导热ZnO/EP复合材料的制备与性能研究

以ZnO粉体、环氧树脂E-51等原料通过溶胶-凝胶法制备ZnO/EP复合材料。采用X射线衍射(XRD)、扫描电镜(SEM)等对其进行表征,研究ZnO填充量对其力学性能和导热性能的影响。结果表明:随着ZnO粉体填充量的增加ZnO/EP复合材料的热导率逐渐升高,但力学性能有所下降,ZnO粉体填充量为40%时热导率达到了0.67(W·m^(-1)·K^(-1)),较EP提高了272.2%。ZnO粉体的最佳填充量为20%。     

环氧树脂/聚多巴胺改性铝粉导热绝缘复合材料的制备与性能研究

采用化学包覆的方法在平均粒径分别为4.5 μm和20 μm的铝(Al)粉上包覆一层有机聚多巴胺(PDA),以环氧树脂(EP)为基体,包覆改性后的铝粉（PDA@Al）为导热填料,采用浇铸法制备了高导热绝缘环氧基复合材料(EP/PDA@Al)。结果表明,PDA@Al的加入有利于提高EP的热稳定性以及热导率,且当PDA@(20 μm)Al的含量为20 %(质量分数,下同)时,复合材料的热导率为0.521 W/（m·K）,相比纯EP的热导率提高了184 %;相对纯Al填充的EP复合材料,EP/PDA@Al复合材料的绝缘性能显著提高。     

膨胀石墨混杂填充聚丙烯复合材料导热性能研究

以不同粒径的膨胀石墨(EG)为填料,通过双辊混炼热压成型制备聚丙烯(PP)/EG导热复合材料,研究了EG填充量、粒径和不同粒径混杂填充对复合材料导热性能的影响。结果表明:随着EG填充量的增加,复合材料的热导率提高。当填充量超过30%时,热导率提升幅度增大,达到渗流阈值;当EG填充量为50%时,复合材料的热导率达到1.791W/(m.K);大粒径填料粒子提高复合材料热导率的能力优于小粒径粒子;大小粒径按合适比例混杂填充得到的复合材料热导率最高。     

具有抗菌活性的氧化锌/环氧树脂基纳米复合材料的研究

为了提高环氧树脂(EP)的抗菌性能,延长其使用寿命,采用纳米氧化锌(ZnO)粉末对脂环族EP进行改性,利用溶液浇注法制备了纳米ZnO/EP抗菌复合材料。研究了不同含量的纳米ZnO经硅烷偶联剂表面处理后,对复合材料的抗菌性能及力学性能的影响。结果表明:硅烷偶联剂处理后的纳米ZnO能够在EP中均匀分散;复合材料的抗菌性能随着纳米ZnO用量的增加而显著增大,加入1%纳米ZnO对大肠杆菌的抗菌率达到99.06%,对金黄色葡萄球菌的抗菌率达到99.00%;加入3%纳米ZnO时达到抗菌饱和,且弯曲强度出现极值,为EP的1.66倍;而纳米ZnO的加入对EP原有的固化温度和玻璃化转变温度几乎没有影响。     

EP/GNs/MWCNTs复合材料的导热性能

以多壁碳纳米管(MWCNTs)和石墨烯纳米微片(GNs)为导热填料,环氧树脂(EP)为基体采用溶剂和超声分散法,制备了EP/GNs/MWCNTs导热复合材料,并与EP/MWCNTs及EP/GNs复合材料的导热性能进行了对比。采用透射电子显微镜观察其微观结构,采用Hot Disk热导率测试仪测试其导热性能,采用差示扫描量热法和热重分析仪测试其耐热性及热稳定性。结果表明,MWCNTs和GNs共同作为EP导热填料时,相比于单组分填料(MWCNTs或GNs)更易形成导热网络;EP的热导率、玻璃化转变温度(Tg)和热分解温度均随着MWCNTs或GNs含量的增加而提高,其中,GNs更有利于提高EP的热导率和热分解温度,MWCNTs更有利于提高EP的Tg。在相同的导热填料含量下,相对于其中的任一单一填料,MWCNTs/GNs共同作用时,对热导率的提高有更显著的效果,且随着其中GNs比例的增加,热导率逐渐增大。当GNs和MWCNTs的体积分数分别为0.6%和0.4%时,EP/GNs/MWCNTs复合材料的热导率、Tg和起始分解温度分别为0.565 W/(m·K),152℃和316℃,分别比纯EP提高了132.5%,34.5%和8.2%。     

脱醇型室温硫化导热硅橡胶的研究

采用氧化锌(ZnO)为导热填料,研究了填料对脱醇型室温硫化(RTV)硅橡胶力学性能、导热性能的影响.结果表明,在满足加工性能的前提下,随着填料用量的增加,硫化后硅橡胶的拉伸强度显著提高,由ZnO填充量10份时的0.55MPa增大至2.53MPa,而断裂伸长率下降,由309%下降至209%,100%定伸应力、硬度、撕裂强度均随填料填充量的增加而增加.随着导热填料ZnO用量的增加,RTV硅橡胶的热导率逐渐升高,当用量70份时,热导率达2.142W/m*K;随着温度的升高,填充70份ZnO的硅橡胶的热导率呈现出逐渐升高的趋势,在30℃时为2.29W/m*K,而在150℃时,热导率升高至5.9W/m*K.     

EVA/中空玻璃微珠隔热复合材料的制备与性能研究

采用乙烯-乙酸乙烯酯共聚物(EVA)为基质,以密度分别为0.18 g/cm3和0.29 g/cm3的中空玻璃微珠(GB) XS1和XS2为填料,通过挤出共混法制备EVA/GB隔热复合材料.探讨了不同中空玻璃微珠对复合材料热导率、热稳定性和拉伸强度的影响,并考察了复合材料与玻璃的黏合强度.结果表明,复合材料的热导率随GB用量的增加而不断下降;当GB用量为20份时,填充粒径均为40 μm的中李玻璃微珠XS1和XS2的复合材料的热导率分别为0.197 0 W/(m·K)和0.219 9 W/(m·K),与未填充EVA相比,分别下降了33.4%和22.5%;以中空玻璃微珠XS2为隔热填料时,所制备的EVA/GB复合材料的热导率随粒径的增大呈不断下降的趋势.填充粒径为40μm和90μm的中空玻璃微珠XS2的复合材料与玻璃的黏合强度在所考察的GB用量范围内均大于30 N/cm,并且随GB用量的增加缓慢下降.随GB用量的增加,填允高密度玻璃微珠XS2的EVA/GB复合材料的拉伸强度先增大,随后减小;当粒径为40μm的XS2用量为5份时,所制备的EVA/GB复合材料具有最大的拉伸强度32.26 MPa,比未填充EVA提高了16.5%.     

六方氮化硼合成及其对导热硅橡胶性能的影响

采用硼酸-三聚氰胺法合成了六方氮化硼(h-BN)粉体,研究了原料配比、煅烧温度对h-BN粉体物相组成、纯度、结晶度和微观形貌的影响。将表面改性的h-BN粉体与硅橡胶复合,制备了氮化硼/硅橡胶复合材料,研究了h-BN加入量对复合材料导热性能和力学性能的影响。结果表明:当硼酸和三聚氰胺的摩尔比为3:1,煅烧温度为1950℃时,h-BN粉体具有较高的纯度、结晶性和产率;当h-BN加入量为2wt.%时,氮化硼/硅橡胶复合材料的热导率、拉伸强度和撕裂强度分别为0.24 W/(m·K)、9.45 MPa和18.48 MPa。     

碳化硅/环氧树脂导热复合材料的制备与性能

采用浇铸成型法制备碳化硅/环氧树脂(SiC/EP)导热复合材料,研究了SiC种类、粒径、用量和表面改性方法对SiC/EP复合材料的导热性能、力学性能和热性能等影响。结果表明:SiC/EP复合材料的导热系数随纳米级SiC用量增加而增大,当φ(纳米级SiC)=17.80%时,导热系数为0.954 6 W/(m.K);SiC/EP复合材料的弯曲强度和冲击强度随纳米级SiC用量增加均呈先升后降态势,当φ(纳米级SiC)=3.50%时,两者均达到最大值。SiC经表面改性后可有效提高复合材料的导热性能和力学性能,并且改性SiC的加入可有效降低EP的玻璃化转变温度。     

无卤阻燃环氧树脂的制备与性能研究

分别采用氢氧化铝(ATH)和ATH/红磷(RP)复配填充制备无卤阻燃环氧树脂复合材料研究了ATH的粒径、用量及ATH/RP复合阻燃剂对环氧树脂阻燃性能、力学性能、热性能和介电性能的影响.结果表明,环氧树脂的阻燃性能随ATH用量的增加而提高,其中以ATH/RP复合填充效果更佳,当mATH/mRP为3/1时,氧指数为38.8％;复合材料的耐热性、介电常数和介质损耗均随ATH/RP用量的增加而提高,而弯曲强度和冲击强度则先增加后降低.当ATH/RP用量为10％时,综合力学性能最佳.     

Preparation and characterization of transparent ZnO/epoxy nanocomposites with high-UV shielding efficiency

Transparent ZnO/epoxy nanocomposites with high-UV shielding efficiency were reported in this paper. First, zinc oxide (ZnO) precursor was synthesized via the homogeneous precipitation method and ZnO nanoparticles were then made by calcination of the precursor at different temperature. The structural properties of the as-prepared ZnO nanoparticles were studied in detail using thermogravimetry (TGA), differential thermal analysis (DTA), X-ray diffractometer (XRD), Fourier transform infrared spectrometer (FT-IR) and transmission electron microscopy (TEM), respectively. Transparent ZnO/epoxy nanocomposites were subsequently prepared from transparent epoxy (EP-400) and as-prepared ZnO nanoparticles via in situ polymerization. Optical properties of ZnO/epoxy nanocomposites, namely visible light transparency and UV light shielding efficiency, were studied using an ultraviolet-visible (UV-vis) spectrophotometer. The optical properties of the as-obtained nanocomposites were shown to depend on ZnO particle size and content. The nanocomposite containing a very low content (0.07% in weight) of ZnO nanoparticles with an average particle size of 26.7 nm after calcination at 350 °C possessed the most optimal optical properties, namely high-visible light transparency and high-UV light shielding efficiency, that are desirable for many important applications.     

Thermal and dielectric properties of the aluminum particle/epoxy resin composites

Microsized aluminum/epoxy resin composites were prepared, and the thermal and dielectric properties of the composites were investigated in terms of composition, aluminum particle sizes, frequency, and temperature. The results showed that the introduction of aluminum particles to the composites hardly influenced the thermal stability behavior, and decreased T_g of the epoxy resin; moreover, the size, concentration, and surface modification of aluminum particles had an effect on their thermal conductivity and dielectric properties. The dielectric permittivity increased smoothly with a rise of aluminum particle content, as well as with a decrease in frequency at high loading with aluminum particles. While the dissipation factor value increased slightly with an increase in frequency, it still remained at a low level. The dielectric permittivity and loss increased with temperature, owing to the segmental mobility of the polymer molecules. We found that the aluminum/epoxy composite containing 48 vol % aluminum‐particle content possessed a high thermal conductivity and a high dielectric permittivity, but a low loss factor, a low electric conductivity, and a higher breakdown voltage. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

增韧导热环氧树脂/氮化硼复合材料的制备与表征

采用种子乳液聚合方法制备了聚（丙烯酸正丁酯/甲基丙烯酸甲酯-co-甲基丙烯酸缩水甘油酯）核壳增韧剂（PBMG）,并用湿法球磨与超声辅助相结合的方法对六方氮化硼（h-BN）进行改性,制备的改性氮化硼（MBN）可提高环氧树脂（EP）的热导率。最后采用机械共混方法制备了环氧树脂/增韧剂/改性氮化硼（EP/PBMG/MBN）复合材料。通过透射电子显微镜（TEM）、扫描电子显微镜（SEM）、X射线衍射（XRD）、动态激光光散射（DLS）、热导率和力学性能等测试对核壳增韧剂的粒子形成、改性氮化硼和复合材料进行了表征。结果发现：最终制备的聚丙烯酸酯乳胶粒子呈现明显的核壳结构,且粒度分布很窄。当聚丙烯酸酯增韧剂添加量为5%、改性氮化硼为8.99%时,环氧树脂/增韧剂/改性氮化硼复合材料的冲击强度和热导率比纯环氧树脂（EP）的分别提高了133%和171%。随着未来的基板材料要求有效的热耗散,这种复合材料有望用于微电子工业上。     

超支化液晶/Al_2O_3/环氧树脂复合材料电性能研究

采用机械共混及模压成型工艺将Al2O3粉体,含H20哑铃状液晶化合物(HLCP)与环氧树脂(E-51)共混制备了HLCP/EP/Al2O3复合材料。研究了Al2O3含量对材料热稳定性、导电性能、导热性能及热膨胀的影响。结果表明:材料的导热系数、介电常数及热稳定性随Al2O3含量的增加而增大,当Al2O3粉体质量分数达到70%时,材料导热系数是纯环氧树脂的1.7倍;介电损耗、线膨胀系数随Al2O3含量的增加而减小,当Al2O3粉体质量分数为60%时,介电常数为3.71。同时,由于HLCP网格的存在,降低了材料的内耗,提高了复合材料的玻璃化转变温度,增强了电性能。     

Preparation and properties of transparent zinc oxide/silicone nanocomposites for the packaging of high‐power light‐emitting diodes

New transparent zinc oxide (ZnO)/silicone nanocomposites with outstanding integrated properties, including a high UV‐shielding efficiency and transparency, bigger thermal conductivity, and lower dielectric constant, were successfully developed; they were prepared by the uniform dispersion of organic modified nano‐ZnO in a silicone matrix through in situ polymerization. The ZnO precursor was prepared by a direct precipitation method, which was then calcinated at different temperatures to produce nano‐ZnO with various morphologies and sizes. The effects of the size, surface nature, and content of nano‐ZnO on the key properties (e.g., optical and dielectric properties, thermal conductivities) of the composites were systematically investigated. The results show that the organic nano‐ZnO prepared by 3‐methacryloxypropyltrimethoxysilane can increase the dispersion of nano‐ZnO in silicone resin, and the interfacial adhesion between inorganic and organic phases, and consequently improve the integrated properties of nanocomposites. The increase of the particle content and size of ZnO in composites can lead to high thermal conductivity and UV‐shielding efficiency but lower visible‐light transparency, so there is an optimum content and size of ZnO in composites to obtain the best integrated properties of the composites. Specifically, the nanocomposite containing 0.03 wt % organic nano‐ZnO with an average size of 46 ± 0.4 nm not only had a high visible‐light transparency, UV‐shielding efficiency, and thermal conductivity but also possessed a low dielectric constant and loss and met the requirements of high‐performance electronic packaging for high‐power light‐emitting diodes. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

天然鳞片石墨/环氧树脂复合材料的制备及导热性能研究

以天然鳞片石墨为导热填料,E44型环氧树脂为基体,采用超声分散法制备天然鳞片石墨/环氧树脂复合导热材料.系统考察了天然鳞片石墨用量、石墨粒度和炭黑添加量等因素对复合材料导热性能的影响.结果表明:随着天然鳞片石墨用量增加,复合材料的导热系数增大,抗压强度先增加后减小;复合材料的导热系数随天然石墨粒径的增大而增大,抗压强度先减小后增加;在石墨/环氧树脂复合导热材料中添加不同用量的炭黑时,随着炭黑添加量的增加,复合材料的抗压强度增大,导热系数先增大后减小.制备天然鳞片石墨/环氧树脂复合导热材料的最佳配方为天然鳞片石墨用量45％,粒径≤270 μm,炭黑用量2％.     

Studies on Preparation and Property Researches of EP/SiC Thermal Conductivity Composites

The epoxy resin/silicon carbide thermal conductivity composites were prepared via casting method. The content of SiC and coupling reagents effecting on the thermal conductivity, mechanical and thermal properties of composites were investigated. Results revealed that the thermal conductivity properties of the composites were improved with the increasing mass fraction of SiC, and the thermal conductivity coefficient λ was 0.7152 W/mk with 50% mass fraction of SiC, being over 3 times of that of native epoxy resin. The flexural strength and impact strength of the EP/SiC composites increased firstly, but decreased with excessive addition of SiC, and the properties of EP/SiC composites were maximum with 10 wt% SiC. DSC and TGA analysis showed that the glass transition temperature (Tg) of composites decreased, but the heat resistance increased with the addition of SiC. SEM observation of impact fracture revealed that the impact strength had the relationships of large or small fracturing ability and the fracturing extended ability and the resin elasticity deformation.     

0D surface modification and 3D silicon carbide network construction for improving the thermal conductivity of epoxy resins

With rapid advances in electronic device miniaturization and increasing power density, high thermal conductivity polymer composites with excellent properties are becoming increasingly significant for the progress of next-generation electronic apparatuses. In this work, a new type of three-dimensional (3D) network silicon carbide (SiC) frame and core-shell SiC@SiO₂ (SiC@SiO₂) were successfully prepared. The effects of different filler forms (dispersed particle filler and three-dimensional continuous filler network) on the thermal conductivity of the composites were compared. The composites based on the three-dimensional filler network exhibited evidently better thermal conductivity improvement rates, compared to their traditional counterparts. The thermal conductivity of the epoxy/SiC@SiO₂ composite having a total filler content of 17.0 vol% was 0.857 W/m/K, 328.5% higher than that of pure epoxy resin. Similarly, the thermal conductivity of the EP/3D-SiC composite having a total filler content of 13.8 vol% was 1.032 W/m/K, 416.0% higher than that of pure epoxy resin. The abovementioned stats were proven via molecular simulations. We estimated the interfacial thermal resistance (ITR) of the EP/3D-SiC composite to be 5.98 × 10^?8 m² K/W, which was an order of magnitude lower than that of the epoxy composites without a 3D network. Simultaneously, computerized molecular simulation technology was used to verify the feasibility of the experiment, which provided new ideas for the preparation of other highly thermally conductive materials.     

环氧树脂/玻璃布/BN导热复合材料的制备与性能研究

采用高温模压成型法制备环氧树脂(EP)/玻璃布/氮化硼(BN)导热复合材料。探讨了BN用量和偶联剂处理对复合材料力学性能、导热性能和介电性能等影响。结果表明:当w(BN)=15%时,复合材料的冲击强度较高;导热性能随着BN用量的增加而增大;当w(BN)=25%时,改性复合材料的热导率为0.901 2 W/(m.K),此时复合材料仍保持较低的介电常数和介电损耗。当BN用量相同时,偶联剂表面处理可有效改善复合材料的力学性能和导热性能。