Epitaxial growth of strained Si1−yCy films by the hot-wire cell method and its application to metal oxide semiconductor devices

We succeeded in obtaining strained Si_1−yC_y films at a substrate temperature of 200 °C by the hot-wire cell method. The substitutional carbon concentration in films annealed at 700 °C was 0.9%, while it was limited to 0.13% for a sample grown by gas-source molecular beam epitaxy (MBE) at a substrate temperature of 700 °C. We investigated the thermal stability of strained Si_1−yC_y films for device application. Annealing at over 900 °C caused the formation of 3C-SiC and relaxation of the strain occurred. From this result, we found that the process temperature should be lower than 800 °C. A low-temperature MOSFET process, in which all process temperatures after deposition of Si_1−yC_y were lower than 800 °C, was developed and a strained Si_1−yC_y MOSFET was fabricated.     

Investigation of stress behaviors and mechanism of void formation in sputtered TiSix films

We have investigated the stress behaviors and a mechanism of void formation in TiSi_x films during annealing. TiSi_x thin films were prepared by DC magnetron sputtering using a TiSi_2.1 target in the substrate temperature range of 200–500 °C. The as-deposited TiSi_x films at low substrate temperature (<300 °C) have an amorphous structure with low stress of 1×10⁸ dynes/cm². When the substrate temperature increases to 500 °C, the as-deposited TiSi_x film has a mixture of C49 and C54 TiSi₂ phase with stress of 8×10⁹ dynes/cm². No void was observed in the as-deposited TiSi_x film. Amorphous TiSi_x film transforms to C54 TiSi₂ phase with a random orientation of (311) and (040) after annealing at 750 °C. The C49 and C54 TiSi₂ mixture phase transforms to (040) preferred C54 TiSi₂ phase after annealing over 650 °C. By increasing substrate temperature, the transformation temperature for C54 TiSi₂ can be reduced, resulting in relieved stress of TiSi₂ film. The easy nucleation of the C54 phase was attributed to an avoidance of amorphous TiSi_x phase. We found that amorphous TiSi_x→C54 TiSi₂ transformation caused higher tensile stress of 2×10¹⁰ dynes/cm², resulting in more voids in the films, than C49→C54 transformation. It was observed that void formation was increased with thermal treatment. The high tensile stress caused by volume decreases in the silicide must be relieved to retard voids and cracks during C54 TiSi₂ formation.     

Structural, chemical, and electrical characterisation of reactively sputtered WSx thin films

WS_x films were sputter-deposited on Si, SiO₂/Si, and glass substrates from a WS₂ target in an Ar/H₂S atmosphere. Their structure, morphology, chemical composition, and electrical properties were investigated as a function of deposition parameters such as working pressure and H₂S fraction. Films could be grown in the composition range WS_0.3−WS_3.5. Crystallisation was achieved at substrate temperatures T_s > 70 °C and compositions 0.7 ≤ x ≤ 1.95. While the first 5–50 nm near the interface exhibited a basal orientation (c), further growth resulted in the formation of edge-oriented platelets (c) giving rise to a porous, lamellar microstructure. The crystalline structure was mainly turbostratic, while some degree of ordered stacking was present in samples grown at high substrate temperature (600 °C). Resistivity measurements showed a semiconductor-type temperature dependence characterised by activation energies up to 95 meV. Sheet resistance was found to be nearly independent of film thickness, suggesting that the main carrier transport takes place in an interfacial layer of about 20 nm in thickness.     

Growth of c-GaN films on GaAs(100) using hot-wire CVD

Cubic gallium nitride (GaN) films were grown on nitrided layers of GaAs(100) by hot-wire chemical vapor deposition. The nitrided layer was also formed by NH_x radicals generated on a tungsten hot-wire surface. Nitridation conditions for the growth of GaN with a cubic-type structure were investigated. As a result, GaN film with a preponderant cubic phase was grown on the GaAs surface layer nitrided at a substrate temperature of 550 °C, a filament temperature of 1200 °C and an ammonia (NH₃) pressure of 1 Torr.     

Effect of deposition temperature on the structural and thermoelectric properties of bismuth telluride thin films grown by co-sputtering

Thermoelectric bismuth telluride thin films were prepared on SiO₂/Si substrates by radio-frequency (RF) magnetron sputtering. Co-sputtering method with Bi and Te targets was adopted to control films' composition. Bi_xTe_y thin films were elaborated at various deposition temperatures with fixed RF powers, which yielded the stoichiometric Bi₂Te₃ film deposition without intentional substrate heating. The effects of deposition temperature on surface morphology, crystallinity and electrical transport properties were investigated. Hexagonal crystallites were clearly visible at the surface of films deposited above 290 °C. Change of dominant phase from rhombohedral Bi₂Te₃ to hexagonal BiTe was confirmed with X-ray diffraction analyses. Seebeck coefficients of all samples have negative value, indicating the prepared Bi_xTe_y films are n-type conduction. Optimum of Seebeck coefficient and power factor were obtained at the deposition temperature of 225 °C (about − 55 μV/K and 3 × 10^− 4 W/K²·m, respectively). Deterioration of thermoelectric properties at higher temperature could be explained with Te deficiency and resultant BiTe phase evolution due to the evaporation of Te elements from the film surface.     

Structural characterization of ion-beam-induced epitaxially crystallized thin layers of III–V and IV–IV semiconductors

Structural properties of ion-beam-induced epitaxial crystallization (IBIEC) for amorphous layers of GaAs on GaAs(100), BP on BP(100) and Si_1−xGe_x and Si_1−x−yGe_xC_y on Si(100) have been investigated. Crystallization was induced by ion bombardment with 400 keV Ne, Ar or Kr at 150 °C for GaAs and at 350 °C for BP. Epitaxial crystallization up to the surface was observed both in GaAs and BP at temperatures much below those required for the solid phase epitaxial growth (SPEG). The growth rate per nuclear energy deposition density has shown a larger dependence on ion dose rate in cases of heavier ion bombardments both for GaAs and BP. Crystallization of a-GaAs with ions whose projected ranges are within the amorphous layer thickness was also observed at 150 °C. Epitaxial crystallization of Si_1−xGe_x and Si_1−x−yGe_xC_y layers (x = 0.13 and y = 0.014 at peak concentration) on Si(100) formed by high-dose implantation of 80 keV Ge and 17 keV C ions has been observed in the IBIEC process with 400 keV Ar ion bombardments at 300–400 °C. Crystalline growth by IBIEC has shown a larger growth rate in Si_1−x−yGe_xC_y/Si} than in Si_1−xGe_x/Si} with the same Ge concentration for all bombardments under investigation. X-ray rocking-curve measurements have shown a strain-compensated growth in Si_1−x−yGe_xC_y/Si}, whereas Si_1−xGe_x/Si} samples have shown a growth with strain accommodation.     

The growth of epitaxial Cd1−xMnxTe films by hot-wall evaporation

In this paper we report the first attempt to prepare epitaxial films of Cd_1−xMn_xTe semimagnetic semiconductor alloys with various compositions by hot-wall evaporation onto NaCl(001) surfaces under a vacuum of 10^-6–10^-7 Torr. The films were deposited from vapour phases of different compositions with various fluxes of CdTe and manganese atoms used as source materials. Both the growth rate and the manganese content were investigated under various conditions.

The structure of the films was examined using transmission electron microscopy and X-ray diffractometry as a function of the temperature of the NaCl substrate between 150 and 450 °C. At low temperatures, polycrystalline films were obtained. The films became highly ordered with increasing substrate temperature. It was found that the films had (001) or (011) planes lying parallel to the NaCl(001) surface and exhibited a cubic sphalerite structure.

No segregation of manganese was found from electron microprobe measurements. Discontinuous growth and the morphology of the early stages of growth were studied using extraction replica electron microscopy. The growth was found to be favoured by a three-dimensional mechanism.     

Low temperature UV/ozone oxidation formation of HfSiON gate dielectric

Physical and electrical properties of hafnium silicon oxynitride (HfSi_xO_yN_z) dielectric films prepared by UV ozone oxidation of hafnium silicon nitride (HfSiN) followed by annealing to 450 °C are reported. Interfacial layer growth was minimized through room temperature deposition and subsequent ultraviolet/ozone oxidation. The capacitance–voltage (C–V) and current–voltage (I–V) characteristics of the as-deposited and annealed HfSi_xO_yN_z are presented. These 4 nm thick films have a dielectric constant of 8–9 with 12 at.% Hf composition, with a leakage current density of 3×10⁻⁵ A/cm² at V_fb+1 V. The films have a breakdown field strength >10 MV/cm.     

Characterization and microstructure of highly preferred oriented lead barium titanate thin films on MgO (100) by sol-gel process

Highly preferred oriented lead barium titanate (Pb_1−x,Ba_x)TiO₃ thin film, with particular emphasis on (Pb_0.5,Ba_0.5)TiO₃, can be obtained by spin-coating on MgO (100) substrate by using the precursor sol, which was synthesized from acetylacetone chelating with titanium isopropoxide and ethylene glycol as a solvent, in the sol-gel process. Film thickness, pyrolysis temperature and heating rate were studied systemically to investigate their influences on the formation of preferred oriented thin films. The highly preferred (001)/(100) oriented thin film could be obtained by the pyrolysis of wet film at 500 °C and annealing at 600 °C at a slow heating rate of 5 °C/min. It is confirmed that the tetragonal perovskite structure of the titanate ceramic decreases with an increase of Ba content in (Pb_1−x,Ba_x)TiO₃. The (001)/(100) oriented films were synthesized from all compositions between x = 0.2 and x = 0.8, at a crystallization temperature of 600 °C. In particular, for the Ba content in the range of x = 0.50.6, highly preferred (001)/(100) planes were observed.     

Interpretation of ductile fracture toughness temperature dependence of a low strength steel in terms of a local approach

Fracture toughness and notch ductility tests were performed on two heats of A508 steel tested over the temperature range between 100°C and 450°C. Both types of experiments showed that the materials exhibited a ductility trough at temperatures close to 300°C. At this temperature tensile tests showed the existence of strain aging phenomenon. Tests on axisymmetric notched tensile specimens were used to derive the critical value for void growth, R_c/R₀, used in a model for ductile fracture. A good correlation between J_Ic and R_c/R₀ was observed. This was used to predict the variations of J_Ic with temperature. A reasonable agreement between the predicted values and the experimental results is observed.     

Preparation of Pt-PtOx thin films as electrode for memory capacitors

Pt-PtO_x thin films were prepared on Si(100) substrates at temperatures from 30 to 700°C by reactive r.f. magnetron sputtering with platinum target. Deposition atmosphere was varied with O₂/Ar flow ratio. The deposited films were characterized by X-ray diffraction, X-ray photoelectron spectroscopy and scanning electron microscopy. Resistively of the deposited films was measured by d.c. four probe method. The films mainly consisted of amorphous PtO and Pt₃O₄ (or Pt₂O₃) below 400°C, and amorphous Pt was increased in the film as a deposition temperature increased to 600°C. When deposition temperature was thoroughly increased, (111) oriented pure Pt films were formed at 700°C. Compounds included in the films strongly depended on substrate temperature rather than O₂/Ar flow ratio. Electrical resistivity of Pt-PtO_x films was measured to be from the order of 10⁻¹ Ω cm to 10⁻⁵ Ω cm, which was related to the amount of Pt phase included in the deposited films.     

Sb segregation in Si and SiGe: effect on the growth of self-organised Ge dots

The segregation and incorporation coefficients of antimony (Sb) in Si_1−xGe_x buried doped layers were investigated simultaneously using specific temperature sequences. We first showed an exponential kinetic evolution of Sb surface segregation in Si. In contrast such an evolution could not be observed in Si_1−xGe_x because of the Sb thermal desorption, at growth temperatures of 550°C. We also showed an increased surface segregation increasing with the partial Ge concentration in Si_1−xGe_x alloys, which was explained by a decrease of the kinetic barrier for Sb atoms mobility. It was, therefore, possible to determine the growth conditions to obtain a Si_1−xGe_x doped layer with a controlled incorporation level and a negligible surface segregation obtained by the thermal desorption of the Sb surface coverage. Finally, using Sb surfactant mediated growth, we found Ge dots with lateral sizes reduced by a factor of 2.8 and density multiplied by a factor of four as compared to dots directly deposited on Si(001).     

Diffusion barrier properties of sputtered TaNx between Cu and Si using TaN as the target

TaN_x films sputtered from a TaN target were used as diffusion barriers between Cu thin films and Si substrates. Material characteristics of TaN_x films and metallurgical reactions of Cu/TaN_x/Si systems annealed in the temperature range 400–900 °C for 60 min were investigated by X-ray diffraction, X-ray photoelectron spectroscopy, scanning electron microscopy, cross-sectional transmission electron microscopy, and sheet resistance measurements. We found that the deposition rate decreased with increasing bias. TaN, β-Ta, and Ta₂N phases appeared and/or coexisted in the films at specific biases. A step change in N/Ta ratio was observed whenever a bias was applied to the substrate. After depositing a copper overlayer, we observed that the variation percentage of sheet resistance for Cu (70 nm)/TaN_x (25 nm, x=0.37 and 0.81)/Si systems stayed at a constant value after annealing up to 700 °C for 60 min; however, the sheet resistance increased dramatically after annealing above 700 and 800 °C for Cu/TaN_0.37/Si and Cu/TaN_0.81/Si systems, respectively. At that point, the interface was seriously deteriorated and formation of Cu₃Si was also observed.     

The influence of titanium nitride sputter deposition temperature on surface-hardened 2.5% silicon iron

Surface-hardened silicon iron (SiFe), with 2.5% Si, was sputter deposited with TiN by a reactive d.c. magnetron sputtering process. In this work we have studied the influence of the substrate temperature on the adhesion, hardness and the chemical composition of the TiN film and the substrate hardened structure during sputtering. Glow discharge optical spectrometry (GDOS) and electron microprobe analysis (EPMA), together with a scratch tester and a Vickers' hardness instrument, were used to study the chemical composition depth profiles, hardness and the critical load C_L at the TiN-substrate interface. The substrate surface hardness drops from 820 to 225 HV after TiN deposition as a result of decarburization of the SiFe surfaces. This drop in hardness level was found for all the substrate deposition temperatures, between 200 and 600 °C. The TiN surface hardness reached a maximum of 2700 HV at a substrate temperature of 300 °C and dropped to 1400 HV for a substrate temperature of 600 °C. At 200 °C substrate temperature the TiN surface hardness is 2100 HV which is considered to be a normal hardness for stoichiometric TiN film. GDOS chemical composition depth profiles show changes in the relative intensities at the interface when the substrate deposition temperature was at 400 and 550 °C for the elements carbon, nitrogen, titanium, silicon and iron. The O:Ti ratio increases from 200 to 300 °C and decreases between 300 and 500 °C. Above 500 °C, O:Ti starts to increase again. EPMA shows that the TiN surface hardness and critical load values reach a maximum when the interface C:Ti ratio is 0.1 at a deposition temperature of about 300 °C.     

Transmission electron microscopy of annealed a-Si1−xCx:H/Al films with different Al grain sizes

The crystallization behavior of a-Si_1−xC_x:H/Al films after annealing has been investigated by transmission electron microscopy and Raman scattering. It is found that the crystallization process is complex and non-uniform, and that both equiaxial and branching Si grains with many twins and stacking faults arise at annealing temperatures as low as 250 °C. Both fine polycrystalline β-SiC grains and fractal-like -SiC aggregates are first observed in a few regions in a-Si_1−xC_x:H/Al films annealed at 350 °C. The increase of the Al grain size can cause a decrease in the crystallization temperature and a rise in the grain growth rate of Si. At higher annealing temperatures, the reaction process SiC+Al→Al₄C₃+Si is predominant.     

Deposition of Sm2O3 doped CeO2 thin films from Ce(DPM)4 and Sm(DPM)3 (DPM=2,2,6,6-tetramethyl-3,5-heptanedionato) by aerosol-assisted metal–organic chemical vapor deposition

Samarium-doped ceria (SDC) thin films were prepared from Sm(DPM)₃ (DPM = 2,2,6,6-tetramethyl-3,5-heptanedionato) and Ce(DPM)₄ using the aerosol-assisted metal–organic chemical vapor deposition method. -Al₂O₃ and NiO-YSZ (YSZ = Y₂O₃-stabilized ZrO₂) disks were chosen as substrates in order to investigate the difference in the growth process on the two substrates. Single cubic structure could be obtained on either -Al₂O₃ or NiO-YSZ substrates at deposition temperatures above 450 °C; the similar structure between YSZ and SDC results in matching growth compared with the deposition on -Al₂O₃ substrate. A typical columnar structure could be obtained at 650 °C on -Al₂O₃ substrate and a more uniform surface was produced on NiO-YSZ substrate at 500 °C. The composition of SDC film deposited at 450 °C is close to that of precursor solution (Sm : Ce = 1 : 4), higher or lower deposition temperature will both lead to sharp deviation from this elemental ratio. The different thermal properties of Sm(DPM)₃ and Ce(DPM)₄ may be the key reason for the variation in composition with the increase of deposition temperature.     

Titanium–aluminum–nitride coatings for satellite temperature control

Intense solar irradiation, radiative cooling to outer space, and internal heat generation determine the equilibrium temperature of a spacecraft. The balance between the solar absorption and thermal emittance of the surface is therefore crucial, in particular for autonomous parts directly exposed to the solar radiation and thermally insulated from the main thermal mass of the spacecraft. The material composition but also the coating thickness are found to influence the equilibrium temperature of an object in space. In this paper we report on a systematic search for a suitable composition and thickness of Ti_xAl_yN_z alloy coatings prepared by reactive, unbalanced magnetron sputtering from targets consisting of differently sized titanium and aluminum sectors. The films were deposited on glass, glassy carbon, aluminum sheet metal, and on sputtered aluminum and Ti_xAl_(1−x) films on glass. The stoichiometry and sheet resistance of the films was determined with Rutherford backscattering and four-point probe measurements respectively. Reflectance spectra for the visible and infrared spectral ranges were used to obtain average solar absorptance and thermal emittance values used in model calculations of the equilibrium temperature. Neglecting internal heat contributions, the lowest calculated equilibrium temperature in orbit around the Earth, 32.5°C, was obtained for a 505-nm-thick Ti_0.14Al_0.47N_0.40-film.     

Sintering behavior and microwave dielectric properties of Bi3(Nb1−xTax)O7 solid solutions

Solid solutions of Bi₃(Nb_1−xTa_x)O₇ (x = 0.0, 0.3, 0.7, 1) were synthesized using solid state reaction method and their microwave dielectric properties were first reported. Pure phase of fluorite-type could be obtained after calcined at 700 °C (2 h)⁻¹ between 0 ≤ x ≤ 1 and Bi₃(Nb_1−xTa_x)O₇ ceramics could be well densified below 990 °C. As x increased from 0.0 to 1.0, saturated density of Bi₃(Nb_1−xTa_x)O₇ ceramics increased from 8.2 to 9.1 g cm⁻³, microwave permittivity decreased from 95 to 65 while Q_f values increasing from 230 to 560 GHz. Substitution of Ta for Nb modified temperature coefficient of resonant frequency τ_f from −113 ppm °C⁻¹ of Bi₃NbO₇ to −70 ppm °C⁻¹ of Bi₃TaO₇. Microwave permittivity, Q_f values and τ_f values were found to correlate strongly with the structure parameters of fluorite solid solutions and the correlation between them was discussed in detail. Considering the low densified temperature and good microwave dielectric proprieties, solid solutions of Bi₃(Nb_1−xTa_x)O₇ ceramics could be a good candidate for low temperature co-fired ceramics application.     

Synthesis and characterization of catalysts produced from paper mill sludge. I. Determination Of NOx removal capability

Characteristics and catalytic properties of a series of carbon-based catalysts (CBCs) produced from paper mill sludge were evaluated. The major processes involved in the production of the catalysts were chemical activation, impregnation, pyrolysis, and post pyrolysis rinsing. The porous structure, catalytic activity and thermostability of the catalysts were tailored during the production stage by introducing hetero-atoms (zinc chloride, and ferric nitrate) in the carbon structure. Characterization of the produced CBCs included determination of the surface area, pore size, and pore size distribution (PSD) from standard N₂-adsorption isotherm data. The extent of graphitization and the presence of metal crystals were identified from X-ray diffraction (XRD). The limit of the catalyst gasification was estimated from thermogravimetric analysis (TGA) conducted in an oxidized environment. The NO_x reduction capability of the produced catalysts was evaluated in the presence of carbon monoxide using a fixed bed reactor. The reaction temperature ranged from 300 to 500°C. It was shown that paper mill sludge is an excellent precursor for the production of CBCs with NO_x removal capability of 66–94%. The catalytic capability of the produced CBCs varied according to the method of production, catalyst surface properties (surface area, pore structure, PSD), metal composition and reaction temperature. The highest NO_x removal capacity was observed for the catalytic reactions carried out at 400°C. The mesoporous catalyst produced with a Zn:Fe molar ratio of 1:0.5 exhibited the maximum NO_x removal catalytic activity of 94%.     

Surface Preparation of Aluminum Nitride for Metallization: Effect of Temperature on Surface Reactivity

The current aqueous cleaning step in the surface preparation of aluminum nitride (AlN) prior to metallization causes performance and reliability issues for the substrates used for microelectronic packaging due to surface reactions. These issues limit the use of AlN and its replacing of BeO, an environmentally hazardous material currently used. The aim of this investigation was to determine the effects of different solutions on the surface of AlN substrates under varying conditions at times up to 2419.2 ks (28 days). Concentration of the solutions, temperature, and immersion time were varied for the AlN samples in the solutions. Both elevated temperatures (50°C and 90°C) and low temperatures (5°C) were investigated.

Four general types of behavior were observed: minor changes in average surface roughness and microstructure, linear change in average surface roughness and pitted grains, nonlinear change in average surface roughness and product formation on AlN surface, and miscellaneous change in average surface roughness with surface product formation.

The surface roughening kinetics were very complex due to changes in both the reaction product morphology and reaction mechanism with temperature, solvent, and pH for a specific solvent. Minor changes in average surface roughness and microstructure were observed for HCl pH = 5, H₂ SO₄ pH = 5, NaOH pH = 8, NaOH pH = 10, NaOH pH = 12, deionized water and Alfred tap water at 5°C, HCl pH = 3 and oleic acid at 50°C and citric acid and oleic acid at 90°C. Linear changes in average surface roughness and pitted grains were observed for HCl pH = 2 and H₂SO₄ pH = 3 at 50°C and HCl pH = 2, H₂SO₄ pH = 3, and deionized water at 90°C. Non-linear change in average surface roughness and product formation on AlN surface was observed for HCl pH = 5, NaOH pH = 8 and Alfred tap water at 50°C and HCl pH = 5 and H₂SO₄ pH = 2 at 90°C. Miscellaneous changes in average surface roughness with surface product formation were observed for H₂SO₄ pH = 2, H₂SO₄ pH = 5, NaOH pH = 10, NaOH pH = 12, citric acid, Micro-90 and deionized water at 50°C and HCl pH = 3, H₂SO₄ pH = 5, NaOH pH = 8, NaOH pH = 10, NaOH pH = 12, Micro-90 and Alfred tap water at 90°C.