电镀工艺对镍纳米膜微观结构及硬度的影响

采用直流电沉积法制备纳米晶镍膜,研究了添加剂C12H2NaSO4,TJ,GL-100对镀层微观表面形貌、硬度、晶粒尺寸及织构的影响,同时探讨了电流密度对硬度的影响。结果表明：在无添加剂和仅加入C12H25NaSO4时,改变了镀层晶面的生长速率和晶粒快速的生长方向,使（200）晶面发生织构;TJ的添加显著细化晶粒;TJ和GL-100复合添加使镀层晶粒在（111）晶面择优取向生长。3种添加剂的复合作用,使镀层表面形貌及硬度达到最佳状态。在电镀条件相同时,镀层的硬度随电流密度的增加而增加。     

强磁场下铜电沉积层表面形貌及织构的研究

利用SEM和XRD研究了无磁场和2 T～10 T强磁场中电流密度和磁感应强度对铜电沉积层表面形貌及择优取向的影响.结果表明无磁场下,表面晶粒随电流密度增加而增大,同时伴随氢气析出而导致气孔出现,施加10 T磁场后,表面晶粒随电流密度增加呈分裂细化趋势,同时氢气析出被抑制.强磁场施加使(220)晶面织构得到抑制,而(111),(200),(311)等晶面的织构得到增强,但无论是否施加磁场,在200A/m2～630A/m2的电流密度下,铜电沉积层仍保持(220)的优先生长方向.     

电镀工艺对氨基磺酸盐体系镍镀层内应力的影响

目的 在氨基磺酸盐电镀体系中,探索出各电镀工艺参数对镀层内应力的影响规律.方法 采用一种改良的双阳极-阴极弯曲的办法测试镀层应力.通过X射线衍射实验(XRD)、扫描电子显微镜(SEM)以及KEYENCE数码显微系统,分别分析应力状态下镀层织构、微观畸变以及镀层形貌.结果 电流密度越大,镀层的张应力越大,当电流密度达到15 A/dm2时,继续增加电流密度,镀层张应力值不变.电镀时间越长,镀层越厚,张应力值越大,电镀15 min后,镀层应力保持不变.Cl?浓度越高,镀层的张应力值越大.电流密度对张应力的影响程度比电镀时间显著.X射线衍射全谱拟合表明,磁场的加入会抑制Ni(111)织构的形成,对Ni(200)有择优取向,同时使晶粒的微观畸变变小,磁场强度越强,应力越小.超声空化作用对镀层织构影响不明显,但会降低晶粒的微观畸变,并减小镀层张应力.结论 在氨基磺酸镍体系中,电流密度、电镀时间以及Cl?浓度的增大都会显著增大张应力.磁场和超声的加入在细化晶粒的同时,减小了镀层张应力.     

强磁场下铜电沉积层表面形貌及织构的研究

利用SEM和XRD研究了无磁场和2 T～10 T强磁场中电流密度和磁感应强度对铜电沉积层表面形貌及择优取向的影响.结果表明:无磁场下,表面晶粒随电流密度增加而增大,同时伴随氢气析出而导致气孔出现,施加10 T磁场后,表面晶粒随电流密度增加呈分裂细化趋势,同时氢气析出被抑制.强磁场施加使(220)晶面织构得到抑制,而(111),(200),(311)等晶面的织构得到增强,但无论是否施加磁场,在200A/m2～630A/m2的电流密度下,铜电沉积层仍保持(220)的优先生长方向.     

氯化胆碱-乙二醇低共熔溶剂中电沉积纳米晶镍

采用循环伏安和计时电流技术考察氯化胆碱-乙二醇低共熔溶剂中镍在铂电极上的电沉积行为,利用扫描电子显微镜及X射线衍射技术研究电流密度对镍镀层形貌及织构变化的影响。结果表明:镍在氯化胆碱-乙二醇低共熔溶剂中的电沉积过程是准可逆的,其形核/生长过程遵循Scharifker-Hill三维形核模型。初始阶段,镍离子的形核/生长过程按三维连续形核机制,随后趋向于三维瞬时形核机制。随电流密度的增大,镀层厚度增加,晶粒尺寸减小,镍(111)晶面择优取向减弱,镀层表面形貌则由锥形颗粒状变为不规则的多面体颗粒状,最后变为圆球形胞状结构。     

强磁场对电沉积镍铁合金膜显微组织的影响

在电沉积镍铁合金膜过程中施加了不同强度的纵向强磁场,研究了磁场强度对电沉积镍铁合金膜的微观形貌、晶粒取向和成分的影响。结果表明:随着磁感应强度增加,镀层表面晶粒先粗化,然后细化为数百纳米的颗粒层;同时样品截面组织经历了由层状生长转为树枝晶、脊状晶和条状晶的一系列变化;在12 T强磁场下条状晶沿外磁场方向破碎为球状微晶组织;强磁场使样品(111)晶面择优取向,并进一步促进了Fe2 的优先沉积,使样品中铁含量随外加磁场强度的增大而增加,而膜的饱和磁化强度也线性提高。     

镀液温度对电化学制备Ni-SiC纳米复合镀层微观结构的影响

在不同镀液温度下直流电沉积制备Ni-SiC纳米复合镀层,利用X-射线衍射仪(XRD)、扫描电子显微镜(SEM)和能谱仪(EDX)对镀层的相组成、表面形貌、成分等进行表征,考察镀液温度对镀层的微观形貌、晶体生长和镀层中SiC含量等影响。结果表明:随着温度升高,Ni-SiC晶粒从无序取向渐变为(220)择优取向,到70℃时(220)面的晶面织构系数达到最大值;镀层中纳米SiC含量随着温度的升高先增大后减少,在60℃时达到最大值;纳米SiC微粒的加入可抑制镍晶的晶粒生长,从而细化晶粒,并使镍晶产生晶格畸变;Ni-SiC纳米复合镀层的表面形貌随温度的升高,表面颗粒更加细化和均匀。     

电流密度对镍镀层结构和性能的影响

采用阴极移动电镀技术在电流密度为1～13A/dm2时制备镍镀层。利用扫描电镜(SEM)、X射线衍射仪(XRD)、X射线应力衍射仪以及硬度计等手段,研究电流密度对镍镀层的表面形貌、结晶取向、孔隙率、内应力和硬度的影响。结果表明:镍镀层的织构和性能随电流密度的变化而改变。当电流密度低于7A/dm2时,镀层表面球形颗粒较为粗大、孔隙率较高,在为4A/dm2时,镀层具有最低的拉应力约110 MPa;当电流密度为7A/dm2时,镀层表面球形颗粒均匀细小,具有最小的表面粗糙度Ra 0.69μm,最小的孔隙率0.08个/cm2以及最高的硬度330HV0.1;当电流密度大于7A/dm2时,镀层的表面粗糙度增加,择优取向由(200)晶面向(220)晶面发生转变,电流密度达到13A/dm2时,(220)晶面的织构系数达到了85.4%。     

直流电沉积法制备纳米晶体镍镀层及其热稳定性的研究

利用直流电沉积技术,系统分析电流密度和镀液糖精浓度对纳米晶体镍性能的影响。电流密度在0.5-1.5 A/dm2 范围内时,可调节糖精浓度制备出415-603Hv的显微硬度宽分布的纳米晶镀层。小电流密度0.5 A/dm2 时,随糖精浓度增大,镀层(200) 面衍射强度增强,结构由(111), (200)双织构向(200)面转变,且镀层内应力值降低,增大到1.2g/L时,内应力降为0MPa。镀层晶粒尺寸为28~98nm时,直到600℃晶粒才开始长大,结构稳定性较好;晶粒尺寸为10nm时,晶粒在317℃异常长大,其结构稳定性显著下降。     

直流电沉积法制备纳米晶体镍镀层及其热稳定性研究（英文）

利用直流电沉积技术系统分析电流密度和镀液糖精浓度对纳米晶体镍性能的影响。结果表明,电流密度在0.5~1.5 A/dm~2时,可调节糖精浓度制备出显微硬度HV分布为415~603 MPa的纳米晶镀层。小电流密度0.5 A/dm~2时,随糖精浓度增大,镀层(200)面衍射强度增强,结构由(111),(200)双织构向(200)面转变,且镀层内应力降低,糖精浓度增大到1.2 g/L时,内应力降为0。镀层晶粒尺寸为28~98 nm时,直到600℃晶粒才开始长大,结构稳定性较好;晶粒尺寸为10 nm时,晶粒在317℃异常长大,其结构稳定性显著下降。     

Influence of pulse parameters on the microstructure and microhardness of nickel electrodeposits

Square-wave cathodic current modulation was used to electrodeposit fine-grained nickel from an additive-free and saccharin-containing Watts bath. The influence of pulse on-time, off-time, peak current density and saccharin on the grain size, surface morphology, crystal orientation, and microhardness was determined. The study showed that at constant off-time and peak current density, the crystal size of the deposits was found initially to decrease with pulse on-time before it started to increase with further increase in on-time. The crystal orientation progressively changed from a (111) texture at the on-time of 0.1 ms to a strong (200) texture at an on-time of 8 ms. An increase in the pulse off-time at constant on-time and peak current density resulted in a progressive increase in crystal size. However, the crystal orientation remained unaffected with increasing off-time. An increase in peak current density resulted in considerable refinement in crystal size of the deposits. The crystal orientation progressively changed from an almost random distribution at the lowest peak current density of 0.2 A/m² to a strong (200) texture at a peak current density of 2.0 A/m². The nanocrystalline nickel with grain size in the order of 30 nm can be produced from saccharin-containing Watts' baths. In contrast, when using an organic-free Watts' bath and similar pulse-plating conditions, the grain size can only be refined down to about 80-100 nm. The microhardness of deposits is related with grain size: when the grain size is large, the microhardness is consistent with Hall-Petch law (HPL); when the grain size is ultrafine, “nano-effect” would be generated, the microhardness is against HPL.     

Synthesis and Characterization of Electrodeposited Nanocrystalline Nickel

NANOCRYSTALLINE materials exhibit ultra-highstrength,superior wear resistance and enhancedsuperplastic formability compared with theirconventional coarse-grained counterparts ll~31.As aresult,there has been a great emphasis on studyingthese materials.And the synthesis of nanocrystallinemetals and alloys is a particularly important topic.Many synthesis techniques for production ofnanocrystalline materials have been developed,such asinert gas condensation,ball milling,sol-gel technique,spu…     

脉冲磁场处理对7075铝合金性能及组织的影响

采用脉冲磁场对7075铝合金进行了磁处理,并使用室温拉伸、SEM、TEM和XRD等测试手段对比研究了7075铝合金脉冲磁场处理前后的力学性能及显微组织。研究发现,峰值强度为2 T和3 T的脉冲磁场会增大合金的微观应变,促进晶粒择优取向由(200)晶面转变为(111)晶面,但脉冲磁场对合金的拉伸性能无明显影响;峰值强度为1 T的脉冲磁场能够显著促进合金内部小尺寸第二相的回溶,减弱晶界沉淀相的连续性,增加晶界无沉淀析出带的宽度,可在不降低7075铝合金材料强度的情况下提高该材料的塑性。     

Computation of deformation-induced textures in electrodeposited nickel coating

The deformation-induced textures in electrodeposited nickel coating were numerically studied. The finite element method （FEM） for polycrystalline was developed based on Taylor model. Then the deformation-induced textures in electrodeposited nickel coating with initial random and lamellar texture were simulated under tensile load. It is found that the initial textures significantly influence the deformation-induced textures. For nickel coating with the initial random textures, when （he tensile strain is about 40%, there are some lamellar textures. For nickel coating with the initial lamellar textures, the lamellar texture is more intensity with the increase of the tensile strain. With the increase of the tensile strain in the coating, there are more pronounced element distortion and a more inhomogeneous deformation. Due to the different crystal orientations, the grain-scale roughness is observed. With increasing tensile strain in the coating, the surface grain-scale roughness increases on the flee surface. The surface roughness of the coating with initial random texture is lower than that with the initial lamellar texture.     

Crystal defects formed in electroformed nickel liners of shaped charges

Two types of electroformed nickel liners of shaped charges were prepared by electroforming technique. X-ray diffraction (XRD), transmission electron microscopy (TEM), electron backscattering diffraction (EBSD) technique and high resolution electron microscopy (HREM) have been employed to investigate the crystal defects formed in electroformed nickel liners of shaped charges. The result shows that (100) fiber texture which is parallel to the grown direction exists in the electroformed nickel prepared by using direct current electroforming without any additives, and (111) fiber texture exists in the electroformed nickel prepared by using direct current electroforming with additives. The deposits prepared by using direct current electroforming possess columnar grain with an average grain size of 30 μm in width and 170 μm in length. The deposits prepared with additives are composed of a colony structures with grain size of about 29 nm, and a lot of crystal defects such as twins, antiphase boundaries and stacking faults have been observed in the electroformed nickel.     

Effect of electromagnetic vibration on the structure in solidified Al-4.5％Cu alloy under a strong magnetic field

同时施加静磁场和交变电流后, Al-4.5晶粒的细化程度随电流的增大而增加,随磁场增加先增加后略有降低.XRD结果表明,施加磁场后,晶粒的(111)晶向沿磁场方向取向.晶粒取向度随晶粒的增大而降低.从球形颗粒旋转取向和颗粒迁移角度推导了晶体粒径和取向的关系.     

Effect of Axial Magnetic Field on the Microstructure,Hardness and Wear Resistance of TiN Films Deposited by Arc Ion Plating

TiN films were deposited on stainless steel substrates by arc ion plating. The influence of an axial magnetic field was examined with regard to the microstructure, chemical elemental composition, mechanical properties and wear resistance of the films. The results showed that the magnetic field puts much effect on the preferred orientation, chemical composition, hardness and wear resistance of TiN films. The preferred orientation of the TiN films changed from(111) to(220) and finally to the coexistence of(111) and(220) texture with the increase in the applied magnetic field intensity. The concentration of N atoms in the TiN films increases with the magnetic field intensity, and the concentration of Ti atoms shows an opposite trend. At first, the hardness and elastic modulus of the TiN films increase and reach a maximum value at 5 m T and then decrease with the further increase in the magnetic field intensity. The high hardness was related to the N/Ti atomic ratio and to a well-pronounced preferred orientation of the(111) planes in the crystallites of the film parallel to the substrate surface. The wear resistance of the Ti N films was significantly improved with the application of the magnetic field, and the lowest wear rate was obtained at magnetic field intensity of 5 m T. Moreover, the wear resistance of the films was related to the hardness H and the H3/E*2 ratio in the manner that a higher H3/E*2 ratio was conducive to the enhancement of the wear resistance.     

复合电沉积工艺参数对镍晶微铸件表面性能的影响

目的将超声波、磁场引入到微电铸过程中,改善电沉积镍晶微构件的表面性能。方法改变电流密度、脉冲占空比、超声波功率、磁场强度的方向和强度,进行电沉积镍晶微铸件,分析这些工艺参数对微铸件表面形貌和显微硬度的影响。结果微铸件的显微硬度随磁场强度的增大而显著提高,随着阴极电流密度、超声波功率及脉冲占空比的增大呈现出先升高、后下降的规律,其中脉冲占空比对电铸层显微硬度的影响较弱。优选的工艺参数为:垂直磁场强度0.8 T,阴极电流密度2 A/dm2,超声波功率240W,脉冲占空比20%。结论引入超声波和磁场后可优化电沉积环境,细化电铸层晶粒尺寸,改善电铸层微观形貌,提高微铸件显微硬度。     

IF钢退火过程中再结晶行为的EBSD表征

借助EBSD等技术研究了从冷轧到退火过程中IF钢中铁素体再结晶晶粒的取向演变。研究结果表明,从冷轧到退火过程中,铁素体晶粒取向向着平行于法向的[111]晶粒演变,而平行于法向的[100]晶粒逐渐消失;在冷轧变形过程中,铁素体晶粒的晶体取向决定着发生滑移变形的难易程度,与[100]晶粒相比,[111]晶粒更易于发生滑移变形,并在晶粒内部积累大量的位错,储存了大量的应变能,在随后的退火过程中,应变能较高的[111]晶粒优先形核并长大,优先发生再结晶,而应变能较低的[100]晶粒的再结晶受到阻碍。随着退火温度的升高,γ织构([111]//ND)明显增强,其织构组分(111)[112]尤为明显。