Fe（OH）3中微量金属离子对水热合成α—Fe2O3粒径的影响

本文研究了某些金属离子（Ａｌ＾３＋、Ｍｎ＾２＋、Ｚｎ＾２＋、Ｃｒ＾２＋、Ｎｉ＾２＋、Ｃｏ＾２＋）Ｆｅ（ＯＨ）３凝胶经水热法合成的α－Ｆｅ２Ｏ３微粉颗粒大小的影响。研究结果出现，随着金属离子的浓度在一定范围内（０．０１０－０．０５０ｍｏｌ·Ｌ＾－１）的增加，α－Ｆｅ２Ｏ３颗粒有减小的趋势。其中加入Ｃｏ＾２＋（０．０５０ｍｏｌ·Ｌ＾－１）、Ｍｎ＾２＋（０．１００ｍｏｌ·Ｌ＾－１）可以得到粒径为７５ｎｍ     

液膜分离富集和测定锤液中的微量铅

用二环己基－１８－王冠－６（ＤＣ－１８－Ｃ－６）、表面活性剂ＳＰＡＮ８０、中性油ＳＩＯＯＮ－１和溶剂三氯甲烷乳状液膜体系，研究了Ｐｂ＾２＋的迁移行为。在适宜条件下，８ｍｉｎ内Ｐｂ＾２＋的迁移率达９９．４％以上，相同条件下，许多金属离子（如Ｎｉ＾２＋、Ｌｉ＾＋、Ｋ＾＋、Ｎａ＾＋、Ｃａ＾２＋、Ｍｇ＾２＋、Ｓｒ＾２＋、Ｂａ＾２＋、Ｆｅ＾３＋、ＡＬ＾３＋、Ｃｕ＾２＋、Ｚｎ＾２＋和Ｃｏ＾２＋等）均不被迁移，     

Na2Mo0.1S0.9O4（α）—Pr2（SO4）3二元系的相关系与导电性

应用差热分析、Ｘ射线粉末衍射及电测量技术对Ｎａ２Ｍｏ０．１Ｓ０．９Ｏ４（α）－Ｐｒ２（ＳＯ４）３体系进行了研究，结果表明，在Ｎａ２Ｍｏ０．１Ｓ０．９Ｏ４相中加入少量的Ｐｒ２（ＳＯ４）３就可以形成完全固熔体，且无任何相变存在，当Ｐｒ２（ＳＯ４）３含量达到４ｍｏｌ％时，电导率较纯Ｎａ２Ｍｏ０．１Ｓ０．９Ｏ４提高两个数量级（５５３Ｋ时，σ＝１．０９×１０＾－３Ｓｃｍ＾－１），同时还证明了该类导体的导电机     

等离子喷涂Cr_3C_2-NiCr及其表面化学镀Ni涂层的摩擦学特性

考察了等离子喷涂Ｃｒ３Ｃ２－ＮｉＣｒ涂层及其表面化学镀Ｎｉ镀层通过不同配副组成摩擦副的摩擦学特性,并应用ＳＥＭ、ＸＲＤ和ＸＰＳ对磨痕进行了分析．结果发现：等离子喷涂Ｃｒ３Ｃ２－ＮｉＣｒ涂层及其表面化学镀Ｎｉ镀层自配副组成摩擦副,均表现出较大的摩擦系数和磨损系数;但是,Ｃｒ３Ｃ２－ＮｉＣｒ涂层表面化学镀Ｎｉ镀层与Ｃｒ３Ｃ２－ＮｉＣｒ涂层配副组成摩擦副,在于摩擦条件下,能达到０．１２的摩擦系数和接近１０－６ｍｍ３（Ｎｍ）－１的磨损系数．上述结果是由于Ｃｒ３Ｃ２－ＮｉＣｒ涂层的磨损机理从强烈的层状颗粒剥落转变为沿气孔和微裂纹等处的颗粒断裂．     

MSnO_3和MSn_（0．5）Zr_（0．5）O_3（M＝Sr，Ba）的水热合

本文利用水热合成方法对ＭＳｎＯ３和ＭＳｎ（０．５）Ｚｒ（０．５）Ｏ３（Ｍ＝Ｓｒ，Ｂａ）的合成进行了研究，并采用ＸＲＤ、ＳＥＭ和ＩＣＰ等方法对产物进行了表征，结果表明：在Ｍ（ＯＨ）２－ＳｎＯ２（或ＳｎＯ２＋ＺｒＯ２）－ＫＯＨ体系中，当ＫＯＨ／Ｓｎ和ＫＯＨ／（Ｓｎ＋Ｚｒ）≥３０时，２６０℃下晶化５～７天，可获得ＭＳｎＯ３和ＭＳｎ（０．５）Ｚｒ（０．５）Ｏ３纯相，在Ｍ（ＯＨ）２－（ＳｎＯ２＋ＺｒＯ２）－ＫＯＨ－Ｈ２Ｏ体系中，可通过控制介质碱度来获得ＭＳｎＯ３＋ＭＺｒＯ３混合物和ＭＳｎ（０．５）Ｚｒ（０．５）Ｏ３，并根据合成规律初步探讨了反应过程．     

液膜分离富集金及其微量测定

在协同流体载体（ＴＯＡ和ＰＭＢＰ）、表面活性剂（ＳＰＡＮ８０）、膜增强剂（液体石蜡）、溶剂（煤油）和内相（ＴＵ－ＨＣｌ溶液）乳状液膜体系中，在迁移条件下，１５ｍｉｎ内Ａｕ迁移率达９９．５％以上，而许多常见的离子则不能通过液膜迁移，只有Ａｕ才能从含有ΣＲＥ＾３＋、Ａｇ＾＋、Ｐｄ＾２＋、Ｐｔ４＾＋、Ｒｈ＾３＋、Ｃｕ＾２＋、Ｆｅ＾３＋、Ａｌ＾３＋、Ｐｂ２＾＋、Ｚｎ＾２＋、Ｎｉ＾２＋、Ｍｏ＾６＋、Ｗ＾６＋     

镍合金化学镀层的阳极行为及局部腐蚀

利用电化学测试及Ｘ射线光电显微（ＸＰＳ）、扫描电镜（ＳＥＭ）等方法，研究了镍合金化学镀层在酸性介质中的阳极行为局部腐蚀，结果表明，由于Ｎｉ－Ｐ合金中磷的不均匀分布及胞界等的存在，在Ｃｌ＾－的作用下，Ｎｉ－Ｐ合金发生孔蚀。Ｎｉ－Ｐ合金表面膜由Ｎｉ（ＯＨ）２及Ｎｉ３（ＰＯ４）２组成，在开路及电位较低时，以Ｎｉ（ＯＨ）２为主，在电位较高时，以Ｎｉ３（ＰＯ４）２为主。阳极极化过程中，由于表面膜组成的改变导     

含碳Fe—Mn—Si—Cr—Ni合金形状记忆效尖的研究

研究了碳加入后对Ｆｅ－１４Ｍｎ－５Ｓｉ－８Ｃｒ－４Ｎｉ合金形状记忆效应（ＳＭＥ）的影响。结果表明，碳元素的适当加入，有助于合金的可恢复应变的提高。在３．７５￣７．５％变形量时，含碳量为０．１２％的合金的可恢复应变量可达２．５￣３％，高于超低碳合金（Ｃ〈０．０２％）。     

高电导有机金属聚合物的制备及性能研究

利用ＴＴＦＴＴ为矫合成一系列的有机金属聚合物（ＭＴＴＦＴＴ＾２－）ａ（Ｍ＝Ｎｉ,Ｃｕ,Ｆｅ）研究了它们的电性质,结果表明,在室温下,它们的电导出现在１０＾０５－０．０４Ω＾－１．ｃｍ＾－１范围内。（ＴＥＡＸＮｉＴＴＦＴＴ）ｎ是室温下聚合物中导电最高的,我们测定了它的电阻对温度的依赖关系,呈半导性质,同时对该样品还采用了ＶＳＣ的测量方法,结果表明该聚合物的电阻对温度的依赖关系在２８３～１５０Ｋ区间内     

立方A^4＋M^5＋2O7型化合物与新型负热膨胀材料

概述了立方Ａ＾４＋Ｍ＾５＋２Ｏ７型化合物的结构特点，讨论了ＡＶ２－ｘＰｘＯ７型（Ａ＝Ｚｒ或Ｈｆ；ｘ＝０．１～１．２）及其部分取代的Ａ＾４＋１－ｙＢ＾４＋ｙＶ２－ｘＰｘＯ７型（Ｂ＝Ｔｉ，Ｃｅ，Ｔｈ，Ｕ，Ｍｏ，Ｐｔ，Ｐｂ，Ｓｎ，Ｇｅ或Ｓｉ；ｙ＝０．１～０．４）和Ａ＾４＋１－ｙＣ＾１＋ｙＤ＾３＋ｙＶ２－ｘＰｘＯ７型（Ｃ为碱金属元素，Ｄ为稀土金属元素）材料的负热膨胀性能。     

Cr7C3 / Ni3Al 复合材料制备过程中碳化铬的溶解再析出行为

将真空常压烧结方法制得的Cr₃C₂-Ni₂Al 复合焊丝堆焊于碳钢表面。分析表明, 在堆焊过程中, 利用氩弧物理热和Ni-Al 反应热, Ni 与Al 化合反应生成Ni₃Al 金属间化合物, Cr₃C₂ 则发生分解, 除少部分[ C]与[Cr ]固溶于Ni₃Al 基体中外, 大部分反应析出更稳定的Cr₇C₃ 相, 其尺寸取决于堆焊层中不同区域的冷却环境,较为均匀地分布于Ni₃Al 基体中。由于Cr 在Ni₃Al 中的固溶度远大于C , 加之Cr₃C₂ 转化为Cr₇C₃ 也造成部分富余的C , 结果造成在该Ni₃Al 表面强化材料焊层中形成石墨相, 其密度轻、熔点高, 主要偏聚于焊层表层。Cr₇C₃ / Ni₃Al 复合材料的室温、高温硬度远高于传统高温耐磨材料Stellite 合金, 该材料有望成为一种新型的高温耐磨表面强化材料。      

Structures and electronic properties of M2C2 @ C78 (M = Ti, Zr, Hf): a density functional theory study

A systematic DFT investigation has been conducted to explore the structures and electronic properties of the metal-carbide endofullerenes M2C2 @ C78 (M = Ti, Zr, Hf) at the PBE/DNP level of theory. The theoretical calculations predicted the following: (i) this series of endofullerenes have the valence states [M4+]2C2(2-) @ C78(6-) (ii) the structure of the [M2C2](6+) cluster encapsulated in the C78(6-) (D3h) cage varies with the increasing of the ionic radius of M4+, i.e., from a linear M-C [triple bond] C-M geometry for M = Ti, through a zigzag geometry for M = Hf to a side-on binding mode for M = Zr; (iii) M2C2 @ C78 (M = Zr, Hf) should display interesting intramolecular dynamic behavior at room temperature, i.e., the encapsulated C2(2-) moiety can rotate freely around the C3-axis of the C78(6-) (D3h) cage; (iv) the [Ti2C2]6+ in the lightest Ti2C2 @ C78 is far more fixed by adopting the linear Ti-C - C-Ti geometry; (v) the order for their ionization potentials is Ti2C2 @ C78 < Hf2C2 @ C78 < Zr2C2 @ C78, whereas their EAs follow the order: Ti2C2 @ C78 < Hf2C2 @ C78 approximately Zr2C2 @ C78. The predicted redox properties of these endofullerenes suggest that Zr2C2 @ C78 is synthetically as approachable as Hf2C2 @ C78.     

含 Sm 聚合物的制备及荧光性质

用 Sm_2O_3制备了甲基丙烯酸钐和辛酸钐。通过添加或交联制得了含 Sm 的甲基丙烯酸和甲基丙烯酸甲酯共聚物。测定了 Sm 盐的元素分析、IR、TG、DTA 和它们在溶液中的荧光性质。研究了含 Sm聚合物的力学性能和荧光性质。     

电致发光材料MGa2S4：Ce的合成及其发光特性

用固相反应法制备ＣａＳ，ＳｒＳ，ｇＡ２ＳＥ及Ｃｅ２Ｓ３，进而合成了ＭＧａ２Ｓ４：Ｃｅ（Ｍ＝Ｃａ，Ｓｒ）电致发光材料，ＣａＧａ２Ｓ４和ＳｒＧａ２Ｓ４同属Ｄ＾２４２ｈ空间群中斜方晶系结构。     

Nanotechnology-based flexible electronics

Research on flexible electronics has grown exponentially over the last decade. Researchers around the globe are developing a wide range of flexible systems, including displays [1, 2], sensors [3-5], RFID tags [6, 7] and other similar devices [8]. Innovations in materials have been key to the increased research success in this field of research in recent years [9]. Transistors, interconnects, memory cells, passive components and other assorted devices all have challenging material demands for flexible electronics to become a reality. Nanomaterials of various kinds have been found to represent a tremendously powerful tool, with nanoparticles [10], nanotubes, nanowires [3, 11] and engineered organic molecules [12, 13] contributing to the realization of high-performance semiconductors, dielectrics and conductors for flexible electronics applications. Nanomaterials offer tunability in terms of performance, solution processability and processing temperature requirements, which makes them very attractive as building blocks for flexible electronic systems. Indeed, such systems represent some of the largest families of commercially produced nanomaterials today, and numerous commercial products based on nanoparticle formulations are widely available. This special issue focuses on the rapidly blossoming field of flexible electronics, with a particular focus on the use of nanotechnology to facilitate flexible electronic materials, processes, devices and systems. Contributions to the issue describe the development of nanomaterials-including nanoparticles, nanotubes, nanowires and carbon-based thin films-for use in conductors, transparent electrodes, semiconductors and dielectrics. The articles feature innovations in nanomanufacturing and novel materials, as well as the application of these technologies to advanced flexible devices and systems. As flexible electronics systems move rapidly towards successful commercial deployment, it is extremely likely that they will exploit nanomaterials as building blocks. Developments in the field will help to leverage the power of these materials to realize novel functionalities in flexible form factors. This special issue provides a view of the state of the art in these technologies, and gives a vision of the coming innovations that will make flexible electronics a reality. References [1] Gelinck G H et al 2004 Flexible active-matrix displays and shift registers based on solution-processed organic transistors Nature Mater. 3 106-10 [2] Zhou L, Wanga A, Wu S C, Sun J, Park S and Jackson T N 2006 All-organic active matrix flexible display Appl. Phys. Lett. 88 083502 [3] Fan Z, Ho J C, Jacobson Z A, Razavi H and Javey A 2008 Large-scale, heterogeneous integration of nanowire arrays for image sensor circuitry Proc. Natl Acad. Sci. 105 11066 [4] Sekitani T et al 2009 Organic nonvolatile memory transistors for flexible sensor arrays Science 326 1516-9 [5] Mannsfeld S C B et al 2010 Highly sensitive flexible pressure sensors with microstructured rubber dielectric layers Nature Mater. 9 859-64 [6]Subramanian V, Frechet J M J, Chang P C, Huang D C, Lee J B, Molesa S E, Murphy A R, Redinger D R and Volkman S K 2005 Progress toward development of all-printed RFID tags: materials, processes, and devices Proc. IEEE 93 1330-8 [7] Jung M et al 2010 All-printed and roll-to-roll-printable 13.56 MHz-operated 1 bit RF tag on plastic foils IEEE Trans. Electron. Devices 57 571-80 [8] Kim D-H et al 2011 Epidermal electronics Science 333 838-43 [9] Wagner S and Bauer S 2012 Materials for stretchable electronics MRS Bull. 37 207 [10] Grouchko M, Kamyshny A and Magdassi S 2009 Formation of air-stable copper-silver core-shell nanoparticles for inkjet printing J. Mater. Chem. 19 3057-62 [11] Takei K et al 2010 Nanowire active-matrix circuitry for low-voltage macroscale artificial skin Nature Mater. 9 821-6 [12] Sekitani T, Zschieschang U, Klauk H and Someya T 2010 Flexible organic transistors and circuits with extreme bending stability Nature Mater. 9 1015-22 [13] Park S, Wang G, Cho B, Kim Y, Song S, Ji Y, Yoon M and Lee T 2012 Flexible molecular-scale electronic devices Nature Nanotechnol. 7 438-42.     

高耐磨钢回火过程中碳化物沉淀的透射电镜研究

用透射电镜研究了三种高耐磨钢在二次硬化峰附近回火时碳化物的沉淀，结果表明：耐磨钢产生二次硬化的特殊碳化物为ＭＣ＋Ｍ２Ｃ，它们和基体间满足如下取向关系：〔１１１〕ＭＣ／／〔０１１〕α，（１１０）ＭＣ／／（１００）α；〔００１〕ＭＣ／／〔０１１〕α，（２００）ＭＣ／／（２００）α；〔０１１１〕Ｍ２Ｃ／／〔００１〕α，（２１１０）Ｍ２Ｃ／／（２００）α。在５４０℃回火时，Ｓｉ能抑制耐磨钢中Ｍ３Ｃ碳化物的     

Electrical properties of complex bimetallic salts [M(N–N)3]2+[Cu(MNT)2]2− and heterobimetallic AgI–CuII/HgII–CuII bis(maleonitriledithiolato) bridged coordination polymers

This paper presents the solid-state electrical conductance properties of a series of complex bimetallic salts of the form [M(N–N)₃][Cu(MNT)₂] (M=Fe(II), Co(II), Ni(II), or Cd(II); N–N=1,10-phenanthroline (phen) or ethylenediamine (en); MNT²⁻=maleonitriledithiolate) and bridged heterobimetallic complexes Ag₂[Cu(MNT)₂] and Hg[Cu(MNT)₂] that have been prepared by treatment of complex salt Na₂[Cu(MNT)₂] (generated in situ) with one equivalent of cationic complexes [M(N–N)₃]X₂ or Hg(CH₃COO)₂ and two-equivalent of AgNO₃ in aqueous–methanol mixture and characterised by relevant spectroscopies (IR, EPR, UV-Visible) as well as by powder XRD spectra. Solution conductivity measurements in 10⁻³ M DMSO solution revealed 1:1 electrolytic behaviour of the bimetallic salts. Diamagnetism together with powder EPR spectra for Ag₂[Cu(MNT)₂] and Hg[Cu(MNT)₂] show strong antiferromagnetic interaction between two adjacent copper(II) centers at room temperature. Majority of the complexes exhibited compressed pellet σ_rt in 8.19×10⁻¹¹ to 5.37×10⁻⁷ S cm⁻¹ range and show semiconductivity over the 303–383 K temperature range. Conductivity of both coordination polymers are appreciably higher compared to the bimetallic salts. For the salts [Co(phen)₃][Cu(MNT)₂], [Ni(phen)₃][Cu(MNT)₂] and bridged complexes Ag₂[Cu(MNT)₂] and Hg[Cu(MNT)₂] the conductivity remarkably increases, i.e., 10² to 10³ order of magnitude at elevated temperature showing some sort of phase transformation producing S⋯S intermolecular contact.     

钻柱纵向和扭转振动分析

介绍钻柱的振动状态和产生振动的原因。针对钻柱的纵向振动,分别建立了力激励法和位移激励法的数学模型;计算结果表明,力激励法与位移激励法求得的消振转速相反,即力激励法的消振转速恰恰是位移激励法的共振转速,反之亦然;传统多以力激励为边界条件来研究钻柱纵向振动的频率响应,并指导现场消振作业的,这样给出的最佳消振转速,恰恰是共振转速;在钻井作业中,钻头的纵向跳动比纵向受力的变化要稳定得多,钻柱的动负荷比动位移重要得多,应该用位移激励法研究钻柱的纵向振动问题。针对钻柱的扭转振动问题,分别建立了扭矩激励法和转角激励法的钻柱扭转振动数学模型;证明用转角激励法来研究钻柱的扭转振动更符合实际。     

Synthesis, spectroscopy and magnetic properties of transition-metal complexes with aminophosphonate derivatives of pyridine

The compounds of general formula [ML₂](ClO₄)₂ [M = Cu(II), Ni(II), Co(II)]; L = diethyl 3-pyridylmethyl[N-(butyl)amino]phosphonate (3-pmape) or diethyl 4-pyridylmethyl[N-(butyl)amino]phosphonate (4-pmape) were prepared. The new complexes were identified and characterized by elemental analysis, infrared, electronic spectral studies and magnetic measurements. The complexes are sixcoordinate. Metal ions are octahedrally surrounded by two pyridine and two amine nitrogens, and two oxygens of the phosphoryl groups. The results of the magnetic studies suggest polymeric chain structure of the above complexes and indicate weak antiferromagnetic interaction between the magnetic centers. The magnetic behavior of Co(II) complexes is characteristic for cobalt(II) system with an important orbital contribution via spin-orbit coupling.     

Effect of carbon steel microstructure and molecular structure of two new Schiff base compounds on inhibition performance in 1 M HCl solution by DC,SEM and XRD studies

In this investigation, attempts have been made to study the inhibitive effect of N,N′-ortho-phenylen acetyle acetone imine (S1) and 4-[(3-{[1-(2-hydroxy phenyl) methylidene] amino} propyl) ethanemidol]-1,3-benzenediol (S2) in the concentration range of 50–400 ppm for mild steel with two different microstructures resulted from two different heat treatments (annealed (A) and quenched and tempered (Q&T)) in 1 M hydrochloric acid solution. Both Schiff bases acted as a mixed type inhibitors. The S1 inhibitor for both microstructures showed better inhibition efficiency than S2. The A samples indicated slightly less corrosion than Q&T samples in 1 M HCl solution in absence of inhibitor due to the formation of duplex γ-Fe₂O₃/Fe₃O₄.