陶瓷添加物对Ti_3SiC_2基复合材料抗氧化性的影响

为研究陶瓷添加物对Ti3SiC2基复合材料性能的影响,首先,采用反应热压烧结法制备了Ti3SiC2材料及陶瓷添加物含量均为30wt%的SiC/Ti3SiC2、Al2O3/Ti3SiC2和MgAl2O4/Ti3SiC2复合材料。然后,测试了材料的力学性能和导电性,在1 373~1 773K温度范围内对Ti3SiC2基复合材料的抗氧化性进行了研究,并对其烧结试样的物相组成和显微结构等进行了表征。结果表明:Ti3SiC2在高温氧化后的主要产物为TiO2和SiO2;氧化层分为内外2层,内层由TiO2与SiO2这2相混合组成,外层为TiO2;氧化层中存在大量显气孔,结构较为疏松,导致抗氧化性较差。与Al2O3/Ti3SiC2和MgAl2O4/Ti3SiC2复合材料相比,SiC/Ti3SiC2复合材料具有更好的抗氧化性。     

Ti-2Al-2.5Zr合金在300℃碱性水中氧化的表面分析

利用原位 AES深度分析 ,XRD,和 XPS方法研究了 Ti- 2 Al- 2 .5 Zr合金在 30 0℃碱性水中氧化 130 0 0 h所形成的氧化膜的结构、成分和价态 ,及其随深度的变化。结果表明 ,氧化膜是由板钛型 Ti O2 、Al2 Ti O5(Ti O2 ·Al2 O3) ,Ti3O5,Ti2 O3和 Ti O所组成 ,氧化膜由表面到基体基本是按以上顺序交迭构成。通过 XPS和原位 AES分析发现钛合金表面形成由 Ti O2 ,Al2 Ti O5(Ti O2 ·Al2 O3) ,Ti3O5组成的较为稳定的厚约 80 0 nm的 Ti4 + (Ti O2 )层 ,随深度的增加出现了 Ti3+ (Ti3O5,Ti2 O3)和 Ti2 + (Ti O) ,直至基体 ,氧化膜总厚度约 30 0 0 nm。     

Ti3SiC2陶瓷材料的制备及抗烧蚀行为

以固溶少量Al的Ti3SiC2粉体为原料,采用热压烧结工艺制备出致密度大于99％的Ti3SiC2陶瓷块体材料,其硬度、抗弯强度和断裂韧度分别为775HV,520.46 MPa和7.62 MPa·m1/2.对Ti3SiC2块体在无冷却条件下进行抗氧乙炔焰烧蚀实验,结果表明:烧蚀10 s内Ti3SiC2陶瓷保持表面平整,烧蚀25 s内样品未出现宏观裂纹.SEM和XRD观察分析表明,Ti3SiC2陶瓷在高温乙炔焰和氧气的高热流冲击作用下,表面发生分解和氧化,Si和C被氧化为Si-O化物和C-O化物气体逸出,Ti元素被氧化成高温稳定的TiO2金红石相覆盖在表面;氧化层呈3层结构分布,最外层为结构疏松的TiO2,次表层则为TiO2和Al2TiO5组成的致密复合层,内氧化层为致密Al2O3富集层,Al2O3来源于固溶在原料Ti3SiC2中Al元素的氧化,并在高温下与TiO2反应生成了Al2 TiO5.具有高黏度和高熔点的Al2O3富集层可以有效阻碍O2和热流向基体的扩散,从而降低基体的氧化速率,提高Ti3SiC2材料的抗烧蚀性能.     

TiB_2颗粒增强钛基复合材料抗氧化性能

采用粉末冶金法制备了TiB2/Ti颗粒增强钛基复合材料,研究了不同烧结温度(800、900、1000和1100℃)TiB2/Ti复合材料在600、700、800和900℃空气中的恒温氧化行为,分析了TiB2对钛基复合材料氧化动力学行为的影响,并对氧化层表面的相组成、形貌以及氧化层剖面的显微结构进行了分析。结果表明:该复合材料的氧化层表面的氧化产物主要为金红石型TiO2,此外还有Fe2O3、Al2O3和B2O3,未发现其它类型钛的氧化物;TiB2/Ti复合材料800℃恒温空气中氧化的氧化动力学曲线初始阶段氧化速度较快,随着氧化时间的延长,形成的氧化膜减慢了氧化的速度;随着增强体TiB2体积分数的增加和烧结温度的提高,复合材料的抗氧化性能提高,这主要是由于提高烧结温度和提高增强体TiB2的体积分数均有利于氧化层的致密度提高,从而提高了材料的抗氧化性能。     

钛合金微弧氧化膜的性能探讨

钛合金微弧氧化膜具有优良的综合性能,但过去的研究多针对Ti6Al4V及医用纯钛,且电解液常用硅酸盐和磷酸二氢盐体系,不够全面、系统。为此,以磷酸盐溶液体系在船用TA2表面制备了陶瓷微弧涂层。采用SEM、光学显微镜、X射线衍射仪和显微硬度计对陶瓷膜的表面形貌、截面形貌、氧化层厚度、相结构和显微硬度进行了观察测试,用电子万能材料试验机和数字万用表测定了膜层的结合强度和绝缘性,并用盐雾试验机考察了涂层的耐蚀性。结果表明:随氧化时间的延长,膜层厚度不断增加,氧化60min后膜层厚度可达到20μm以上;陶瓷层主要由金红石TiO2相和锐钛矿TiO2相构成,膜基结合强度达到30MPa以上,膜层绝缘性和耐蚀性良好。     

三元层状化合物Ti2 AlN在800℃,900℃和1000℃空气中的循环氧化行为

Ti、Al和TiN粉按化学计量比1:1:1配料,采用热压工艺在1300℃保温2h,30MPa压力下制备了Ti2AlN块体材料.研究了该材料在800℃,900℃和1000℃空气中的循环氧化行为.利用X射线衍射仪和扫描电镜对氧化层的相组成,厚度以及元素含量进行了测量和分析.结果表明:Ti2AlN在空气中的循环氧化行为基本上是符合抛物线规律,氧化层的主要成分是由TiO2和α-Al2O3组成.在温度高于800℃时,氧化膜由于氧化区域的热应力过大容易脱落.Ti2AlN材料在空气中的氧化性能明显低于Ti3AlC2和Ti3SiC2材料.     

冷喷涂制备TiAl_3-Al复合层及其抗高温氧化性能

为了提高γ-TiAl合金的抗高温氧化性能,采用冷喷涂技术在γ-TiAl合金基体上喷涂纯Al层后进行热扩散处理,制备了厚约250μm的TiAl3-Al复合涂层,研究了该涂层在950℃下的长时间高温氧化行为,用X射线衍射仪(XRD)分析了复合涂层的相组成,用场发射电子显微镜研究了其形貌,用电子探针分析了其成分。结果表明:冷喷涂纯Al层致密,存在少量微裂纹和微气孔;TiAl3-Al复合涂层和基体之间生成了TiAl3相,TiAl3与Al的界面有空洞;γ-TiAl合金高温氧化70 h即失重,氧化产物为TiO2和Al2O3的混合物;TiAl3-Al复合涂层进入稳态氧化阶段后,增重缓慢,遵循近抛物线规律,高温氧化1 000 h后涂层仍完好,氧化产物主要为Al2O3相,还有微量的TiO2及钛氮化合物;TiAl3-Al复合涂层提高了γ-TiAl合金的抗高温氧化性能。     

Ti-45Al-10Nb合金的高温氧化行为

研究了Ti—45A1—10Nb(原子分数，％)合金在800-960℃在氧气和空气中的氧化行为．结果表明，该合金具有较好的高温抗氧化性能，其氧化增重速率与铁基耐热不锈钢相似或略优．与Ti—50A1合金相反，Ti-45A1-10Nb合金在空气中的氧化增重速率明显低于在纯氧中的氧化增重速率．X射线衍射与能谱分析表明，Ti-45Al一10Nb合金在氧气中的氧化产物主要有TiO2和Al2O3，但在空气中的氧化产物中有TiN相．这是降低氧化速率的主要原因，同时，合金元素Nb稳定了氧化层中的TiN相，因而提高了合金在空气中的抗氧化性能．     

不同厚度铝合金微弧氧化陶瓷层摩擦学性能研究

采用球-盘磨损实验方法,研究了不同厚度2A12铝合金微弧氧化陶瓷层的摩擦学特性及其磨损性能,用SEM观察陶瓷层的表面形貌、截面显微组织以及磨损后的形貌,XRD研究陶瓷层的相组成.研究表明,随氧化时间延长,样品表面膜厚度趋于均匀,界面处氧化膜变得比较平坦.陶瓷层主要由α-Al2O3和γ-Al2O3相组成,随氧化时间的延长、厚度增大,γ-Al2O3相在陶瓷层中的含量逐渐减少,而高温态、高硬度的α-Al2O3相的含量随氧化时间的延长逐渐提高,陶瓷层的平均硬度逐渐增大;未磨光、有疏松层的陶瓷层的磨损失重和磨损速率随微弧氧化时间的延长、厚度增大均增大,而磨光、去除疏松层的陶瓷层的磨损失重和磨损速率则均逐渐下降;磨痕的形状均为滑动方向上呈现片状鱼鳞、沟槽,为黏着磨损特征,磨痕未见裂纹.     

La2O3掺杂BST/Mg2TiO4微波复合陶瓷的制备和性能

用固相烧结法制备掺杂La2O3的Ba0.55Sr0.45TiO3/Mg2TiO4微波复合陶瓷,研究了掺杂对其微观结构、微波(f=10 GHz)介电性能和调谐率的影响.结果表明:当掺杂La2O3量(质量分数)为1.2%时,La3+进入BST晶格,且抑制了BST/Mg2TiO4中Ti从+4向+3价转化;La2O3的掺入比较...     

Oxidation of Ion Plated Ni—Cr Alloy Film at 300℃

Investigation by using LAS 3000 surfaceanalysis system showed that the oxide of Fe,Cr,Al formed during oxidation were Cr_2O_3,Fe_2O_3and Al_2O_3,but only small amount of nickel oxidewas found.The composition of oxide layers for differentoxidation durations varied in a similar way.In all cases,there exists an oxygen concentrationpeak in the composition profile of oxide layer.There is a transitional zone between oxide layerand alloy film.The thickness of oxide layerincreases logarithmically with the time of oxida-tion.The ion plated Ni-Cr alloy film has verydense oxide layer and good oxidation resistance.     

Oxidation of vanadium with reactive oxygen plasma: A photoelectron spectroscopy study of the initial stages of the oxide growth process

We report on the oxidation of vanadium surface in a low-temperature oxygen plasma studied by in-situ photoelectron spectroscopy (XPS, UPS). Pure vanadium foil was exposed to the oxygen plasma for different time intervals allowing to investigate early stages of the oxide-metal interface formation process and the oxide film growth. Upon increasing the exposure time to the oxygen plasma we identify two regimes with respect to the vanadium oxidation state: formation of 4+ state on the early stages of growth and in saturated regime vanadium was found to be predominantly in the 5+ oxidation state. Angle-resolved XPS was used to perform an in-depth distribution analysis of chemical composition in outermost layers of the oxide. We found that plasma oxidation produces a well-pronounced interface with a transition layer thickness of about 1.3 nm.     

Effects of High Temperature Oxidation on Mechanical Properties of Ti_3AlC_2

The oxidation tests of Ti_3AlC_2 were conducted at 1100 and 1200?C in air for 48 and 360 h, respectively,and the effects of high temperature oxidation on the flexural strength and hardness of Ti_3AlC_2 were investigated. The microstructure, grain size and phase compositions of Ti_3AlC_2 substrate didn't change after oxidation, hence the oxide removed Ti_3AlC_2 substrate maintained its initial flexural strength and hardness. However, the flexural strength of oxide retained Ti_3AlC_2 decreased by about 5%. Acoustic emission monitoring indicated that during the process of three-point bending test, the formed Al_2O_3 scale on Ti_3AlC_2 surface fractured firstly in a cleavage manner, then the substrate/oxide interface cracked,and finally the Ti_3AlC_2 substrate fractured. The mechanical degradation was caused by the preferential formation of cracks in brittle Al_2O_3 scale as well as at defective and lacunose grain boundaries of the substrate where stress concentration generated. The mechanical degradation was insensitive to oxidation temperature and time in the present conditions. In addition, the surface hardness increased significantly after oxidation due to the formed hard Al_2O_3 scale on the surface of Ti_3AlC_2 substrate.     

H_2O和Y(O)对NiCoCrAl热障涂层高温氧化的影响

分别利用真空等离子沉积和超音速火焰喷涂技术制备含有Y和含Y氧化物的NiCoCrAl涂层,用差热分析和光学及电子显微镜研究两种涂层在Ar-16.7%O_2,Ar-3.3%H_2O和Ar-0.2%H_2-0.9%H_2O气氛中1100℃时的氧化动力学和断面微观结构,通过第一性原理计算对比在不同气氛中含Y氧化物对涂层氧化的影响机理。结果表明:对于NiCoCrAl+Y涂层,Y倾向于向界面扩散并在界面富集导致Al_2O_3膜生成更多有利于内氧化的孔洞,水蒸气更会对内氧化产生促进作用。而对于NiCoCrAl+Y(O)涂层,由于Y在涂层制备过程中被氧钉扎,导致NiCoCrAl+Y(O)涂层在上述气氛中生成了平直而均匀的Al_2O_3层,不同气氛对其氧化行为影响较小。上述研究进一步揭示NiCoCrAl涂层中活性元素Y的存在状态和氧化气氛中的水蒸气对氧化铝组织结构和生长速率有重要影响。     

Oxidation of Hastelloy-XR Alloy for Corrosion-Resistant Glass-Coating

The oxidation behavior of Hastelloy-XR alloy was investigated to obtain the optimum surface condition for corrosion-resistant glass-coatings. The surface morphology of oxide scales changed significantly with variation of temperatureand oxygen partial pressure (po2 ). The oxidation kinetics was mainly parabolic independent of oxidation conditions.The oxide scales were consisted of inner Cr2O3 and outer spinel layers. The phase component of spinel layers wereMn1.5Cr1.5O4 and (Mn,Ni)(Cr,Fe)2O4 for the oxygen partial pressures po2<10 kPa and po2>10 kPa, respectively.The optimum oxidation condition to obtain an oxide scale for well-adhered glass-coating to the substrate was 1248 Kand po2 =0.01 kPa for the oxidation time of 43 ks.     

用变角XPS定量分析研究GaAs光电阴极激活工艺

用变角X射线光电子能谱 (XPS)技术分析了GaAs光电阴极的激活工艺 ,定量计算了阴极表面激活层和界面氧化层的厚度和组成。界面氧化物是由于O原子穿过激活层 ,扩散到GaAs与 (Cs,O)激活层的界面上而形成的。导入过量O会增加O GaAs界面层的厚度 ,而对 (Cs,O)激活层厚度影响较小。在激活过程中 ,严格控制和减少每次导入的O量是减少界面氧化层厚度 ,提高灵敏度的重要途径。在第一步激活后的阴极样品 ,通过较低温度的加热和再激活 ,能获得比第一步高出 30 %的光电灵敏度的原因是较低温度加热减少了界面氧化层的厚度和界面势垒     

Magnetic properties of permalloy/permalloy-oxide multilayer thin films

Magnetic properties of permalloy/permalloy-oxide multilayer thin films are investigated. These thin films are prepared by a repeat of sputter deposition of permalloy thin film, followed by oxidation of the film surface. The total thickness of the permalloy thin films before oxidation is about 100 nm. The number of layers is one to twenty. The oxide layers are formed by oxidation in dry air. The estimated oxide layer thickness is about 2 nm. The oxide NiFe₂O₄ is identified by RHEED. The film coercivity decreases linearly with increasing layer numbers. The saturation magnetization and magnetoresistivity decrease as the number of layers increase. The coercivity decrease is due to grain growth suppression and magnetic separation by oxide film of permalloy layer, and magnetoresistivity decrease is due to electrical resistivity increase originating into electron scattering by the oxide layer.     

An XPS and thermogravimetric study of oxidized AlN and AlN–Si3N4 layers deposited by liquid-phase chemical vapour deposition

The results of a comparative study of the resistance to oxidation of AlN and a codeposit of AlN–Si3N4 are presented. The oxidation of both types of layer was performed at 1200°C in an oxygen gas flow (pO2∼1 atm). A thermogravimetric analysis was made, recording the weight gain throughout the oxidation process, and revealed a dramatic improvement in the resistance to oxidation of the codeposit layer when compared with the aluminium nitride layer. An X-ray photoelectron spectroscopy depth-profile analysis was made by performing a series of successive abrasive polishes on the oxidized layers. After each abrasive polish the sample surface was cleaned by ionic bombardment under ultrahigh vacuum and the photoemission spectra recorded. This process of polishing, etching and analysis was continued until the oxygen content decreased to a level comparable with that observed in the layers before oxidation. The changes in chemical bonding throughout the various depth profiles were examined by deconvolution of the Al 2p and Si 2p photoelectron peaks and by analysis of the Auger K L L lines. It was concluded that the slower rate of oxidation of the codeposit could be attributed to either the formation of silica or a mixed oxide phase of the mullite type (3 Al2O3–2SiO2). This revised version was published online in November 2006 with corrections to the Cover Date.     

Effect of Ti content and Y additions on oxidation behavior of SnAgTi solder and its application on dissimilar metals soldering

Auger electron spectroscopy (AES) technology was utilized to investigate the oxidation behavior of SnAgTi solder by means of characterizing the chemical composition and the thickness of the oxide layer. The effect of Ti and Y elements on oxidation behavior was discussed. Cu and 1Cr18Ni9Ti was soldered with Sn4Ag2Ti0.5Y solder. The shear strength, the microstructure, and the composition of intermetallic compound phase of the soldered joint were measured. The result indicated that the oxide layer of SnAgTi solder mainly consisted of titanium oxide. A small amount of Y additions would further improve oxidation resistance because it could inhibit the oxidation of Ti in the molten solder and reduce the oxygen atoms entered into the solder. The composition of the oxide layer of Sn4Ag2Ti0.5Y solder was mainly Y₂O₃ and very little titanium oxide. The thickness of oxide layer and the depth of O containing layer became less with decreasing Ti content and adding Y element. The mechanical property and the microstructure of the Cu/1Cr18Ni9Ti soldered joint showed the good bonding between the parent metals and the solder. The study provides a fundamental understanding for the oxidation behavior of SnAgTi solder.     

Cracking behavior of oxide scale formed on Ti3SiC2-based ceramic

The cyclic oxidation and acoustic emission (AE) tests were carried out for studying cracking behavior of oxide scales formed on Ti₃SiC₂-based ceramic at 1100 °C. A duplex oxide scale with an outer layer of pure TiO₂ and an inner layer of a mixture of TiO₂ and SiO₂ was formed. The oxide scale did not spall from substrate during the cyclic oxidation at 1100 °C for 360 times. However, a great number of micro-cracks penetrating whole inner oxide layer were detected. AE test showed that the oxide scale did not crack during the isothermal oxidation at 1100 °C for 1 h, however, the scale cracked during the cooling stage. Comparing the growth rate and thickness between the oxide layers formed during the isothermal oxidation and cyclic oxidation, respectively, indicated that cracks in the inner oxide layer served as paths mainly for outward diffusion of titanium and for inward diffusion of oxygen, resulting in increased growth rate of the outer oxide layer. Because of entire and compact TiO₂ consisted of outer oxide layer, and low thermal stress resulting from small mismatch of thermal expansion coefficients between the oxides and the substrate, Ti₃SiC₂ exhibited excellent cyclic oxidation resistance at 1100 °C for 360 cycles.