Design and analysis of an adaptive board-to-board dynamic holographic interconnect

We describe the design and analysis of an adaptive free-space optical interconnect between two circuit boards in a standard electronic backplane. An array of vertical-cavity surface-emitting lasers is used as the transmitter, and this communicates with a detector array on the receiver circuit board. Routing is achieved with a holographic crossbar that has a ferroelectric liquid-crystal spatial light modulator to display binary phase computer-generated holograms. A detailed analysis of a 48-channel interconnect designed to operate at 1 (Gbytes/s)/channel indicates that such a switch will operate successfully given typical components and card misalignments.     

Design of an optical interconnect for photonic backplane applications

A compact alignment-tolerant interconnect has been developed for use within a prototype modulator-based free-space photonic backplane. The interconnect design encompasses several unique features. Microlens arrays are used, and several beams share each microlens by clustering the optical input-output in a small field about the optical axis of each lens. For simplifying the layout, the optical input and output of each smart-pixel array are clustered separately, thereby allowing a Fourier plane patterned-mirror array to be used in the beam-combination optics. This allows a suitable balance between high interconnection densities and reasonable optical relay distances between adjacent boards to be achieved. The primary advantages of this scheme are the simplicity of the optical design and its alignability, making it ideally suited for high-density interconnection applications.     

Gradient-index lens optical backplane

An optical backplane design based on gradient-index lenses is described. This design is based on a tapped bus architecture and offers an affordable and efficient card-to-card communication method. It was found that the use of gradient-index lenses reduced the alignment tolerances by a factor of 10 over an equivalent free-space model. Results from simulation and from the construction of a five-node, proof-of-concept demonstration unit are presented. The excess loss measured for the 25 different combinations varied from a low of 0.7 dB to a high of 4.0 dB.     

Design and characterization of a microchannel optical interconnect for optical backplanes

The design, modeling, and experimental characterization of a microchannel-based free-space optical interconnect is described. The microchannel interconnect was used to implement a representative portion of an optical backplane that was based on field-effect transistor, self-electro-optic device smart-pixel transceivers. Telecentric relays were used to form the optical interconnect, and two modes based on two different optical window clusterings were implemented. The optical system design, including the optical geometry for different degrees of clustering of windows supported by a lenslet relay and the image mapping associated with a free-space optical system, is described. A comparison of the optical beam properties at the device planes, including the spot size and power uniformity of the spot array, as well as the effects of clipping and misalignment for the different operating modes, is presented. In addition, the effects of beam clipping and misalignment for the different operating modes is presented. We show that microchannel free-space optical interconnects based on a window-clustering scheme significantly increase the connection density. A connection density of 2222 connections/cm(2) was achieved for this prototype system with 2 x 2 window clustering.     

Design and implementation of a modulator-based free-space optical backplane for multiprocessor applications

Design and implementation of a free-space optical backplane for multiprocessor applications is presented. The system is designed to interconnect four multiprocessor nodes that communicate by using multiplexed 32-bit packets. Each multiprocessor node is electrically connected to an optoelectronic VLSI chip which implements the hyperplane interconnection architecture. The chips each contain 256 optical transmitters (implemented as dual-rail multiple quantum-well modulators) and 256 optical receivers. A rigid free-space microoptical interconnection system that interconnects the transceiver chips in a 512-channel unidirectional ring is implemented. Full design, implementation, and operational details are provided.     

Design, implementation, and characterization of an optical power supply spot-array generator for a four-stage free-space optical backplane

The design and implementation of a robust, scalable, and modular optical power supply spot-array generator for a modulator-based free-space optical backplane demonstrator is presented. Four arrays of 8 x 4 spots with 6.47-mum radii (at 1/e(2) points) pitched at 125 mum in the vertical direction and 250 mum in the horizontal were required to provide the light for the optical interconnect. Tight system tolerances demanded careful optical design, robust optomechanics, and effective alignment techniques. Issues such as spot-array generation, polarization, power efficiency, and power uniformity are discussed. Characterization results are presented.     

Optomechanics for a four-stage hybrid-self-electro-optic-device-based free-space optical backplane

We present the design, fabrication, and testing of optomechanics for a free-space optical backplane mounted in a standard 6U VME backplane chassis. The optomechanics implement an optical interconnect consisting of lenslet-to-lenslet, as well as conventional lens-to-lens, links. Mechanical, optical, electrical, thermal, material, and fabrication constraints are studied. Design trade-offs that affect system scalability and ease of assembly are put forward and analyzed. Novel mounting techniques such as a thermal-loaded interference-fitted lens-mounting technique are presented and discussed. Diagnostic tools are developed to quantify the performance of the optomechanics, and experimental results are given and analyzed.     

Optical illustration of a varied fractional Fourier-transform order and the Radon-Wigner display

Based on an all-optical system, a display of a fractional Fourier transform with many fractional orders is proposed. Because digital image-processing terminology is used, this display is known as the Radon-Wigner transform. It enables new aspects for signal analysis that are related to time- and spatial-frequency analyses. The given approach for producing this display starts with a one-dimensional input signal although the output signal contains two dimensions. The optical setup for obtaining the fractional Fourier transform was adapted to include only fixed free-space propagation distances and variable lenses. With a set of two multifacet composite holograms, the Radon-Wigner display has been demonstrated experimentally.     

Board-to-Board Free-Space Optical Interconnections Passing through Boards for a Bookshelf-Assembled Terabit-Per-Second-Class ATM Switch

We propose free-space optical interconnections for a bookshelf-assembled terabit-per-second-class ATM switch. Thousands of arrayed optical beams, each having a rate of a few gigabits per second, propagate vertically to printed circuit boards, passing through some boards, and are connected to arbitrary transmitters and receivers on boards by polarization controllers and prism arrays. We describe a preliminary experiment using a 1-mm-pitch 2 x 2 beam-collimator array that uses vertical-cavity surface-emitting laser diodes. These optical interconnections can be made quite stable in terms of mechanical shock and temperature fluctuation by the attachment of reinforcing frames to the boards and use of an autoalignment system.     

Design, implementation, and characterization of a hybrid optical interconnect for a four-stage free-space optical backplane demonstrator

A four-stage unidirectional ring free-space optical interconnect system was designed, analyzed, implemented, and characterized. The optical system was used within a complementary metal-oxide semiconductor-self-electro-optic-effect-device-based optical backplane demonstrator that was designed to fit into a standard VME chassis. This optical interconnect was a hybrid microlens-macrolens system, in which the microlens relays were arranged in a maximum lens-to-waist configuration to route the optical beams from the optical power supply to the transceiver arrays, while the macrolens optical relays were arranged in a telecentric configuration to route optical signal beams from stage to stage. The following aspects of the optical system design are discussed: the optical parameters for the hybrid optical system, the image mapping of the two-dimensional array of optical beams from stage to stage, the alignment tolerance of the hybrid relay system, and the power budget of the overall optical interconnect. The implementation of the optical system, including the characterization of optical components, subsystem prealignment, and final system assembly, is presented. The two-dimensional array of beams for the stage-to-stage interconnect was adjusted with a rotational error of <0.05 degrees and a lateral offset error of <3.5 mum. The measured throughput is in good agreement with the lower-bound predictions obtained in the theoretical results, with an optical power throughput of -20.2 dB from the fiber input of the optical power supply to the modulator array and -25.5 dB from the fiber input to the detector plane.     

Implementation of a compact, four-stage, scalable optical interconnect for photonic backplane applications

We report on the implementation of a dense 512-beam free-space optical interconnect linking four optoelectronic VLSI chips at the backplane level. The system presented maximizes the positioning tolerances of the components by use of slow f-number (f/16) Gaussian beams and oversized apertures. A beam-clustering scheme whereby a 4 x 4 array of beams is transmitted by each minilens is used to provide a high channel density. A modular approach is used to decrease the number of degrees of freedom in the system and achieve passive alignment of the modules in the final integration phase. A design overview as well as assembly and experimental results are presented.     

Field-programmable smart-pixel arrays: design, VLSI implementation, and applications

A smart-pixel array is a two-dimensional array of optoelectronic devices that combine optical inputs and outputs with electronic processing circuitry. A field-programmable smart-pixel array (FP-SPA) is a smart-pixel array capable of having its electronic functionality dynamically programmed in the field. Such devices could be used in a diverse range of applications, including optical switching, optical digital signal processing, and optical image processing. We describe the design, VLSI implementation, and applications of a first-generation FP-SPA implemented with the 0.8-microm complementary metal-oxide semiconductor-self-electro-optic effect device technology made available through the Lucent Technologies-Advanced Research Projects Agency Cooperative (Lucent/ARPA/COOP) program. We report spice simulations and experimental results of two sample applications: In the first application, we configure this FP-SPA as an array of free-space optical binary switches that can be used in optical multistage networks. In the second, we configure the device as an optoelectronic transceiver for a dynamically reconfigurable free-space intelligent optical backplane called the hyperplane. We also describe the testing setup and the electrical and the optical tests that demonstrate the correct functionality of the fabricated device. Such devices have the potential to reduce significantly the need for custom design and fabrication of application-specific optoelectronic devices in the same manner that field-programmable gate arrays have largely eliminated the need for custom design and fabrication of application-specific gate arrays, except in the most demanding applications.     

Misalignment correction for optical interconnects using vertical cavity semiconductor optical amplifiers

In board-to-board optical interconnects, the misalignment between the board and the backplane connections can cause both optical loss and interchannel cross talk. A vertical cavity semiconductor optical amplifier (VCSOA) is proposed to correct optical misalignment in an optical connector between the board and the backplane. Angular or lateral misalignment can be corrected with the designed module. The correction ability is determined by the acceptance angle of the VCSOA, which was characterized to be 9.4 degrees full angle at a 3 dB gain drop for a 30 microW optical signal at 1 GHz. The lateral misalignment correction ability is 0.16f, where f is the focal length of the mini lens to converge the input light onto the VCSOA.     

Non-display applications and the next generation of liquid crystal over silicon technology

The next generation of applications for liquid crystal (LC) over silicon technology will be non-display oriented systems such as adaptive optical interconnects, optical switches and optical image processors. These new non-display applications have a different set of material parameters, which means that existing display-based materials are not entirely optimal. This is particularly the case when the application is driven by phase modulation at high frame rates (more than 1 kHz). An example of such a non-display application is in adaptive optical interconnects. Optical data transmission between printed circuit boards is becoming more and more important as the data rate in electronic systems increases into the gigahertz region. One way of avoiding the data bottlenecks in board to board interconnects is to use optical links to transmit the data. Recent research into free-space optical links has shown that a high level of manufacturing tolerance must be used to maintain the link. However, one way of avoiding these limitations is to use a reconfigurable LC phase hologram as a beam-steering element to compensate for movement between the boards and maintain the optical data path.     

Integrated three-dimensional optical multilayer using free-space optics

An integrated three-dimensional optical multilayer system for optical data communications is presented. It is based on the use of free-space optical light propagation and combines two integration principles, namely, planar and stacked integration. The combination of both integration schemes aims at a maximal design flexibility for complex geometric layouts. On the other hand, packaging issues that stem from assembly and tolerance have to be considered. Here we describe the basic concept and demonstrate the implementation of an optical interface module in a processor-memory bus.     

Polarization-controlled multistage switch based on polarization-selective computer-generated holograms

We describe a polarization-controlled free-space optical multistage interconnection network based on polarization-selective computer-generated holograms: optical elements that are capable of imposing arbitrary, independent phase functions on horizontally and vertically polarized monochromatic light. We investigate the design of a novel nonblocking space-division photonic switch architecture. The multistage-switch architecture uses a fan-out stage, a single stage of 2 x 2 switching elements, and a fan-in stage. The architecture is compatible with several control strategies that use 1 x 2 and 2 x 2 polarization-controlled switches to route the input light beams. One application of the switch is in a passive optical network in which data is optically transmitted through the switch with a time-of-flight delay but without optical-to-electrical conversions at each stage. We have built and characterized a proof-of-principle 4 x 4 free-space switching network using three cascaded stages of arrayed birefringent computer-generated holographic elements. Data modulated at 20 MHz/channel were transmitted through the network to demonstrate transparent operation.     

Parallel free-space optical interconnect based on arrays of vertical-cavity lasers and detectors with monolithic microlenses

We investigate the use of low-threshold 980-nm vertical-cavity surface-emitting lasers for free-space optical interconnects. The vertical-cavity surface-emitting lasers and backilluminated detectors are monolithically integrated with microlenses on the back sides of the growth substrates to eliminate the necessity of external optics. With a channel pitch of 250 mum, an interconnect length between boards of the order of 5 to 10 mm with a ?50-mum lateral alignment tolerance can be achieved without external relay optics. The complete link is modeled to predict the system's efficiency and maximum bit rate. Data transmission at 500 Mbits/s per channel is demonstrated. The data rate was limited by parasitics, not the inherent bandwidth of the laser diodes.     

512-channel vertical-cavity surface-emitting laser based free-space optical link

A vertical-cavity surface-emitting laser based bidirectional free-space optical interconnect has been implemented to interconnect two printed circuit boards. A total of 512 clustered channels with a density of 2844 channels/cm2 are transmitted over a distance of 83 mm. The optical interconnect is a combination of refractive microlenses and diffractive minilens relays.     

Real-time binary phase holograms on a reflective ferroelectric liquid-crystal spatial light modulator

A ferroelectric liquid-crystal spatial light modulator with an active silicon backplane is used to implement reconfigurable reflective phase holograms. Optical results are presented for an optimized computergenerated Fourier hologram.