共查询到14条相似文献,搜索用时 93 毫秒
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提出了一种基于集总电荷建模方法的大功率PIN二极管改进电路模型。传统的集总电荷模型使用有效载流子寿命模型,未考虑载流子寿命和基区电荷浓度之间的关系,导致模型的仿真精度偏低。该文在研究传统PIN二极管集总电荷模型的基础上,首先分析了二极管基区载流子寿命随注入浓度和温度的变化规律,并提出了载流子寿命随浓度和温度变化的集总电荷模型。然后,基于提出的载流子寿命模型建立了改进的PIN二极管集总电荷电路模型,并加入模型物理参数的温度函数,实现了模型对不同温度下PIN二极管通态和瞬态特性的表征,并在PSPICE仿真平台中实现了该模型。最后,用1 700 V/1 000 A IGBT模块中反并联续流二极管对模型进行了实验,仿真和实验结果对比验证了该模型的准确性。 相似文献
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介绍了柔性单晶锗纳米薄膜(GeNM )PIN 二极管的制备方法和反向偏置下对应不同弯曲状态下的射频特性。为了定量研究在反向偏置下机械弯曲对柔性PIN二极管射频特性的影响,分别搭建了不同弯曲半径下的等效电路模型。通过研究不同机械应力作用下模型中的各个参数的变化得到二极管内部电阻,寄生电感,p+ p-结的电阻以及p-n+结的电容为影响其射频特性的主要因素,机械弯曲使这些参数值单调变化,导致柔性单晶锗PIN二极管关态下的射频特性变好。这在应变测量领域显示出很大的发展应用潜力。 相似文献
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传统的整流二极管RC吸收参数设计基于谐振等效电路,不能精确刻画二极管反向恢复过程,RC参数难以优化。为此,基于大功率PIN二极管集总电荷模型,采用多目标优化设计RC吸收电路参数。首先,根据三电平移相全桥变换器拓扑结构及调制方式,分析了RC参数对整流二极管反向电压尖峰的影响规律。其次,基于大功率PIN二极管的集总电荷模型对理论分析进行了仿真验证。然后,采用多目标优化设计RC吸收电路。最后,实验结果验证了最优RC参数抑制整流二极管反向电压尖峰的有效性。 相似文献
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开关二极管是微波控制电路中的一种应用最普遍的控制器件,它可以实现近似短路和开路的功能.Ⅰ层厚度对PIN二极管的器件特性具有重要的影响.利用Silvaco TCAD软件对InP基PIN开关二极管器件结构进行建模仿真,分析不同1区厚度对二极管的电流电压特性的影响,得出最优值.利用化合物半导体材料外延与器件工艺平台,制备出InP基PIN开关二极管器件,直流特性测试结果表明,PIN开关二极管的开启电压为0.525 V,反向击穿电压大于12 V.为进一步实现毫米波开关电路奠定了基础. 相似文献
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To improve signal-to-noise (S/N) ratios in biological NMR experiments we have regularly employed close-fitting receiver coils.
The poor RF (radio-frequency) homogeneity often exhibited by these coils can be partly overcome by using them with large transmitter
coils, provided that good between-coil isolation during the RF transmission and receive periods is achieved. With this in
mind, we have used combined PIN diodes and tuned line to isolate transmitter and receiver and to remove transmitter noise.
A series of experiments reported here demonstrate (a) distortion-free receiver detuning during free-induction decay, (b) the
reduced effect of the receiver coil on the transmitter pulse, (c) an increase in S/N from 71:1 to 158:1, and (d) the effectiveness
of transmitter noise isolation. Improvements in S/N, isolation, and image homogeneity illustrate the value of utilizing these
devices. Hardware to allow PIN diode switching under computer control is described, utilizing mostly nonmagnetic materials
and batteries. 相似文献
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Hatem Garrab Bruno Allard Herv Morel Sami Ghedira Kamel Besbes 《International Journal of Numerical Modelling》2004,17(6):539-560
Electro‐thermal simulations of a PIN‐diode based on the finite‐element method, show a non‐uniform temperature distribution inside the device during switching transients. Hence, the implicit assumption of a uniform temperature distribution when coupling an analytical electrical model and a thermal model yields inaccurate electro‐thermal behaviour of the PIN‐diode so far. The idea of including non‐uniform temperature distribution into power semiconductor device models is not new, as accurate electro‐thermal simulations are required for designing compact power electronic systems (as IC or MCM). Instead of using a one‐dimensional finite difference or element method, the bond graphs and the hydrodynamic method are utilized to build an electro‐thermal model of the PIN‐diode. The results obtained by this original technique are compared with those obtained by a commercial finite‐element simulator. The results are similar but the computation effort of the proposed technique is a fraction of that required by finite‐element simulators. Moreover, the proposed technique may be applied easily to other power semiconductor devices. Copyright © 2004 John Wiley & Sons, Ltd. 相似文献