平板型双毛细芯蒸发器LHP的实验研究

实验设计了平板型双毛细芯蒸发器环路热管系统,并针对所设计的系统搭建了实验平台,对其进行启动和变工况特性研究,考虑不同因素如充灌率、重力倾角特对系统性能的影响。实验结果显示:平板型LHP的双毛细芯蒸发器可以提高系统的热传输能力,减小侧壁导热对补偿腔的影响,降低系统的运行温度,改善和提高系统的运行性能。     

重力辅助平板型环路热管实验研究

研制了一套以不锈钢丝网为毛细芯的平板式蒸发器、风冷式冷凝器,以甲醇为工作工质的环路热管,并着重研究了其在不同热负荷条件下启动特性以及变工况条件下运行特征。实验结果表明,平板式LHP可以在1～10W/cm2热流密度范围内顺利启动,并有良好的适应变热负荷能力,在改变工况的时候系统一般能在3min内重新达到新平衡状态。系统在18～48W热负荷条件下出现波幅和周期不等的温度波动现象。实验系统的热阻在0.29～3.2℃/W之间,热阻与热负荷、系统倾角以及工质充灌量有关,并重点研究了倾角以及充灌量对系统启动及其变工况运行的影响。     

平板型环路热管温度波动现象研究

环路热管(loop heat pipe,LHP)是一种靠蒸发器内毛细芯产生毛细力驱动回路运行,利用工质相变来传递热量的高效传热装置.研制了一套小型平板式蒸发器、风冷式冷凝器的环路热管(mLHP),mLHP的毛细芯为500目不锈钢丝网,工质为丙酮和甲醇.蒸发器、冷凝器以及所有管路均由紫铜制成.着重研究了平板型mLHP在不同热负荷条件下的温度波动特性.实验结果表明,平板式mLHP在某些热流密度区间容易发生温度波动;同时,重点研究了工质对mLHP系统温度波动的影响,并给出相应的合理解释.     

双层毛细芯对环路热管传热性能的实验分析

环路热管作为一种高效的相变传热装置,其性能与位于蒸发器和储液槽之间的毛细芯结构密切相关。为了更深入研究双层毛细芯对环路热管传热性能的影响,利用不同颗粒直径铜粉制备双层毛细芯,在毛细芯总厚度为5 mm的条件下,通过调整大粒径和小粒径层的相对厚度来改变毛细芯厚度比,对平板型蒸发器环路热管启动和变工况运行进行实验测试。实验结果表明:在同一工况下,不同厚度比的双层毛细芯启动特性存在显著差异,启动过程中出现小粒径层蒸发效率低引起的温度过冲和环路热管中气液两相流变化导致的温度振荡;同时存在一个较优的双铜层毛细芯厚度比,大粒径(180～280μm)铜层厚度为3 mm可提高蒸发效率,小粒径(56～71μm)铜层厚度为2 mm可提供足够毛细抽吸力保证环路热管稳定运行。搭载该厚度毛细芯的环路热管不仅启动速度快(125 s),而且总热阻和蒸发器壁面温度均最低,最大加热功率达到120 W(21.10 W/cm~2),对应热阻为0.17 K/W。     

氨工质平板式环路热管的传热性能研究

为了解决平板式蒸发器环路热管面对高集成电子元器件在较长传热距离下的散热能力不足等问题,本文采用更大面积的毛细芯和蒸发器,研制了一个传热距离达到1.6m的氨-不锈钢环路热管系统并进行了大量实验.实验过程中,加热壁面温度控制在70℃以下.实验结果表明,在热沉温度为-10℃的情况下,该环路热管可以在2.5W到180 W的热负荷范围内稳定运行,相应的热流密度是0.15 W/cm2和10.8W/cm2.蒸发器热阻的最小值为0.096℃/W,系统热阻的最小值为0.252℃/W.系统存在变热导率和定热导率两种工作特性,实验过程中没有观察到明显的温度过冲和温度波动现象.在启动测试和变热负荷测试中,系统均能够快速响应,展现出优良的可靠性.研究表明,与一般的平板式蒸发器环路热管相比,该系统更好地兼顾了传热距离和传热能力,拓展了平板式蒸发器的应用场景.     

一种振荡热管换热器热性能的研究

设计了一种振荡热管换热器,将其内插于太阳能集热器中,应用于蓄能型内插热管式太阳能热水系统,根据太阳辐射强度切换工作模型,可实现对太阳能的分季节最大化利用。搭建了蓄能型振荡热管换热器性能试验台,对充灌工质分别为R134a、乙醇/水、丙酮/水的振荡热管换热器在不同加热功率下启动时间、水侧温升和热阻等性能进行研究。结果表明:无论振荡热管换热器内充灌哪种工质,热管的启动时间都随着加热功率的增大而减小;相似环境温度下,充灌不同工质的振荡热管换热器的热阻都随着加热功率的增大而减小;在相同的环境温度下,充灌不同工质的振荡热管换热器的循环水温都会随着加热功率的增大而升高,充灌R134a的振荡热管换热器的循环水温增幅最大。     

低温环路热管综述

环路热管是以多孔毛细芯抽吸力为动力的相变传热设备,可根据实际应用改变结构形式,能在远距离传热的同时保持良好的均温性,并且可在微重力环境下运行。环路热管工作温区较广,按照其工作温区一般可分为高温环路热管(350 K以上)、常温环路热管(200～350 K)和低温环路热管(200 K以下)。为了满足深空探测的需要,低温环路热管广泛应用于航天设备温控系统中并表现出优异的性能。按照孔隙特征和结构形式将用于环路热管的毛细芯分为四种,简要阐述每种毛细芯制备和特点;综合分析了近年来低温环路热管技术主要理论和实验研究成果,将目前低温环路热管常见的工作温区分成五个部分,分析影响低温环路热管传热性能的因素,包括工质充装量、反重力高度、次蒸发器功率等。最后,提出优化措施以满足未来深空以及地面应用的需求。     

不同加热方式下环路热管蒸发器可视化研究

针对环路热管内部工质相变及流动换热问题,设计了环路热管蒸发器中心通道可视化实验平台,研究了不同加热方式对热管内工质状态和传热特性的影响。结果表明：加热方式直接影响热管10W启动过程,双面加热启动速度最快。相同热载荷时,不同加热方式下环路热管热阻及蒸发器中心通道内液面高度和成核情况存在差异。10W - 40W热载荷时,随着热载荷的增大,三种加热方式的传热热阻均在减小。40W-50W热载荷时,顶部加热方式下的热管性能出现恶化,底部加热传热性能出现停滞,仅双面加热性能稳定并有提高趋势。随着热负荷的增加,蒸发器中心通道内气液界面升高、气泡的产生变得更加剧烈,蒸发器通过吸液芯向储液器的漏热量增加,进而影响环路热管的性能。     

不同加热功率下充液率对无芯环路热管性能的影响

设计了以铝为管材、丙酮为传热工质的无芯环路热管。其蒸发段采用加热带加热,冷凝段用风冷降温。热管依靠蒸发压头使工质循环,并依靠重力作用,使冷凝液回流到蒸发段。搭建试验台并研究了不同加热功率下充液率对无芯环路热管的传热温差、传热量、热效率、热阻和当量导热系数的影响。结果表明:加热功率为150.00 W、充液率为30%时,无芯环路热管的均温性最好;传热温差和热阻均最小,分别为6.75℃、0.045 K/W。传热量132.00 W、热效率0.88、当量导热系数168 125 W/(m·K),均达到最大值。所以,该无芯环路热管在本实验研究范围内的最佳工作条件为加热功率150.00 W、充液率30%。     

纳米悬浮液热虹吸管的传热性能试验研究

在相同的试验条件下,对比研究了纳米CuO-去离子水(DW)悬浮液重力热管与普通DW重力热管的启动性和等温性,研究了纳米工质热管的充液率和颗粒浓度对热管工作特性的影响,对纳米工质热管的强化传热机理进行了初步探讨。研究表明:纳米工质热管比普通热管启动快;纳米工质热管蒸发段外壁温的高低与充液率、纳米浓度和加热条件有关;纳米颗粒浓度和充液率对热管的传热性能影响较大,且存在最佳浓度(本研究为5%)和最佳充液率(本研究为44.3%);高浓度纳米工质热管比普通DW重力热管易于达到传热极限;试验中纳米悬浮液重力热管的传热强化率为16.19%～146.27%。     

基于决策树的大小水电长期协调调度模型及应用

针对西南水电富集地区大小水电抢占输电通道外送电力的问题,构建了基于决策树的大中型水电与小水电长期协调调度模型,以水电总体可消纳电量最大为目标,以确定性逐次优化方法（POA）对历史长系列水文资料进行模拟调度,在此基础上采用决策树挖掘大小水电长期协调调度规则,在应用阶段,结合CFS降雨预报信息,预报大中型水电站径流和小水电发电能力,并作为决策树输入,以获得面临时段大中型水电站的决策出力。云南省德宏地区大规模大、小水电混合分区实例应用结果表明,该模型能够有效利用具有良好调节能力的大中型水电站协调大小水电运行,提高外送通道利用率,为电力调度部门提供了一种良好的大小水电长期协调调度方法。     

Heat transfer characteristics of the evaporator section using small helical coiled pipes in a looped heat pipe

An experimental study was carried out for the heat transfer characteristics and the flow patterns of the evaporator section using small diameter coiled pipes in a looped heat pipe (LHP). Two coiled pipes: the glass pipe and the stainless steel pipes were used as evaporator section in the LHP, respectively. Flow and heat transfer characteristics in the coiled tubes of the evaporator section were investigated under the different filling ratios and heat fluxes. The experimental results show that the combined effect of the evaporation of the thin liquid film, the disturbance caused by pulsation and the secondary flow enhanced greatly the heat transfer and the critical heat flux of the evaporator section. In final, two dimensionless empirical correlations were proposed for predicting the heat transfer coefficients of the evaporator section before and after dryout occurs.     

Loop heat pipe for cooling of high-power electronic components

In this paper, we present a new development of loop heat pipe (LHP) technology in its applications to cooling systems for high-power IGBT elements. An advanced method of LHP evaporator wick manufacturing has been proposed. Following this approach, a 16 mm outer diameter and 280 mm-length LHP evaporator was designed and manufactured. Nickel and titanium particles were used as raw material in LHP evaporator wick fabrication. LHP with a nominal capacity as high as 900 W for steady-state condition and more than 900 W for a periodic mode of operation at a temperature level below 100 °C and a heat transfer distance of 1.5 m was designed through the cooling of a high-power electronic module. An experimental program was developed to execute LHP performance tests and monitor its operability over a span of time. An investigation of the effects of LHP performance of parameters such as evaporator and condenser temperatures and LHP orientation in a gravity field was brought about. As regards the results of this initial series of tests, it was found that LHP spatial orientation within the nominal range of heat loads has no drastic effect on overall LHP functioning, whereas condenser temperature does play an important role, especially in the range of heat load close to critical. A 2D nodal model of the evaporator was developed and provides us with confirmation of the suggestion that when high-power dissipation levels are available, low wick conductivity is well adapted for LHP applications.     

Flat Loop Heat Pipe with Bi-Transport Loops for Graphics Card Cooling

A flat loop heat pipe (FLHP) with bi-transport loops is developed for the cooling of graphics card with high heat flux up to 80W/cm². The evaporator and the pipes are made of copper and ultrapure water (electronic resistivity > 18 MΩ-cm) as the working fluid. To give the loop heat pipe (LHP) better performance, the evaporator is made in a flat shape to reduce the contact resistance between the evaporator and the chip. The advances of the LHP with bi-transport loops are discussed. The heat transfer performance is tested with different filling rate in different orientations. The test results show that the LHP can start up easily and can transport large amount of heat stably. The orientation of the condenser above the evaporator gives a better performance, and filling with 13 g of water gives a better performance. Limited by the evaporator temperature lower than 90°C, the LHP can transport 320 W when the evaporator is above the condenser and 380 W when the condenser is above the evaporator.     

Investigation of pulsations of the operating temperature in a miniature loop heat pipe

During the operation of miniature loop heat pipes (LHPs) one can observe pulsations of the operating temperature, which depend on the amount of the working fluid, the device orientation in the gravity field and the conditions of the condenser cooling. Intense pulsations, whose amplitude may exceed tens of degrees, arise from the lack of a working fluid in a LHP when a hot condensate or vapor bubbles periodically penetrate into the compensation chamber (CC) and act on the vapor phase in it, increasing its temperature and volume. Changes in the external conditions, for instance, the LHP arrangement in an unfavourable orientation or a more intensive cooling of the condenser with respect to the conditions for which the filling volume was optimal, also contribute to the initiation of intense pulsations of the operating temperature. In both cases one can observe redistribution of the working fluid between the condenser and the CC, as the result of which the liquid phase volume in the latter decreases and overshoots of vapor or a hot condensate there become possible.     

Evaporation Heat Transfer Coefficient in a Capillary Pumped Loop and Loop Heat Pipe for Different Working Fluids

Capillary pumped loop (CPL) and loop heat pipe (LHP) are passive two-phase heat transport devices. They have been gaining importance as a part of the thermal control system of spacecraft. The evaporation heat transfer coefficient at the tooth–wick interface of an LHP or CPL has a significant impact on the evaporator temperature. It is also the main parameter in sizing of a CPL or LHP. Experimentally determined evaporation heat transfer coefficients from a three-port CPL with tubular axially grooved (TAG) evaporator and a TAG LHP with acetone, R-134A, and ammonia as working fluids are presented in this paper. The influences of working fluid, hydrodynamic blocks in the core, evaporator configuration (LHP or CPL), and adverse elevation (evaporator above condenser) on the heat transfer coefficient are presented.     

Modeling and analysis of startup of a loop heat pipe

The startup behavior of a loop heat pipe (LHP) is one of the key aspects in evaluating its working performance. A mathematical model of the startup process of a LHP is established based on the node network method in this work. A parametric analysis on the startup characteristics of the LHP is conducted, where the effects of startup heat load, thermal capacity of the evaporator and compensation chamber, heat sink temperature, ambient temperature, heat leak from the evaporator to the compensation chamber and cooling on the compensation chamber on the startup characteristics of the LHP are evaluated, which contributes to the improvement of the LHP startup performance.     

Heat Transfer in a Loop Heat Pipe using Diamond-H2O Nanofluid

The main aim of this study is to enhance the thermal performance of loop heat pipe (LHP) charged with nanofluid as the working fluid. Thus, experiments are conducted to investigate heat transfer characteristics of using diamond-H₂O nanofluid with nanoparticle mass concentration ranged from 0% to 3% in a LHP as a working medium for heat input range from 20 W to 60 W. The three-dimensional model, laminar flow and heat transfer governing equations are solved using the finite volume method. The simulations are carried out with three-dimensional model based on the characterization of the working fluid inside the LHP to give an insight into the heat transfer and fluid flow mechanism. The LHP performance is evaluated in terms of temperature distributions and total thermal resistance of LHP. It is inferred that the temperatures obtained at all points in evaporator side of LHP charged with diamond-H₂O nanofluid are lower and reach their steady state faster than LHP charged with pure water. At the constant heat input, test results showed the average decrease of 5.7%?10.8% at nanoparticle mass concentrations ranging from 0.5% to 3% in R_th of LHP as compared with pure water (0%).     

A novel miniaturized loop heat pipe

The research on a novel miniaturized loop heat pipe (LHP) consisted of an evaporator, a condenser, vapor and liquid lines is presented in this paper. In the LHP, the evaporator was separated into two parts of boiling and suction chambers by a vapor separator, which drove vapor to one-way flow to vapor line. Moreover, the bottom of evaporator was connected as the cycle channel of refrigerant. Thin copper plates with micro-fins as enhanced structures fabricated by the ploughing–extrusion (P–E) method were embedded in the boiling chamber. Accordingly, the copper fiber sintered felt fabricated by the solid-phase sintering of copper fibers with rough surface, was filled in the suction chamber of evaporator as the wick to provide the capillary force. In addition, the integral rhombic-shaped pillars fabricated by the milling, behaved as intensified condensation structures in the condenser. The startup and operation characteristics of LHP were tested under different heat loads and refrigerants. The experimental results showed that the highest temperature of evaporator reached 93.2 °C under the maximum heat load of 150 W.