新型氯取代含杂萘联苯结构可溶性聚芳酰胺的合成、表征和性能

以类双酚单体4-(3-氯-4-羟基-苯基)-2H-二氮杂萘-1-酮(DHPZ-OC)和对氯苯腈为原料进行亲核取代反应合成二腈化合物4-[3-氯-4-(4-氰基苯氧基)苯基]-2-(4-氰基苯基)二氮杂萘-1-酮(),然后在碱性(KOH)条件下进行水解制得了一种新型的含氯取代杂萘联苯结构的芳香二酸,4-[3-氯-4-(4-羧基苯氧基)苯基]-2-(4-羧基苯基)二氮杂萘-1-酮().用新二酸与各种芳香二胺进行直接缩合聚合制得了一系列新型氯取代含杂萘联苯结构的聚芳酰胺,特性粘度可达1.23dL/g.用FTIR和¹HNMR研究了新型二酸单体及聚合物的结构.该类聚芳酰胺均可溶解于NMP,DMAc和DMSO等极性有机溶剂中,并且可浇铸成透明韧性膜,其玻璃化转变温度在291～332℃之间,10%的热失重温度在460℃以上.     

苯取代杂萘联苯型聚芳酰胺的合成与表征及性能

合成了一种新型苯基取代芳香二胺双 (4 胺基苯基 ) 4 (3 苯基 4 苯氧基 ) 2 ,3 二氮杂萘 1 酮 (2 (4 aminophenyl) 4 (3 pheny 4 phenoxy) 2 ,3 phthalazinone 1) (1,DAPPP) .采用Yamazaki体系 ,二胺单体 1能与各种商品芳香二酸进行溶液亲核缩聚反应 ,制得了一类新型苯基取代聚芳酰胺 ,其特性粘度为 0 .6 3～ 0 .75dL·g- 1 ;以MS、FT IR、1 H NMR等分析手段研究了新型二胺单体及其聚合物的结构 ;利用DSC、TGA研究了聚合物的耐热性能 ,结果表明新型聚芳酰胺具有高的玻璃化温度 (32 0 .9～ 32 9.9℃ ) ,氮气氛中 10 %热失重温度在40 5 .3℃以上 ,聚合物在二甲基乙酰胺、1 甲基吡咯烷酮和间甲酚等极性有机溶剂中可溶解并浇注得到韧性薄膜     

新型可溶性聚芳酰胺及其共聚物的合成与性能研究

采用新型二胺 1,2 二氢 2 (4 氨基苯基 ) 4 [4 (4 氨基苯氧基 ) 苯基 ] 二氮杂萘 1 酮与对苯二甲酸、间苯二甲酸、萘二酸进行均聚或共聚 ,所得聚芳酰胺的Tg 均高于 30 0℃ ,且易溶于非质子极性溶剂中 ,聚合物的特性粘数为 1 2 6～ 1 5 1dL g(2 5℃ ,NMP) ,拉伸强度为 6 2～ 89MPa ,断裂伸长率为 5 %～ 9% ,拉伸模量为 2 2～ 2 9GPa ,电阻系数为 10 1 4 ～ 10 1 6     

一类新型杂环聚芳酰胺的合成与性能研究

采用二氮杂萘类双酚 4 (4 羟基苯基 ) 2 ,3 二氮杂萘 1 酮 (DHPZ)与对氯苯腈反应制得二腈化合物 ,进一步水解为二酸 .以此新型二酸与不同二胺聚合制得的聚芳酰胺均具有较高的耐热性能 ,其Tg 在 2 91～318℃ ,且易溶于极性非质子溶剂中 .聚合物的特性粘数为 1 17～ 1 5 0dL g(2 5℃ ,0 5 %inNMP) ,对所得聚酰胺进行性能研究 ,其拉伸强度为 71～ 86MPa ,断裂伸长率为 8%～ 13% ,拉伸模量为 0 86～ 1 0 2GPa ,电阻系数数量级为 10 1 4～ 10     

含4-苯基二氮杂萘酮结构共聚芳酯的合成及性能

以4-[4-(4羧基苯氧基)苯基]-2-(4-羧基苯基)二氮杂萘-1-酮(DHPZ-DA)、4,4'-二羧基二苯醚(DAPE)和2,2'-二(4-羟基苯基)丙烷(PBA)为原料,采用溶液缩聚法,合成了一系列聚芳酯,其数均分子量在1.2×104～1.7×104之间.通过FTIR和1H-NMR对聚芳酯结构进行了表征.该系列...     

含二氮杂萘酮结构磺化聚酰亚胺共聚物的合成及其膜性能研究

将磺化二胺单体4,4′-二(4-氨基苯氧基)联苯-3,3′-二磺酸(BAPBDS),含二氮杂萘酮结构的二胺1,2-二氢-2-(4-氨基苯基)-4-[4-(4-氨基苯氧基)-苯基]-二氮杂萘-1-酮(DHPZDA)和1,4,5,8-萘四甲酸二酐(NTDA)进行缩合聚合反应,通过改变磺化二胺单体BAPBDS的含量,合成了一系列不同磺化度的聚酰亚胺(SPIs).采用FT-IR,1H-NMR表征了聚合物的结构,热重分析仪(TGA)研究了聚合物的耐热稳定性.以间甲酚为溶剂,通过溶液浇铸法成膜研究了该系列聚合物膜的性能.结果表明,与其它磺化聚酰亚胺相比,该系列磺化聚酰亚胺的溶解性以及在高温下(80℃)水解稳定性有较大提高.     

主链含芳基均三嗪环结构杂萘联苯共聚芳醚腈的结构与性能

以含均三嗪环结构的双氟单体2,4-二(4-氟苯基)-6-苯基-1,3,5-三嗪与商用2,6-二氟苯腈为共聚单体,与具有扭曲、非共平面结构的4-(4-羟基-苯基)-2H-二氮杂萘-1-酮(DHPZ)经溶液亲核取代逐步聚合,合成了一系列主链含三芳基均三嗪环结构和二氮杂萘酮结构线性共聚芳醚腈(PPENPs),其特性黏数为0.65～1.02 dL/g;采用FTIR和1H-NMR证明了聚合物结构与设计一致.PPENPs的DSC曲线中只有一个玻璃化转变温度,在301～ 337℃之间,且随着分子链中三嗪环结构的增加而升高.N2气氛5％热失重温度在510℃以上,800℃残碳率大于60％.当共聚物中三嗪环含量低于50％时,在室温下可溶于N-甲基吡咯烷酮(NMP)、N,N-二甲基乙酰胺(DMAc)和氯仿(CHCl3)等极性非质子溶剂中.其薄膜的拉伸强度为72 ～ 84 MPa,断裂伸长率为7.6％ ～11％,且随着分子链中三嗪环结构的增加而降低.     

含二苯甲烷结构四元共缩聚杂萘聚芳酰胺的合成与性能

采用自制二胺1,2-二氢-2-(4-氨基苯基)-4-[4-(4-氨基苯氧基)-苯基]-二氮杂萘-1-酮、商品二胺4,4′-二氨基二苯甲烷和对苯二胺与对苯二甲酰氯进行低温溶液缩聚反应,改变三种二胺的比例,得到了一系列共聚酰胺树脂,其特性粘数为1·24~2·32dL/g,用FT-IR、1H-NMR手段研究了聚合物的结构;利用DSC和TGA研究了聚合物的耐热性能,结果表明,该类聚合物具有较高玻璃转化温度(301℃以上);氮气气氛中5%热失重温度在438℃以上;用一定比例的二胺制得的聚合物分别能溶于N-甲基吡咯烷酮、N,N-二甲基乙酰胺等非质子极性溶剂中并浇注得到韧性薄膜.     

用于燃料电池质子交换膜的含萘及氮杂环结构的新型磺化聚酰亚胺的合成及性能

将自制的4,4'-二氨基二苯醚-2,2'-二磺酸基(ODADS)、 含氮杂环芳香二胺1,2-二氢-2-(4-氨基苯基)-4-[4-(4-氨基苯氧基)-苯基]-二氮杂萘-1-酮(DHPZ-DA)和1,4,5,8-萘四甲酸二酐(NTDA)进行直接缩合聚合反应, 通过改变磺化二胺单体的含量来改变聚合物的磺化度, 成功地合成了一系列高分子量的不同磺化度的六元环聚酰亚胺(SPIs), 其特性粘度在0.55-1.47 dL/g. 采用FTIR和 1H NMR技术表征了聚合物的结构. 研究了经溶液浇铸成磺化聚合物膜的理化性质. 结果表明, 随着聚合物磺化度的增大, 膜的含水率和离子交换能力增大, 尺寸稳定性、 对水的稳定性以及抗氧化性降低.     

氮杂环单体的分子结构对共聚芳醚酮酮性能的影响

合成4,4'-二苯基-7,7'-双(2,2',3,3')二氮杂萘(1,1')酮(7,7-DBD)与4,4'-二苯基-6,7'-双(2,2',3,3')二氮杂萘(1,1')酮(6,7-DBD)2种杂环单体,探究2种单体和4-(4-羟基苯基)-2,3-二氮杂萘酮与1,4-二(4-氟苯甲酰基)苯的共聚行为,得到2种侧苯基位置不同的氮杂环聚芳醚酮酮P-CDs与P-TDs.两者的特性黏度介于0.5～1.1 dL/g,P-CDs的特性黏度更高,制备更容易.P-CDs的玻璃化转变温度介于254～296℃,250℃的储能模量保持率高达67%,均高于相同共聚组成的P-TDs.2种聚合物可溶于N-甲基吡咯烷酮与1,1,2,2-四氯乙烷等有机溶剂中;拉伸模量介于1.56～1.78 GPa,拉伸强度介于50.1～102.9 MPa,断裂伸长率介于11.0%～18.1%,绝缘性基本一致.P-CDs的耐热性、溶解性、机械性能均优于P-TDs.故调整主链上侧基分布方式可以明显改变聚合物的耐热性、机械性能、溶解性和可制备性,为制备耐热等级更高且可溶解的高性能聚合物提供参考.     

含苯侧基杂环聚芳酰胺酰亚胺的合成与性能

聚酰胺酰亚胺 (ＰＡＩ)是一类已商业化的耐热高分子材料 ,具有与聚酰亚胺类似的耐热性能 ,但是改善了聚酰亚胺的溶解性、可加工性能 ,因此进一步开发综合性能优异、加工性能好的聚芳酰胺酰亚胺近年来成为研究热点之一[1～ 3 ] .ＰＡＩ的经典制备方法为 :( 1 )偏苯三酸酰氯与芳香二胺的聚合反应 ;( 2 )含酰亚胺环的偏苯酸和异氰酸酯反应 .近年来聚酰胺酰亚胺又开发了以下途径制备 :( 1 )含亚胺环的二酸与芳香二胺一步缩聚反应 ;( 2 )含亚胺环的芳香二卤代物与二胺的催化羰基化反应等[4～ 6] .本研究组近期合成了一种新型芳香二胺 ,并合成了耐…     

Synthesis and properties of organosoluble poly(amide‐imide)s with propeller‐shaped 1,1,1‐triphenylethane units in the main chain

A dicarboxylic acid {1,1‐bis[4‐(4‐trimellitimidophenoxy)phenyl]‐1‐phenylethane ( II )} bearing two performed imide rings was prepared from the condensation of 1,1‐bis[4‐(4‐aminophenoxy)phenyl]‐1‐phenylethane and trimellitic anhydride in a 1/2 molar ratio. A novel family of poly(amide‐imide)s with inherent viscosities of 0.83–1.51 dL/g was prepared by triphenyl phosphite‐activated polycondensation from the diimide‐diacid II with various aromatic diamines in a medium consisting of N‐methyl‐2‐pyrrolidinone (NMP), pyridine, and calcium chloride. Because the 1,1,1‐triphenylethane group of II was unsymmetrical, most of the resulting polymers showed an amorphous nature and were readily soluble in polar solvents such as NMP and N,N‐dimethylacetamide. All the soluble poly(amide‐imide)s afforded tough, transparent, and flexible films, which had tensile strengths ranging from 88 to 102 MPa, elongations at break from 6 to 11%, and initial moduli from 2.23 to 2.71 GPa. The synthesized poly(amide‐imide)s possessed glass‐transition temperatures from 250 to 287 °C. The poly(amide‐imide)s exhibited excellent thermal stabilities and had 10% weight losses from 501 to 534 °C under a nitrogen atmosphere. A comparative study of some corresponding poly(amide‐imide)s is also presented. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 775–787, 2001     

Processable heat-resistant polymers. XI. Synthesis and characterization of unsaturated polyamideimides

Polycondensation of the diacid chloride of 2-(3-carboxy vinyl)phenyl-1,3-dioxoisoindoline-5-carboxylic acid with m-phenylenediamine and the diacid chloride of 2-(4-carboxy phenyl)-1,3-dioxoisoindoline-5-carboxylic acid with 1,5-bis(3-aminophenyl)1,4-pentadien-3-one was carried out in polar solvents to produce new unsaturated polyamide–imides. The solution and the thermal, electrical, and a few other properties of the polymers were studies. The polymers were soluble in highly polar solvents. The solubility parameter of the polymers was calculated from the Small's group contribution. The polymers were fairly thermostable and underwent crosslinking creaction when heated, preferably in the presence of a suitable catalyst. The crosslinked polymers were in soluble even in highly polar solvents and possessed higher thermal stability. The swelling behavior of the polymers was studied and the molecular weight between two consecutive crosslinks was determined. X-ray diffraction and the dielectric properties of the polymers and their crosslinked products were also studied.     

New poly(amide-lmide)s syntheses. XV. Preparation and properties of poly(amide-imide)s derived from 9, 9-bis[4-(4-aminophenoxy) phenyl]fluorene and various bis(trimellitimide)s

Fifteen bis(phenoxy) fluorene-containing poly(amide-imide)s III were synthesized by the direct polycondensation of 9,9-bis[4-(4-aminophenoxy)phenyl]fluorene (BAPPF) with var-ious aromatic bis(trimellitimide)s II in N-methyl-2-pyrrolidone (NMP) using triphenyl phosphite and pyridine as condensing agents. Poly(amide-imide)s III having inherent vis-cosities up to 1.45 dL/g were obtained in quantitative yields. Most of the resulting polymers showed an amorphous nature and were readily soluble in polar solvents such as NMP and N,N-dimethylacetamide. All the soluble poly(amide-imide)s afforded transparent, flexible, and tough films. The glass transition temperatures of these polymers were in the range of 263–315°C and the 10% weight loss temperatures were above 510°C in nitrogen. Some properties of poly(amide-imide)s III were compared with those of the corresponding isomeric poly(amide-imide)s III ′ prepared from 9,9-[4-(4-trimellitimidophenoxy)phenyl]fluorene and various aromatic diamines. © 1995 John Wiley & Sons, Inc.     

Preparation and characterization of aromatic polyamides based on a bis(ether‐carboxylic acid) or a dietheramine extended from 1,1‐bis(4‐hydroxyphenyl)‐1‐phenylethane

Thermoplastic and organic‐soluble aromatic polyamides containing both bulky triphenylethane units and flexible ether linkages were prepared directly from 1,1‐bis[4‐(4‐carboxyphenoxy)phenyl]‐1‐phenylethane ( III ) with various aromatic diamines or from 1,1‐bis[4‐(4‐aminophenoxy)phenyl]‐1‐phenylethane ( V ) with various aromatic dicarboxylic diacids via triphenyl phosphite and pyridine. These polyamides had inherent viscosities ranging from 0.71 to 1.77 dL/g. All the polymers easily were dissolved in aprotic polar solvents such as N‐methyl‐2‐pyrrolidone and N,N‐dimethylacetamide, and some even could be dissolved in less polar solvents such as tetrahydrofuran. The flexible and tough films cast from the polymer solutions possessed tensile strengths of 89 to 104 MPa. The polyamides were thermally stable up to 460°C in air or nitrogen. Glass‐transition temperatures of these polyamides were observed in a range of 179 to 268°C via differential scanning calorimetry or thermomechanical analysis. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 247–260, 2000     

Synthesis and characterization of poly(aryl amide imide)s derived from diphenyltrimellitic anhydride

The synthesis and characterization of a series of novel poly(aryl amide imide)s based on diphenyltrimellitic anhydride are described. The poly(aryl amide imide)s, having inherent viscosities of 0.39–1.43 dL/g in N-methyl-2-pyrrolidinone at 30°C, were prepared by polymerization with aromatic diamines in N,N-dimethylacetamide and subsequent chemical imidization. All the polymers were amorphous, readily soluble in aprotic polar solvents such as DMAC, NMP, dimethylsulfoxide, N,N-dimethylformamide, and m-cresol, and could be cast to form flexible and tough films. The glass transition temperatures were in the range of 284–366°C, and the temperatures for 5% weight loss in nitrogen were above 468°C. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 4541–4545, 1999