共查询到19条相似文献,搜索用时 125 毫秒
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化学镀镍络合剂与镀液故障 总被引:3,自引:0,他引:3
研究了化学镀镍以乳酸、柠檬酸,酒石酸、丁二酸及其复合形式为络合剂与镀液故障之间的关系,为合理选择络合剂、延长镀液的使用寿命提供了一定的依据。 相似文献
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配位剂的选择是化学镀镍技术的关键之一.使用两种常用的有机酸——柠檬酸和丁二酸作为配位剂,以镀速和镀层中磷的质量分数为评价指标,先分别考察两者单独使用时的影响,然后在单因素实验的基础上,考察两者复配使用时的影响.结果表明:单一配位剂难以同时满足化学镀镍工艺对镀速和镀层中磷的质量分数的要求,配位剂复配使用可以克服镀速与镀层中磷的质量分数之间的矛盾;在柠檬酸20 g/L,丁二酸6 g/L的条件下,镀速适中且镀层中磷的质量分数较高. 相似文献
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选择合适的络合刺及促进剂是进行中温酸性化学镀镍的关键?对钢基体中温酸性化学镀镍的络合剂与促进剂做了进一步研究,得到最佳复合络合剂为乳酸 一种无机酸、最佳促进剂为一种有机酸。其适宜添加量分别为20mL/L、g/L。讨论了镀液pH值及操作温度对镀速的影响,得到其适宜pH值及操作温度范围分别为4.8~5.2、65~90℃。周期实验研究结果表明,添加剂浓缩液不同的添加量对镀液寿命、镀层综合性能有较大影响。当其添加比例为15%时,镀液寿命大于10个周期,稳定性常数大于97%,镀速高,镀层镀态硬度达到480HV、热处理后达到1346HV,耐硝酸变色时间大于70s,磷质量分数大部分为11%~12%,外观平整、光亮,SEM照片显示其镀层表面微观结构致密、均匀。 相似文献
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针对柠檬酸化学镀镍体系,以镀液的氯化钯稳定时间及镀速为评价指标,选择2-巯基苯并咪唑(MB)和二乙基二硫代氨基甲酸钠(DDTC)作稳定剂,先考察它们单独使用时的效果,然后考察两者复配使用时的效果。结果表明:MB和DDTC均是柠檬酸体系化学镀镍的优良稳定剂,既可以单独使用,也可以复配使用。复配使用时的效果好于单独使用时的效果。两者的最佳复配量为:MB 2mg/L+DDTC 3mg/L。此时,镀液的氯化钯稳定时间长达2.50h,镀速较快(11.8μm/h)。 相似文献
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加速剂在化学镀镍-磷合金(高磷)工艺中具有不可替代的作用。以柠檬酸化学镀镍为基础镀液,以沉积速度、孔隙率为评价指标,通过实验考察丁二酸、苯并咪唑、氟化钠及硫酸铈对化学镀镍的加速作用,并将丁二酸和硫酸铈进行复配,以求起到更好的加速作用。结果表明,在丁二酸质量浓度为1.5 g/L,添加2 mg/L硫酸铈时,效果最佳,沉积速度达到14.5μm/h,镀层孔隙率仅为0.2个/cm~2。 相似文献
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电渗析法再生化学镀镍老化液的实验研究 总被引:4,自引:0,他引:4
应用电渗析技术,再生化学镀镍老化液以降低镀液成本,减少环境污染。在采用非均相离子交换膜条件下,考察了4种工艺条件对电渗析的选择去除效果的影响,得出了优化工艺条件,在去除副产物的同时限制了有效物质的流失。 相似文献
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The electrodeposition of copper from a citrate solution has been investigated as a function of pH of the plating bath, and applied to the filling of 500 nm trenches. Speciation diagrams of copper in aqueous citrate solution were used to select four deposition baths with different dominant copper-citrate complexes, which was corroborated using UV–vis spectrophotometry. The electrochemical properties of the plating baths were determined in order to relate the deposition kinetics to the morphology of deposits in trenches. SEM images illustrate that the plating bath at pH 3.1, where only mild inhibition of the deposition kinetics is observed, is capable of adequately filling the trenches. 相似文献
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Ternary nickel—iron—cobalt alloys of wide range composition have been deposited from acetate baths under a variety of conditions and the optimum conditions established are: nickel acetate 0.2828 M, ferrous sulphate 0.0359 M, cobalt acetate 0.2828 M, boric acid 0.1617 M, ascorbic acid 0.0056 M, pH 5.0, cd 1.5 A/dm2 and temperature 30°. The bath gave bright, smooth and adherent deposits. Iron and cobalt contents decreased with an increase in cd and pH, X-ray studies of the deposits revealed fcc structure within the composition range studied (43.6–54.0% Ni). The results indicate that acetate bath can be successfully employed for plating purposes. 相似文献
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C. A. Loto 《SILICON》2016,8(2):177-186
The operating process, versatility and the increasing research interest in optimising the process and products technology in the electroless plating method of metal coating, particularly, the electroless nickel plating of metallic substrates such as mild steel, necessitates the writing of this review. It is also aimed at providing more literature information, both of the past and the present published research in this field. In this paper, electroless nickel plating is introduced. The various nickel plating solutions and baths’ operating parameters; main types of electroless nickel plating; the mechanism involved in the plating process; application of the nickel plating process to iron powders; advantages and disadvantages and the process’s other applications are reviewed. Electroless nickel plating produces an amorphous deposit in the as-plated condition. The deposit is not dependent on current distribution and hence it is almost uniform in thickness. Electroless nickel plating is far more difficult to remove chemically than conventional nickel deposits due to its superior corrosion resistance. The deposit has a good wettability and is generally hard. However, its bath control is more complex than with electroplating. The bath also has lower efficiency and higher operating costs, even without the use of electricity. 相似文献
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化学镀镍液中络合剂总量的快速测定 总被引:4,自引:0,他引:4
研究了化学镀镍体系中Ni^2+,pH值,次磷酸钠,温度等对络合剂吸光度的影响。在202.6nm处,用分光光度法测定其中络合剂的总量。试验结果表明,该法在络合剂总量测定中操作简便,快速,准确度高,适用于化学镀镍液中络合剂总量的快速测定。 相似文献