nanocomposites retains ultrahigh transparency. Hydrogen bonding and intermolecular entanglement between boehmite and polyurethane brings about the mechanical properties of the nanocomposites material enhanced, i.e., strength, stiffness, and toughness. Optimized strength, stiffness, and toughness of Boehmite/Cationic waterborne polyurethane at 40 wt% (BNC40) are up to 58.1 MPa, 1096.7 MPa, 249.5 MJ m^?3, respectively. Furthermore, the feasibility and mechanism of polymer strengthening and toughening by inorganic rigid nanoparticles is explored from the aspects of crystallinity and micromorphology.     

Computational Fluid Dynamics Study on a Top-Blown Smelting Process with Lance Failure in an Isa Furnace

JOM - The Isa/Ausmelt smelting technology with a top submerged lance (TSL) has been extensively used in copper smelting processes. However, the TSL is extremely vulnerable to damage and failure...     

In situ polymerization of flame retardant modification polyamide 6,6 with 2-carboxy ethyl (phenyl) phosphinic acid

A novel halogen-free flame retardant copolyamide 6,6 (FR-PA66) was prepared successfully by in situ polymerizing with adipic acid hexamethylene salt and 2-carboxy ethyl (phenyl) phosphinic acid (CEPPA). The elemental composition and chemical structure of FR-PA66 were characterized by energy dispersive X-ray spectroscopy, Fourier transform infrared spectrometer and ¹³C Nuclear magnetic resonance spectrometer. The flame retardancy, thermal stability, and morphology of char residues were also investigated by the limiting oxygen index (LOI), UL 94 test, thermogravimetric analysis, and scanning electron microscopy. The results showed that FR-PA66 samples had much better flame retardancy and char formation ability than pure PA66 after the flame retardant modification. The LOI values were increased from 24.0 to 28.0% by adding 6 wt % of CEPPA and all FR-PA66 samples were rated as V-0 rating in UL-94 test. Furthermore, the thermal stability analysis indicated that in situ polymerization with CEPPA effectively decreased the initial decomposition temperature and increased the amount of char residue. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 137, 48687.     

户内热转印粉末涂料用混合型聚酯树脂的合成研究

通过分析热转印性能的影响因素合成了不同结构的聚酯树脂，研究了树脂酸值对热转印性能的影响，同时研究了部分单体对聚酯树脂热转印性能的影响。采用 DSC热分析法研究了固化促进剂对粉末涂料固化行为的影响，结果表明：选择合适的固化促进剂对涂层转印性能的提高有至关重要的作用。     

炼油达标污水回用处理试验研究

采用曝气生物滤池、多介质过滤、超滤、反渗透工艺,对炼油达标外排污水进行回用处理中试试验。结果表明,曝气生物滤池对油、COD和浊度去除效果良好,超滤、反渗透膜化学清洗周期达到 2个月以上,脱盐率稳定在98％以上,产水品质达到回用要求。     

管道风险管理方法研究

按照管道风险管理的流程分别对管道风险评价、风险控制和决策支持、效能测试和响应进行了论述。针对目前国内管道行业的情况，提出了进行管道风险评价的有效方法及维护措施。着重介绍了国外管道风险可接受标准的情况，作为国内制定管道风险评价标准的参考。     

智能动态网络资源分配系统

通过对解决GSM移动通信网络热点区域话务拥塞问题的研究，提出了利用可控功分器实现智能动态网络资源的分配，解决不同种类的话务拥塞问题，并着重讨论了该系统目前的成功运用及前景。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported