激光喷射钎料球键合焊点热循环试验研究

为研究激光喷射钎料球键合焊点的可靠性,用Sn3.0Ag0.5Cu钎料球对Au/Cu焊盘进行了激光喷射钎料键合试验,采用微强度测试仪、扫描电子显微镜、能谱分析仪研究了热循环条件对接头强度以及界面微观组织演变的影响.结果表明：采用激光喷射钎料键合技术焊盘表面Au层不能完全溶入钎料中,导致在界面处形成AuSn2＋AuSn4多...     

合金元素对Cu/Sn-/Cu回流焊焊点界面微观结构及剪切性能的影响

选用Sn64Bi35Ag1、Sn64.7Bi35Ag0.3和Sn99Ag0.3Cu0.7三种不同的钎料进行回流焊焊接试验,研究高Bi元素、低Ag元素钎料及低Ag钎料对Sn基钎料焊点微观组织及剪切性能的影响.结果表明:各焊点界面处均生成了 一层扇贝状的Cu6Sn5金属间化合物,在含Bi元素的钎料焊点中,Bi元素在焊点界面及内部聚集,导致界面处金属间化合物层的厚度增加,大量富Bi相呈脆性,降低钎料中的Ag含量对焊点中Bi元素的富集现象有减弱作用.Sn99Ag0.3Cu0.7钎料焊点界面处的金属间化合物层厚度最小,且焊点内部形成了细小的Ag3Sn相颗粒,共晶组织呈均匀分布,使得焊点剪切性能最优,其剪切强度达20.4 MPa.     

时效对无铅焊料Ni-P/Cu焊点的影响

研究了150℃等温时效为62Sn36Bp2Ag/Ni-P/Cu及共晶SnAg/Ni-P/Cu表面贴装焊点微结构及塑切强度的影响,结果表明,在钎料与Ni-P间的界面存在Ni3Sn4金属间化合物层,其厚度随时效时间增加,Ni-P层的厚度减小,时效后,SnPbAg,SnAg焊点的剪切强度下降,对于SnAg焊点,时效250h后其剪切强度剧烈下降,断裂发生在Ni-P/Cu界面上,在长时间时效后焊点一侧的Ni-P层中P的含量较主可能是Ni-P/Cu结合强度变差的主要原因,SnPbAg焊点保持着较高的剪切强度。     

再流条件对Ni颗粒增强复合钎料组织形态的影响

主要针对不同的再流次数带来的不同热输入对Ni颗粒增强复合钎料IMC形态的影响进行了深入研究。由前一阶段研究表明，决定Ni颗粒增强复合无铅钎料组织变化的关键因素是钎料的钎焊温度与钎料熔点的温度差△T以及在熔点以上保温时间t。其本质即外界对钎料的热输入量的大小。随着热输入的增加，Ni颗粒周围的IMC以及钎料/基板界面处的IMC都相应变化发展。由于Ni颗粒的加入。基板＼钎料界面层的结构形态均与Sn-Ag共晶钎料有较大不同，Ni与cu6Sn5的相互作用起到了关键影响。界面层厚度的变化随再流次数增加呈现线性增长。     

激光加热条件下 SnPb共晶钎料与Au/Ni/Cu焊盘界面反应动力学

激光重熔在电子封装领域中SnPb共晶钎料凸点制作方面存在极大的优势。采用扫描电子显微镜（SEM）分析了激光加热条件下SnPb共晶钎料与Au/Ni/Cu焊盘之间的界面反应，探讨了钎料中的溶解与扩散动力学。结果表明：CnPb共晶钎料在激光加热瞬间与Au/Ni/Cu焊盘中的Au发生反应，生成Au-Sn金属间化合物，其形貌和分布与激光输入能量密切相关；随着激光输入能量的增加，Au-Su化合物由边境连续层状转变为针状，最后以细小颗粒弥散分布在钎料内部。     

AlNP/Al复合材料与6061Al低温连接组织演变机理及力学性能EI北大核心CSCD

为了防止在高温下连接电子器件发生破坏,并改善常用的低温SnAgCu钎料对母材25%(体积分数)AlNP/Al复合材料与6061Al合金表面的润湿性,对母材表面进行磁控溅射Ni薄层或Ti/Ni双金属薄层的预金属化处理,再用SnAgCu钎料进行连接,可得到结合良好的接头。双金属化后接头两侧界面组成为母材/Ti-Al/Ti/Ti-Ni/Ni/Ni-Sn-Cu/β-Sn+Ag3Sn。不同元素之间扩散速率的差异导致了界面反应层不同位置的物相成分差异,从镀Ni层向焊缝中心方向,反应层的物相呈(Ni,Cu)3Sn,(Ni,Cu)3Sn2,(Ni,Cu)6Sn5,(Ni,Cu)3Sn4的变化趋势。Ti元素的加入可显著提高镀Ni层与母材的结合力,在250℃下保温1-5 min,钎焊双金属化处理后的母材所得接头抗剪强度可达28-35 MPa,断裂发生在β-Sn基体中。     

热循环对SnAgCu(纳米Al)/Cu焊点界面与性能影响

研究了纳米0.1%(质量分数)Al颗粒对SnAgCu无铅钎料与铜基板之间界面反应的影响,研究两种无铅钎料界面在-55~125℃热循环过程中的生长行为及其焊点力学性能变化。结果表明:随着热循环次数的增加,界面层金属间化合物的厚度明显增加,焊后界面层金属间化合物为Cu6Sn5相,在热循环过程中在Cu6Sn5和Cu基板之间出现Cu3Sn相。发现纳米Al颗粒的添加,界面层金属间化合物的厚度明显减少,纳米颗粒对界面层的生长具有明显的抑制作用。同时对焊点在热循环过程中的可靠性进行分析,发现焊点的拉伸力随着循环次数的增加逐渐降低,含纳米Al颗粒的焊点具有明显的优越性,在焊点服役期间,焊点失效路径为Cu6Sn5/Cu3Sn的界面处。     

电子组装用SnAgCu系无铅钎料的研究进展

SnAgCu钎料广泛应用在电子组装领域,被认为是传统SnPb钎料的最佳替代品。但与Sn63Pb37钎料相比,SnAgCu钎料抗氧化能力差,钎料内部及焊点界面存在脆性金属间化合物块及服役期间焊点抗蠕变、疲劳性能较低。添加合金元素和纳米颗粒可以显著改善SnAgCu钎料的组织和性能,提高焊点可靠性。这对发展新型高性能无铅钎料是一个行之有效的办法。本文结合国内外SnAgCu系无铅钎料的最新研究成果,全面阐述了合金元素和纳米颗粒等因素对钎料的润湿性、抗氧化性以及焊点显微组织和可靠性的影响,指明了该钎料目前研究中存在的问题及今后的研究方向。     

In对AgCuZnNiMn钎料显微组织和流铺性能的影响

AgCuZnNiMn钎料熔点适中、塑性好,常用于高强度、可承受冲击载荷工件的钎焊.为降低钎料熔点,向钎料中加入不同含量的In元素,并分析了In对AgCuZnNiMn钎料显微组织、熔化过程、润湿铺展性能的影响.结果表明:AgCuZnNiMn钎料主要由银基固溶体、富铜相、二者的共晶组织以及γ'(Mn,Ni)相组成;钎料凝固过程中先析出γ'(Mn,Ni)相,In含量达2.0wt.%时,组织中粗大的块状γ'(Mn,Ni)相全部转变为尺寸较小的球形颗粒状;熔体中的γ'(Mn,Ni)相可成为富铜相的形核基底,细小颗粒状γ'(Mn,Ni)相的增多对富铜相的细化具有促进作用;钎料中Zn、Mn元素在富铜相中的固溶度较银基固溶体中大,Ni元素主要分布于富铜相中,In元素分布于银基固溶体中;随In含量的增加,AgCuZnNiMn钎料的固相和液相温度均降低,但固-液温度区间无明显变化;钎料的润湿铺展面积随In含量增加而增大,当In含量为1.5wt.%时铺展面积达到峰值.     

Cu基板表面镀镍浸金保护层对无铅焊点可靠性的影响

结合Sn-3.5Ag和Sn-3.0Ag-0.5Cu两种无铅钎料研究了镀镍浸金层(Electroless Nickel Immersion Gold,ENIG)表面层对焊点界面反应以及力学性能的影响。结果表明,钎焊后在Sn-3.5Ag/ENIG/Cu界面主要生成(Ni_yCu_(1-y))_3Sn_4,在Sn-3.0Ag-0.5Cu/ENIG/Cu界面主要生成(Cu_xNi_(1-x))_6Sn_5。在Sn基钎料/ENIG(Ni)/Cu界面处生成金属间化合物的种类及形貌由焊点中Cu原子含量决定。在时效过程中,ENIG表面层中Ni层有效抑制了焊点界面处金属间化合物的生长,减缓了焊点剪切性能的下降。在钎焊过程中ENIG表面层中的Au层不参与界面反应而是进入钎料基体与Sn反应,但是在时效过程中Au原子向界面迁移并造成焊点界面金属间化合物成分和焊点剪切强度的明显变化。     

三价铈离子掺杂氯化钾的光致发光性能

采用水热蒸发法制备了KCl∶Ce3+荧光粉。测量并分析了材料在室温下的真空紫外激发光谱及相应的发射光谱。结果表明激发谱显示6个峰,峰位分别为149、194、206、219、233和251nm。其中149nm的激发峰是基质吸收引起的;194、206、219、233和251nm是Ce3+离子的4f→5d跃迁引起的。发射峰显示双峰结构,峰位分别是311和326nm。此峰对应于Ce3+离子的5d→4f(2F5/2,2F7/2)跃迁。     

Fabrication and microstructures of sequentially electroplated Au-rich, eutectic Au/Sn alloy solder

An Au-rich, eutectic Au/Sn alloy was fabricated by sequential electroplating of Au and Sn, and reflowing the as-deposited Au/Sn/Au triple-layer film at 320–350 °C. Microstructures and phase compositions for the as-deposited Au/Sn/Au triple-layer film and the reflowed Au-rich, eutectic Au/Sn alloys were studied. Two Si wafers, each with the Au-rich, eutectic Au/Sn alloy solder, were bonded together. For the deposited Au/Sn/Au triple-layer film, reaction between Au and Sn occurs at room temperature leading to the formation of AuSn and AuSn₄. After reflowing at 320 °C, two phases remain, AuSn and Au₅Sn, with the AuSn particles distributed randomly in the Au₅Sn matrix. There are also some micropores and microcracks in the reflowed alloy. If the annealing temperature is increased to 350 °C, the Au/Sn alloy is denser and contains fewer micropores. However, microcracks remain, forming preferentially along the Au₅Sn/AuSn interface. After reflowing at 320 °C under a pressure of 13 kPa, two Si wafers are joined using the Au-rich, eutectic Au/Sn alloy solder. The solder is in intimate contact with the Si wafers; however, there are some micropores within the solder. After reflowing at 350 °C, the bond is quite good, without microcracks or micropores at the Si wafer/solder interface or within the solder.     

Transient liquid phase bonding of Sn–Bi solder with added Cu particles

The aim of this study was to apply the transient liquid phase (TLP) bonding technique to low-temperature Sn–Bi-based solders to enable their use in high-temperature applications. The microstructure of the eutectic Sn–Bi solders with and without added Cu particles was investigated with the solders sandwiched between two Cu substrates. The flux of the Cu atoms successfully consumed the Sn phase and resulted in the formation of Sn–Cu intermetallic compounds and a Bi-rich phase in the solder joint. This caused the melting point of the solder joint to increase from 139 to 201 °C. The results of this study show the potential of using low-temperature solders in high-temperature applications. This study also provides new insight into the advantages of using particles in the TLP bonding process.     

Interfacial reaction between Au and Sn films electroplated for LED bumps

Au-20 wt% Sn eutectic solder is used as bumps in flip chip package of power LED (Light Emitting Diode) due to its excellent properties. The Au/Sn dual-layer films were fabricated on Si wafer by pulse electroplating of Au and Sn sequentially, and the solid?Csolid interfacial reaction during aging and the eutectic reaction during reflow soldering were investigated in the present work. After storage at room temperature for 1 week, three phases of AuSn, AuSn₂ and AuSn₄ were sequentially formed at the Au/Sn (10 ??m/10 ??m) interface, and the thickness of this reaction region was about 5 ??m. Firstly, AuSn₄ was formed at the Au/Sn interface, and then AuSn and AuSn₂ were formed at the Au/AuSn₄ interface. After aging at 150 °C for 5 and 10 h, a similar layered structure of AuSn/AuSn₂/AuSn₄ was also observed. Due to the faster diffusion of Au to Sn layer, all the Sn elements were consumed after aging at 150 °C for 15 h and AuSn₄ layer gradually transformed into AuSn and AuSn₂ layers. For the specimen of Au/Sn (9 ??m/6 ??m) films on Si chip, a bamboo-shoot-like microstructure of Au₅Sn/AuSn/AuSn₂ was formed in the reaction region after reflowed at 280 °C for 10 s; while a typical two-phase (Au₅Sn and AuSn) eutectic microstructure was formed after reflowed at 280 °C for 60 s.     

Influences of Ag and Au Additions on Structure and Tensile Strength of Sn-5Sb Lead Free Solder Alloy

It is important, for electronic application, to decrease the melting point of Sn-5Sb solder alloy because it is relatively high as compared with the most popular eutectic Pb-Sn solder alloy. Adding Au or Ag can decrease the onset melting temperature （233℃） of this alloy to 203,5℃ and 216℃, respectively. The results indicate that the Sn-5Sb-i.5Au alloy has very good ultimate tensile strength （UTS）, ductility, and fusion heat, which are better than both those of the Sn-5Sb-3.SAg and Sn-5Sb alloys. The formation of intermetallic compounds （IMCs） AuSn4 and Ag3Sn enhanced the SbSn precipitates in the solidification microstructure microstructure stability, while retained the formation of thus significantly improved the strength and ductility For all alloys, both UTS and yield stress （σy） increase with increasing strain rate and decrease with increasing temperature in tensile tests, but changes of ductility are generally small with inconsistent trends.     

冷却速度对Sn-Ag无铅焊料微观组织和机械性能的影响

研究了不同冷却速度下无铅焊料Sn-3．5％(质量分数)Ag合金的微观形貌(冷却速度从0．08K／s到10^4K／s)。结果表明焊料合金中二次枝晶间距随冷却速度增加而逐渐减小，且符合公式：d=atf^n，其中d为二次枝晶间距，tf是冷却时间，a和n是由材料和其成分所决定的常数，通过计算得到对于Sn-3．5％(质量分数)Ag合金其a为3．7，而n为0．43。维氏硬度测试结果表明：快速冷却条件能使焊料合金晶粒细化，其中作为强化相的金属间化合物Ag3Sn分布更加细密，从而能使整个合金机械性能得到提高。     

Fatigue crack initiation and growth in solder alloys

In modern electronic packaging, especially surface mount technology (SMT), thermal strain is usually induced between components during processing, and in service, by a mismatch in the thermal expansion coefficients. Since solder has a low melting temperature and is softer than other components in electronic packaging, most of the cyclic stresses and strains take place in the solder. Fatigue crack initiation and fatigue crack propagation are likely to occur in the solder even when the cyclic stress is below the yield stress. It is an objective of this research to study the behaviour of fatigue crack initiation and propagation in both lead‐containing solder (63Sn‐37Pb), and lead‐free solders (Sn‐3.5Ag). The effect of alloying (Cu and Bi addition), frequency, tensile hold time and temperature on low cycle fatigue (LCF) behaviour of the solders is discussed. Mechanisms of LCF crack initiation and propagation are proposed and LCF life prediction, based on the various models, is carried out.     

Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system

Au–Sn based candidate alloys have been proposed as a substitute for high-lead content solders that are currently being used for high-temperature soldering. The changes in microstructure and microhardness associated with the alloying of Ag and Cu to the Au rich side as well to the Sn rich side of the Au–Sn binary system were explored in this work. Furthermore, the effects of thermal aging on the microstructure and microhardness of these promising Au–Sn based ternary alloys were investigated. For this purpose, the candidate alloys were aged at a lower temperature, 150 °C for up to 1 week and compared with aging at 200 °C for respective durations. It was determined in this work that the candidate alloys on the Sn rich side were relatively more stable, i.e. only the aging temperature had a substantial impact on the microstructure and not the aging duration. The candidate alloys aged at 200 °C were substantially softer on the Au rich side than the candidate alloys on the Sn rich side. However, the difference in hardness narrowed down considerably between the candidate alloys on the Au rich side and the Sn rich side when subjected to aging at 150 °C.