Deposition and Properties of Superconducting MgB2 Thin Films

The recently discovered superconductor MgB₂ with T _c at 39 K has great potential in superconducting electronics. In this paper, we review the deposition techniques used for MgB₂ thin films in the light of a thermodynamic study of the Mg-B system with the calculation of phase diagrams (CALPHAD) modeling technique. This thermodynamic study identifies a growth window in the pressure–temperature phase diagram, in which the magnesium pressure is very high for likely in situ growth temperatures. A Hybrid Physical–Chemical Vapor Deposition (HPCVD) technique that successfully achieves such a high Mg pressure is shown to produce in situ epitaxial MgB₂ thin films with bulk superconducting properties.     

基于缺陷评估的海底管道设计研究

针对海底管道的裂纹和腐蚀两种主要缺陷,研究了基于缺陷评估的海底管道设计方法,建立了基于缺陷评估的海底管道设计步骤。     

Closed-loop optimal control-enabled piezoelectric microforce sensors

This paper presents a closed-loop optimally controlled force-sensing technology with applications in both micromanipulation and microassembly. The microforce-sensing technology in this paper is based on a cantilevered composite beam structure with embedded piezoelectric polyvinylidene fluoride (PVDF) actuating and sensing layers. In this type of sensor, the application of an external load causes deformation within the PVDF sensing layer. This generates a signal that is fed through a linear quadratic regulator (LQR) optimal servoed controller to the PVDF actuating layer. This in turn generates a balancing force to counteract the externally applied load. As a result, a closed feedback loop is formed, which causes the tip of this highly sensitive sensor to remain in its equilibrium position, even in the presence of dynamically applied external loads. The sensor's stiffness is virtually improved as a result of the equilibrium position whenever the control loop is active, thereby enabling accurate motion control of the sensor tip for fine micromanipulation and microassembly. Furthermore, the applied force can be determined in real time through measurement of the balance force.     

软件容错/高可用性技术在SIP开发中的应用

软件容错/高可用性(FT/HA)技术是目前通信协议软件开发中一个十分重要的研究课题,该课题的研究对于提高通信的可靠性具有十分重要的意义.文章首先描述了FT/HA技术的基本原理,然后提出了一种基于温备份的FT/HA解决方案,最后,重点探讨了该解决方案在会话发起协议(SIP)开发中的应用.     

纳米涂层的研究现状与展望

简述了纳米表面涂层制备工艺的研究现状，分析了气相沉积、热喷涂、电刷镀、化学镀和电沉积等不同工艺在制备纳米表面层中的应用情况。介绍了纳米涂层在超硬耐磨、耐腐蚀、耐高温热稳定性等方面研究的新进展，并对纳米涂层的应用范围和领域作了展望。     

供应链环境下的性能评价系统研究

在竞争全球化的趋势下，供应链管理越来越受到企业重视，供应链性能评价系统(supply Chain Performance Mea-surement System,SCPMS)是供应链管理的关键组成部分，然而企业却不愿意或没有能力建立有效的性能评价系统。总结了供应链性能评价的定义、发展过程及难点，在此基础上提供了一套供应链性能评价的方法，为企业快速建立集成供应链性能评价系统提供借鉴。     

Calculation of Ultraslow Dielectric Relaxation of Doped BaTiO3 Ceramics

Using a linear voltage ramp method, ultraslow dielectric relaxation processes of La-doped BaTiO₃ boundary layer (BL) capacitors are measured at room temperature. For the electric polarization model of a double-layer dielectric, a procedure to calculate the electrical parameters of grain and grain boundary has been developed. Calculated results suggest that there is a shell on the surface of the grain. TEM images of the BL capacitor also show a lot of microregions with minor structural modifications. Relaxation times are estimated from the equivalent circuit and are in agreement with fitted results.     

基于VXI总线的机载火控系统自动测试仪的设计

目的　对作战飞机火控系统的故障检测 ,传统的方法是使用多种检测仪器对机载火控设备进行性能检查 ,不仅技术含量低 ,也给飞机转场后技术阵地的转移带来不便 ,不能满足现代战争的需要 ,为提高战机的作战效能和快速反应的能力 ,研制了机载火控系统自动测试仪 .方法　采用 VXI总线技术、合理的硬件配置和在 Lab Windows/CVI环境下的软件模块化设计方案 .结果　在实际应用中取得了良好效果 ,为技术人员进行机载火控系统的性能及故障检测提供了便利 .结论　该测试仪具有测试结果准确 ,自动化程度高 ,工作稳定可靠 ,操作简便 ,易于转移和维护等优点 ,并具有较高的抗干扰能力 ,不仅适用与内场 ,还可用于在外场对机载火控系统进行原位检测     

纳米β-Ni(OH)2与球型Ni(OH)2的热性能比较研究

用配位沉淀法合成出纳米级Ni（OH）2，并对其进行XRD，TEM，DSC分析，分析结果表明，所得纳米β-Ni（OH）2为可用作电极材料的β-Ni（OH）2，粒径为30－40nm，且热分解温度比普通球镍低10℃左右，摩尔分解热比普通球镍低4－7kJ，从理论上分析了产生此现象的原因。     

分割电极片状压电致动器——(二)位移特性及狭缝宽度对其影响的实验研究

研究了悬臂梁式分割电极片状压电致动器的位移特性。理论分析表明，分割电极狭缝宽度会减小致动器自由端的位移输出，但当狭缝宽度小于致动器电极宽度的１０％时，可忽略狭缝宽度的影响。致动器端部位移的测试结果大于理论计算值。与现有磁头悬浮臂尺寸相近的致动器，在２０Ｖ～５０Ｖ的电压驱动下均可获得１μｍ～２μｍ的致动位移。对９８５０道／厘米的密度磁盘，该位移能覆盖至少一个磁道宽度，满足磁头定位两级伺服系统对第二级致动器位移的基本要求。