Synthesis of ZSM‐5 Films and Monoliths with Bimodal Micro/Mesoscopic Structures

A route to synthesize ZSM‐5 crystals with a bimodal micro/mesoscopic pore system has been developed in this study; the successful incorporation of the mesopores within the ZSM‐5 structure was performed using tetrapropylammonium hydroxide (TPAOH)‐impregnated mesoporous materials containing carbon nanotubes in the pores, which were encapsulated in the ZSM‐5 crystals during a solid rearrangement process within the framework. Such mesoporous ZSM‐5 zeolites can be readily obtained as powders, thin films, or monoliths.     

Passive alignment method of polymer PLC devices by using a hot embossing technique

A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of /spl plusmn/0.5 /spl mu/m. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices.     

Hydrogen annealing effect on DC and low-frequency noise characteristics in CMOS FinFETs

The hydrogen annealing process has been used to improve surface roughness of the Si-fin in CMOS FinFETs for the first time. Hydrogen annealing was performed after Si-fin etch and before gate oxidation. As a result, increased saturation current with a lowered threshold voltage and a decreased low-frequency noise level over the entire range of drain current have been attained. The low-frequency noise characteristics indicate that the oxide trap density is reduced by a factor of 3 due to annealing. These results suggest that hydrogen annealing is very effective for improving device performance and for attaining a high-quality surface of the etched Si-fin.     

Inside Front Cover: The Elastic Properties and Plastic Behavior of Two‐Dimensional Polymer Structures Fabricated by Laser Interference Lithography (Adv. Funct. Mater. 10/2006)

The probing of the micromechanical properties within a two‐dimensional polymer structure with sixfold symmetry fabricated via interference lithography reveals a nonuniform spatial distribution in the elastic modulus “imprinted” with an interference pattern in work reported by Tsukruk, Thomas, and co‐workers on p. 1324. The image prepared by M. Lemieux and T. Gorishnyy shows how the interference pattern is formed by three laser beams and is transferred to the solid polymer structure. The elastic and plastic properties within a two‐dimensional polymer (SU8) structure with sixfold symmetry fabricated via interference lithography are presented. There is a nonuniform spatial distribution in the elastic modulus, with a higher elastic modulus obtained for nodes (brightest regions in the laser interference pattern) and a lower elastic modulus for beams (darkest regions in the laser interference pattern) of the photopatterned films. We suggest that such a nonuniformity and unusual plastic behavior are related to the variable material properties “imprinted” by the interference pattern.     

基于ASTER数据的地物光谱比辐射率的反演研究

比辐射率光谱表征着一个物体的内部物理和化学特征,是定量化遥感的一个关键参数.本文利用ASTER数据的第10至14波段,根据其数据的特点,基于温度比辐射率分离算法的思想,提出了将比辐射率标准化法(Normalize Emissivity Method,NEM)、经验公式、比值法(Ratio Method)这几个模块结合起来,在迭代的基础上计算出比辐射率的新算法.本文简要分析了模型误差的主要来源,并且把本文的算法与简化的ASTER的TES算法进行了比较.分析表明本文的算法是可行、有效的,而且该算法简单,易于实现,在能够保证精度的情况下运算速度快;同时也说明ASTER遥感数据用于反演地物的比辐射率可以得到比较理想的结果,具有良好的应用前景.     

InGaN microring light-emitting diodes

The fabrication and performance of an InGaN light-emitting diode (LED) array based on a microring device geometry is reported. This design has been adopted in order to increase the surface area for light extraction and to minimize losses due to internal reflections and reabsorption. Electrical characteristics of these devices are similar to those of a conventional large-area LED, while the directed light extraction proves to be superior. In fact, these devices are found to be more efficient when operated at higher currents. This may be attributed to improved heat sinking due to the large surface area to volume ratio. The potential applications of these devices are also discussed.     

KOAc/NaY催化合成邻甲基苯甲醚

以KOA c/NaY为催化剂,在连续流动固定床反应器内,邻甲基苯酚(OC)与碳酸二甲酯(DMC)经过气固相催化反应合成了邻甲基苯甲醚(OM)。考察了内、外扩散对KOA c/NaY催化剂活性的影响。实验结果表明,当气流线速度大于30cm/m in时可消除外扩散对合成反应的影响;当KOA c/NaY催化剂的平均粒径在0.30~0.75mm(20~80目的颗粒)时能消除内扩散对合成反应的影响。在消除内、外扩散效应后,还考察了反应温度、原料配比、空速对合成反应的影响,得到较佳的反应条件:催化剂5mL,反应温度548K,反应压力0.6M Pa,空速0.6h-1,n(DMC)∶n(OC)=1,在线评价时间7h。在此条件下,OC的转化率高达85.7%,OM的选择性大于99%。     

Simultaneous amplification by Er ions and SRS in an Er-doped germano-silica fiber

A flat signal gain over in the entire C- and L-bands by erbium (Er) ions' radiative transition and stimulated Raman scattering in an Er-doped germano-silica fiber can be obtained if proper values of the concentration of Er and background loss in a fiber core are obtained during the fiber fabrication process. The optimized conditions for the flat C- and L-band gain are analyzed as functions of Er concentrations. Even for a low-gain value provided by a germano-silica core fiber with a low Er concentration and an optimum fiber length, a relatively low pump is required to obtain the flat gain band.     

射频电缆组件组装工艺浅谈

近年来国内外射频电缆组件的发展很快,射频电缆组件的性能不断提高,对射频电缆组件组装工艺也提出了更高的要求.射频电缆组件组装过程多是手工操作,产品的一致性及性能很难控制,要求有良好的工艺保证,为此介绍了射频电缆组件组装工艺,包括电缆的裁剪及剥皮、内导体的连接、外导体的连接和电气性能的测试;探讨了在组装过程中应注意的问题,以及针对内导体焊接易出现虚焊问题进行研究.     

灰色关联分析法在油气管道半定量风险评价中的应用

肯特(W．kent Muhlbauer)管道风险评价法是一种半定量风险评价法,但是该方法在我国还处在起步阶段,其理论基础和应用技术都很不完善。为了有效处理评分中存在的主观性和不确定性因素,已经把模糊综合评判法引入到管道风险评价中。但是,传统的相对风险值计算还不够准确,为此介绍了灰色关联分析在油气管道半定量风险评价中的应用。通过对影响管道风险的评价指标(因素)体系的综合分析,确定了灰色综合评价的层次结构模型。构建了由第三方破坏指数、腐蚀指数、设计指数、错误指数、介质危险指数5大指标体系构成的管道系统风险综合评价指标体系,并采用层次分析与专家打分相结合的方法计算权重。在油气管道半定量风险评价中应用灰色关联分析法,可以使评价结果更准确。