Synthesis,characterization, and properties of low viscosity tetra‐functional epoxy resin N,N,N′,N′‐ tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane

Tetra‐functional epoxy resin N,N,N′,N′‐tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane (TGDEDDM) was synthesized and characterized. The viscosity of TGDEDDM at 25°C was 7.2 Pa·s, much lower than that of N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM). DSC analysis revealed that the reactivity of TGDEDDM with curing agent 4,4′‐diamino diphenylsulfone (DDS) was significantly lower than that of TGDDM. Owing to its lower viscosity and reactivity, TGDEDDM/DDS exhibited a much wider processing temperature window compared to TGDDM/DDS. Trifluoroborane ethylamine complex (BF₃‐MEA) was used to promote the curing of TGDEDDM/DDS to achieve a full cure, and the thermal and mechanical properties of the cured TGDEDDM were investigated and compared with those of the cured TGDDM. It transpired that, due to the introduction of ethyl groups, the heat resistance and flexural strength were reduced, while the modulus was enhanced. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2014 , 131, 40009.     

Epoxy resins based on aromatic glycidylamines. V. Shelf life of TGDDM-based epoxy resins

The effect of aging on resin composition was investigated as a part of a study concerned with the evaluation of epoxies containing N, N, N′, N′-tetraglycidyl-4,4′-diaminodiphenylmethane (TGDDM). Long-term stability of three different epoxy resins based on TGDDM and their mixtures with 4,4′-diaminodiphenylsulfone (DDS) was followed at 23 ± 2°C at a relative humidity ranging from 45% to 55%, by means of GPC and HPLC; short-term stability of the resins was evaluated at 125°C.     

Cure kinetics of multifunctional epoxies with 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane as hardener

The curing behavior of the epoxy resin N,N,N′,N′‐tetraglycidyldiaminodiphenyl methane (TGDDM) with triglycidyl p‐aminophenol as a reactive diluent was investigated using 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane (DCDDM) as the curing agent. The effect of the curing agent on the kinetics of curing, shelf‐life, and thermal stability in comparison with a TGDDM‐diaminodiphenylsulfone (DDS) system was studied. The results showed a lesser activation energy at the lower level of conversion with a broader cure exotherm for the epoxy‐DCDDM system in comparison with the epoxy‐DDS system, although the overall activation energy for the two systems was comparable. TGA studies showed more stability in the epoxy‐DCDDM system than in the epoxy‐DDS system. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2097–2103, 2000     

Curing,compatibility, and fracture toughness for blends of bismaleimide and a tetrafunctional epoxy resin

The curing, compatibility, and fracture toughness of blends of 4,4 ′-bismaleimidodiphenylmethane (BDM)/tetraglycidyl diamino-diphenyl methane (TGDDM) were investigated. Diamino-diphenyl sulfone (DDS) was used as a curing agent. BDM alone could be both homopolymerized (at a lower temperature) and could also undergo Michael addition reactions with the primary amine of DDS. The secondary amine of DDS did not react with BDM. However, the network produced by homopolymerization was not miscible with that produced by the latter reactions. Curing of TGDDM with DDS took place almost at the same temperature as that of the homopolymerization of BDM, but well below the temperature of the Michael addition reaction. When a BDM/TGDDM mixture was cured with DDS in the stoichiometric ratio, the miscibility of the cured system increased with the amount of TGDDM. This was attributed to the fact that the network produced by Michael addition reactions was diminished. When DDS reacted entirely with TGDDM, the BDM/TGDDM/DDS cure yielded only a TGDDM/DDS network and a BDM homopolymerized network, which were not only miscible, but are also interpenetrating. The superior interpenetrated network, as indicated by the highest fracture toughness, was found at BDM/TGDDM = 40/60 weight ratio in the BDM/TGDDM/DDS curing systems.     

Effect of type of substitution in 4,4′‐bis‐(diaminodiphenyl) methane hardener on cure kinetics,mechanical, and flame retardant properties of tetrafunctional epoxy resins

The nature of the substituent in 4,4′‐bis‐(diaminodiphenyl) methane (DDM) hardener on the cure kinetics, mechanical, and flame retardant properties of N,N,N′,N′‐tetraglycidyl diaminodiphenyl methane (TGDDM) resin is investigated in comparison with unsubstituted DDM and widely used 4,4′‐bis‐(diaminodiphenyl) sulfone hardeners. Dynamic differential scanning calorimetry (DSC) and cure rheology studies showed that the substitution decreased the reactivity of the amine. An electron‐withdrawing chlorine substituent was found to be more effective than an electron‐releasing methyl group in reducing the amine reactivity. Substituted and unsubstituted DDM hardeners showed two peaks in their DSC thermograms that were due to steric hindrance in the former and deficiency of amine in the latter. Substitution showed its effect on the mechanical properties and glass‐transition temperature. The flexural modulus was increased; however, the Izod impact and glass‐transition temperature were decreased in substituted amine systems. The limiting oxygen index results showed higher flame retardancy in the chlorine substituted hardener system compared to other hardener systems that were studied. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 480–491, 2006     

Curing of epoxy resin using imide‐amines

The curing behavior of diglycidyl ether of bisphenol‐A (DGEBA) was investigated by differential scanning calorimetry, using varying molar ratios of imide‐amines and 4,4′‐diaminodiphenyl sulfone (DDS). The imide‐amines were prepared by reacting 1 mol of pyromellitic dianhydride (P) with excess (2.5 mol) of 4,4′‐diaminodiphenyl ether (E), 4,4′‐diaminodiphenyl methane (M), or 4,4′‐diaminodiphenyl sulfone (S) and designated as PE, PM, PS. Structural characterization was done using FTIR, ¹H NMR, ¹³C NMR spectroscopic techniques and elemental analysis. The mixture of imide‐amines and DDS at ratio of 0 : 1, 0.25 : 0.75, 0.5 : 0.5, 0.75 : 0.25, and 1 : 0 were used to investigate the curing behavior of DGEBA. The multiple heating rate method (5, 10, 15, and 20°C/min) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide‐amine, and also on the ratio of imide‐amine : DDS used. Activation energy was highest in case of epoxy cured using a mixture of DDS : imide‐amine of a ratio of 0.75 : 0.25. Thermal stability of the isothermally cured resins was also evaluated in a nitrogen atmosphere using dynamic thermogravimetry. The char yield was highest in case of resins cured using mixture of DDS : PS (0.25 : 0.75; EPS‐3), DDS : PM (0.25 : 0.75; EPM‐3), and DDS : PE (0.75 : 0.25; EPE‐1). © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3502–3510, 2006     

Fracture and adhesion behaviors of epoxy resins modified with poly(amine‐quinone)

An amine‐quinone monomer, i.e. 2,5‐bis(4,4′‐methylenedianiline)‐1,4‐benzoquinone (BB), was synthesized by the Michael addition of 4,4′‐diaminodiphenyl methane with 1,4‐benzoquinone. To evaluate the effect of BB content on the glass transition temperature (T_g) and crosslinking density (ρ) of cured diglycidyl ether of bisphenol A (DGEBA)/BB systems, storage modulus and loss factor measurements were obtained using dynamic mechanical analysis. The mechanical properties of the systems were determined in terms of the fracture toughness, impact strength, and adhesion strength. As a result, the ρ values of the systems were found to decrease systematically as the BB content increased. The fracture toughness and adhesion strength of the systems increased with increasing BB content. These results indicate that the addition of BB into epoxy resins increases the free volume of the epoxy network and absorbs the deformation energy, resulting in an improvement of the mechanical properties of the DGEBA/BB systems. Copyright © 2006 Society of Chemical Industry     

Miscibility and mechanical properties of tetrafunctional epoxy resin/phenolphthalein poly(ether ether ketone) blends

Phenolphthalein poly(ether ether ketone) (PEK‐C) was found to be miscible with uncured tetraglycidyl 4,4′‐diaminodiphenylmethane (TGDDM), which is a type of tetrafunctional epoxy resin (ER), as shown by the existence of a single glass transition temperature (T_g) within the whole composition range. The miscibility between PEK‐C and TGDDM is considered to be due mainly to entropy contribution. Furthermore, blends of PEK‐C and TGDDM cured with 4,4′‐diaminodiphenylmethane (DDM) were studied using dynamic mechanical analysis (DMA), Fourier‐transform infrared (FTIR) spectroscopy, and scanning electron microscopy (SEM). DMA studies show that the DDM‐cured TGDDM/PEK‐C blends have only one T_g. SEM observation also confirmed that the blends were homogeneous. FTIR studies showed that the curing reaction is incomplete due to the high viscosity of PEK‐C. As the PEK‐C content increased, the tensile properties of the blends decreased slightly and the fracture toughness factor also showed a slight decreasing tendency, presumably due to the reduced crosslink density of the epoxy network. SEM observation of the fracture surfaces of fracture toughness test specimens showed the brittle nature of the fracture for the pure ER and its blends with PEK‐C. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 598–607, 2001     

An investigation of cure and thermal stability of poly(amide‐amidic acid) modified tetraglycidyl 4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone

In this work, poly(amide‐amidic acid) (PAA) was used to modify tetraglycidyl 4,4′‐diaminodiphenylmethane (TGDDM)/4,4′‐diaminodiphenylsulfone (DDS) system. Results of non‐isothermal differential scanning calorimetry analysis indicated that PAA played a role of catalyst during the process of the curing reaction. The curing mechanism was studied by Fourier transform infrared spectroscopy, showing that the PAA acted as a co‐curing agent in the system. The glass transition temperature decreased firstly and then increased with the increase of the PAA content. PAA equally rendered TGDDM more fire resistant with higher char yield. On examining the fracture surface morphology using scanning electron microscopy, it was observed that there was no obvious phase separation when the content of PAA was less than 20 phr (per hundred weight of TGDDM/DDS resin), however, phase separation was observed when the content of PAA was 25 and 30 phr. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Phosphorus‐containing epoxy resins: Thermal characterization

Three novel aromatic phosphorylated diamines, i.e., bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl} pyromellitamic acid (AP), 4,4′‐oxo bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl}phthalamic acid (AB) and 4,4′‐hexafluoroisopropylidene‐bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl}phthalamic acid (AF) were synthesized and characterized. These amines were prepared by solution condensation reaction of bis(3‐aminophenyl)methyl phosphine oxide (BAP) with 1,2,4,5‐benzenetetracarboxylic acid anhydride (P)/3,3′,4,4′‐benzophenonetetracarboxylic acid dianhydride (B)/4,4′‐(hexafluoroisopropylidene)diphthalic acid anhydride (F), respectively. The structural characterization of amines was done by elemental analysis, DSC, TGA, ¹H‐NMR, ¹³C‐NMR and FTIR. Amine equivalent weight was determined by the acetylation method. Curing of DGEBA in the presence of phosphorylated amines was studied by DSC and curing exotherm was in the temperature range of 195–267°C, whereas with conventional amine 4,4′‐diamino diphenyl sulphone (D) a broad exotherm in temperature range of 180–310°C was observed. Curing of DGEBA with a mixture of phosphorylated amines and D, resulted in a decrease in characteristic curing temperatures. The effect of phosphorus content on the char residue and thermal stability of epoxy resin cured isothermally in the presence of these amines was evaluated in nitrogen atmosphere. Char residue increased significantly with an increase in the phosphorus content of epoxy network. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 2235–2242, 2002     

Isothermal curing by dynamic mechanical analysis of three epoxy resin systems: Gelation and vitrification

Times to gelation (t_gel) and times to vitrification (t_vit) during isothermal curing for the epoxy systems diglycidyl ether of bisphenol A (DGEBA)/1,3‐bisaminomethylcyclohexane (1,3‐BAC), tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM)/4‐4′‐diaminodiphenylsulfone (DDS), and TGDDM/epoxy novolac (EPN)/DDS were measured at different curing temperatures. This article reports on a method to determine t_gel and t_vit by dynamic mechanical analysis (DMA). Gelation was determined at the onset of the storage modulus or by the peak of the loss factor. Vitrification was defined as the curve of the storage modulus as the curve reached a constant level (endset) in DMA tests. The experimental values obtained for t_gel and t_vit were compared with values obtained by other experimental methods and with theoretical values (t_gel's) or indirect determinations (t_vit's). From kinetic analysis by differential scanning calorimetry, conversions corresponding to gelation were obtained for the three systems; this yielded a constant value for each system that was higher than theoretical value. Values of the apparent activation energies of the DGEBA/1,3‐BAC, TGDDM/DDS, and TGDDM/EPN/DDS epoxy systems were obtained from plots of t_gel's against reciprocal temperatures. They were 53.2, 58.2, and 46.5 kJ/mol, respectively. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 78–85, 2002     

Fluid uptake behavior of multifunctional epoxy blends

Profound changes in network architecture from blending trifunctional (m-triglycidylaminophenol, mTGAP) or tetrafunctional (tetraglycidyldiaminodiphenylmethane, TGDDM) epoxides with diglycidyl ether of bisphenol-A (DGEBA) and a curative amine (3,3′-diaminodiphenylsulfone, 3,3′-DDS) were observed using PVT, DMA, and PALS analyses. Increasing multifunctional content, which increased the crosslink density (with the expected increase in T_g), produced a decrease in the average free volume hole size (V_h) accompanied by a counterintuitive increase in fractional free volume (FFV). This unusual inverse relationship between FFV and V_h allowed clear resolution of their respective roles in equilibrium moisture uptake vs. the rate of uptake (diffusivity). Equilibrium water uptake increased with increasing multifunctional content, concomitant with the increase in FFV. Water diffusivity, on the other hand, decreased with increasing multifunctional content, concomitant with the decrease in V_h. The decreasing V_h in the epoxy blends also had interesting consequences for organic solvent sensitivity. MEK ingress was substantial in the binary DGEBA/DDS epoxy and completely inhibited for most of the blends, implying hole size selectivity was responsible for the MEK uptake inhibition. MEK uptake was precluded in epoxies whose V_h was below a critical threshold value of ～68 Å³. A small amount of mTGAP or TGDDM was sufficient to reduce the V_h of DGEBA/DDS epoxy below the threshold and prevent MEK uptake.     

Thermal characterization of carbon‐nanofiber‐reinforced tetraglycidyl‐4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone epoxy composites

The thermal properties of carbon nanofibers (CNF)/epoxy composites, composed of tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) resin and 4,4′‐diaminodiphenylsulfone (DDS) as a curing agent, were investigated with differential scanning calorimetry (DSC), thermogravimetric analysis, and dynamic mechanical thermal analysis. DSC results showed that the presence of CNF had no pronounced influence on the heat of the cure reaction. However, the incorporation of CNF slightly improved the thermal stability of the epoxy. Furthermore, the storage modulus of the TGDDM/DDS epoxy was significantly enhanced, whereas the glass‐transition temperature was not significantly affected, upon the incorporation of CNFs. The storage modulus of 5 wt % CNF/epoxy composites at 25°C was increased by 35% in comparison with that of the pure epoxy. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 295–298, 2006     

Epoxy resin based on 4,4′-dihydroxydiphenysulfone. I. Synthesis and reaction kinetics with 4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylsulfone

Epoxy resins based on 4,4′-dihydroxydiphenylsulfone (DGEBS) and diglycidyl ether of bisphenol A (DGEBA) were prepared by alkaline condensation of 4,4′-dihydroxydiphenylsulfone (bisphenol S) with epichlorohydrin and by recrystallization of liquid, commercial bisphenol A-type epoxy resin, respectively. Curing kinetics of the two epoxy compounds with 4,4′-diaminodiphenylmethane (DDM) and with 4,4′-diaminodiphenylsulfone (DDS) as well as T_g values of the cured materials were determined by the DSC method. It was found that the ? SO₂? group both in the epoxy resin and in the harener increases T_g values of the cured materials. DGEBS reacts with the used hardeners faster than does DGEBA and the curing reaction of DGEBS begins at lower temperature than does the curing reaction of DGEBA when the same amine is used. © 1994 John Wiley & Sons, Inc.     

Differential scanning calorimetry studies of the cure of carbon fiber–epoxy composite prepregs

Diaminodiphenyl sulfone (DDS) cured tetraglycidyl-4,4'-diaminodiphenyl methane (TGDDM) epoxies, whose cure reactions are accelerated by BF₃:amine catalysts, are the most common composite matrices utilized in aerospace high performance, fibrous composites. To process reproducible composites requires an understanding of the cure reactions and how these reactions are modified by the BF₃:amine catalysts. In this article we report systematic differential scanning calorimetry (DSC) studies of (i) the constituents of BF₃:NH₂C₂H₅-catalyzed TGDDM–DDS epoxies and their mixtures, (ii) the effect of BF₃:NH₂C₂H₅ concentration on the cure reactions, (iii) the nature of the catalyzed cure reactions, and (iv) the environmental sensitivity of the catalyst. DSC studies are also reported on the cure reaction characteristics and environmental sensitivity of commercial C fiber–TGDDM–DDS epoxy prepregs.     

Development of a toughened DGEBS/DDS system toward improved thermal and mechanical properties by the addition of a tetrafunctional epoxy resin and a novel thermoplastic

It was the object of the present article to discuss the effect of the addition of a tetrafunctional resin, namely, tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM), and of a novel 40:60 polyethersulfone:polyetherethersulfone (PES:PEES) copolymer on a blend constituted by a difunctional resin, diglycidyl ether of bisphenol S (DGEBS), and an aromatic ammine, 4,4′‐diaminodiphenylsulfone (4,4′DDS). The formulated blends were fully characterized in terms of the morphology and the viscoelastic and mechanical properties. The modification by the tetrafunctional resin was proved to be a useful means to improve the glass transition temperature and, therefore, to widen the range of the working temperature. The addition of the novel copolymer resulted in a marked increase in toughness without negatively affecting the thermal and elastic properties of the blend. TEM analysis, despite the high amount of thermoplastic used, showed a homogeneous morphology that would lead to the conclusion of the existence of a full‐IPN network. Moisture‐uptake experiments were conducted both on the blend and on the resins on their own. It was shown that the combination of the difunctional resin with the tetrafunctional led to a decrease of the percent of the water absorbed. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 268–273, 2003     

Disecondary amine synthesis and its reaction kinetics with epoxy prepolymers

3,3′‐Diaminodiphenyl sulfone (3,3′‐DDS) was reacted with acetaldehyde in the presence of sodium triacetoxy borohydride via reductive amination to yield a 3,3′‐DDS based secondary diamine, N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone. Near IR analysis indicated that the 5060 cm^?1 peak for primary amine (? NH₂) in 3,3′‐DDS was absent in the reaction product spectrum. The ? NH₂ proton peak at δ 5.66 ppm shifted to δ 6.16 ppm in the product. Methyl and methylene protons of CH₃? CH₂? NH? Ph? group were observed at δ 3.01 and 1.12 ppm, respectively, in the product. The carbon NMR spectrum of the reaction product showed new peaks at δ 37.46 and 14.47 ppm that further confirmed secondary amine formation. The liquid chromatography coupled mass spectra peaks at 248–250 for 3,3′‐DDS and 304 for the reaction product further supported the formation of N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone. A blend of N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone with diglycidyl ether of bisphenol‐A (DGEBA) epoxy prepolymer started reacting at about 110–125°C surpassing an energy barrier of ～ 66 kJ/mol as determined via differential scanning calorimetry analysis. Reaction kinetics were characterized via near IR spectroscopy specific to the reaction between secondary amine and DGEBA epoxy prepolymer. The results confirmed >97% conversion at a cure protocol of 5 h at 80°C, 5 h at 100°C, 11 h at 125°C, and 6 h at 185°C. N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone‐DGEBA thermoplastics displayed tensile and flexural modulii of 3.08 and 2.86 GPa, respectively, and glass transition temperature (T_g) of 120.77°C. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Effects of graphene functionalization on the long‐term behavior of epoxy/graphene composites evaluated by dynamic mechanical analysis

Graphene oxide (GO) and its reduced version (RGO) were prepared and functionalized with phenyl glycidol chlorophosphate (PGC) to obtain the corresponding GO‐PGC and RGO‐PGC materials. These graphene systems were used to prepare thermosetting composites with a tetrafunctional epoxy resin, 4,4′‐methylenebis(N,N‐diglycidylaniline) (TGMDA) cured with 4,4′‐diamino‐diphenyl‐sulfone (DDS). The systems were evaluated by dynamic mechanical analysis at constant strain and temperature sweeps to estimate the viscoelastic properties and relaxation phenomena at long time, which is important for modeling the mechanical long‐term behavior. The time temperature superposition (TTS) principle was employed for the construction of a master curve. The addition of the graphene‐type fillers shifted the time when the relaxation phenomena start to occur towards higher values, suggesting a better working temperature and durability of the corresponding nanocomposites when compared to the neat epoxy network. This phenomenon is more pronounced for the systems prepared with functionalized graphenes. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44816.     

Effect of backbone moiety in epoxies on thermal conductivity of epoxy/alumina composite

We chose two commercial epoxies, bisphenol A diglycidyl ether (DGEBA) and 3,3′,5,5′‐tetramethyl‐4,4′‐biphenol diglycidyl ether (TMBP), and synthesized one liquid crystalline epoxy (LCE), 4′4′‐bis(4‐hydroxybenzylidene)‐diaminophenylene diglycidyl ether (LCE‐DP) to investigate the effect of backbone moiety in epoxies on the thermal conductivity of epoxy/alumina composite. The DGEBA structure shows an amorphous state and the TMBP structure displays a crystal phase, whereas the LCE‐DP structure exhibits a liquid crystalline phase. The curing behaviors of them were examined employing 4,4′‐diaminodiphenylsulfone (DDS) as a curing agent. The heat of curing of epoxy resin was measured with dynamic differential scanning calorimetry (DSC). Alumina (Al₂O₃) of commercial source was applied as an inorganic filler. Thermal conductivity was measured by laser flash method and compared with value predicted by two theoretical models, Lewis‐Nielsen and Agari‐Uno. The results indicated that the thermal conductivity of the LCE‐DP structure was larger than that of the commercial epoxy resins such as TMBP and DGEBA and the experimental data fitted quite well in the values estimated by Agari‐Uno model. POLYM. COMPOS., 2013. © 2013 Society of Plastics Engineers     

Novel adamantane‐containing epoxy resin

A novel adamantane‐containing epoxy resin diglycidyl ether of bisphenol‐adamantane (DGEBAda) was successfully synthesized from 1,3‐bis(4‐hydroxyphenyl)adamantane by a one‐step method. The proposed structure of the epoxy resin was confirmed with Fourier transform infrared, ¹H‐NMR, gel permeation chromatography, and epoxy equivalent weight titration. The synthesized adamantane‐containing epoxy resin was cured with 4,4′‐diaminodiphenyl sulfone (DDS) and dicyandiamide (DICY). The thermal properties of the DDS‐cured epoxy were investigated with differential scanning calorimetry and thermogravimetric analysis (TGA). The dielectric properties of the DICY‐cured epoxy were determined from its dielectric spectrum. The obtained results were compared with those of commercially available diglycidyl ether of bisphenol A (DGEBA), a tetramethyl biphenol (TMBP)/epoxy system, and some other associated epoxy resins. According to the measured values, the glass‐transition temperature of the DGEBAda/DDS system (223°C) was higher than that of the DGEBA/DDS system and close to that of the TMBP/DDS system. TGA results showed that the DGEBAda/DDS system had a higher char yield (25.02%) and integral procedure decomposition temperature (850.7°C); however, the 5 wt % degradation temperature was lower than that of DDS‐cured DGEBA and TMBP. Moreover, DGEBAda/DDS had reduced moisture absorption and lower dielectric properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007