共查询到18条相似文献,搜索用时 328 毫秒
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针对800 nm的激发光源设计合成了3种具有D-π-D分子构型的新型二苯乙烯衍生物(分别命名为BPSBP,BESBP和BCSBP)作为双光子引发剂.利用飞秒激光研究了该系列双光子引发剂的双光子光聚合行为,着重讨论双光子引发剂浓度对聚合阈值和双光子引发剂浓度、聚合能量及曝光时间对聚合分辨率的影响.综合影响聚合分辨率、系统加工效率和微器件表面质量的因素,以浓度为32μmol/g的BPSBP作为双光子引发剂的聚合体系,在9×105mJ/cm2的聚合能量下制作出了亚微米级的三维周期微结构等微器件,并用电镜(SEM)进行了表征. 相似文献
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一种Bragg型声光双稳器件的双稳特性研究 总被引:1,自引:0,他引:1
本文报导了一种基于Bragg型衍射的声光双稳器件。声光晶体由行波场驱动,声场频率则由系统的反馈讯号控制。实验中,观察并记录了输出光强相对输入光强的双稳特性与固定偏置频率的关系,以及在不同输入光强条件下输出光强与偏置频率之间的双稳特性,这些实验结果与理论分析结果一致。 相似文献
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针对微/纳机电系统(MEMS/NEMS)零部件加工制造难题,研究具有亚衍射极限空间分辨率的飞秒激光双光子聚合加工方法,搭建钛蓝宝石飞秒激光微纳加工系统,对液态聚合物材料进行飞秒激光双光子聚合加工工艺试验研究。结果表明:随着激光功率的降低,单个固化点的尺寸减小,加工分辨率提高;扫描步距减小,所加工工件的表面粗糙度数值减小,但加工效率降低。基于CAD软件设计出微米墙和纳米线构成的三维微纳结构,利用飞秒激光双光子聚合加工得到该三维微纳结构实物,通过优化工艺参数加工出直径小于100 nm的纳米线,从而证明飞秒激光双光子聚合加工方法为微/纳器件的制造提供了一种有效方法。 相似文献
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Two-photon laser precision microfabrication and its applications to micro-nano devices and systems 总被引:3,自引:0,他引:3
Two-photon absorption (TPA) provides the ability to confine photochemical and physical reactions to the order of laser wavelength in three dimensions. For applying TPA to laser precision microfabrication, we proposed a two-photon photopolymerization technique, by which photonic crystals and various micromachines with near-diffraction-limit features have been produced. Here we show that the diffraction limit was exceeded by utilizing nonlinear laser-matter interaction processes, and spatial resolutions far smaller than the diffraction limit were achieved. The super resolution, combined with other technologies newly developed by us including three-dimensional imaging of voxels, rapid surface profile scanning, device functionalization and its mechanical driving with a laser trapping force, and dye-doping polymerization for three-dimensional microdiagnosis, makes the technique quite compelling for nanophotonic and optical microelectromechanical (MEMS) applications. 相似文献
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自从理论计算指出金刚石结构具有完全光子带隙以来,三维光子晶体的理论研究和实验制作一直受到高度重视。光子晶体的制备方法总体上可分为两大类:微制作法和自组装法。前者适合于制备微波、远红外及近红外波段的光子晶体,后者制备近红外、可见或更短波段的光子晶体具有独特的优势。简述了光子晶体的概念和基本特征,并对三维光子晶体的自组装制备方法进行了综述。 相似文献
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Precise fabrication of three-dimensional (3D) microstructures having nano-details has become realized using two-photon induced photopolymerization (TPP) since several years ago; and now, this technology is recognized as a promising process for the creation of 3D neo-conceptive nano- and microscale devices. However, there are still important issues to be settled for the practical use of TPP. One of them is the 3D pattern collapse due to the surface tension of rinse materials in a development process, which impedes the progress of 3D precise microfabrication via TPP. To solve this issue effectively, finite element analyses of 3D pattern collapse using an imperfection model were conducted. Overall of this work, we showed the mechanism of 3D pattern collapse and the way how to reduce pattern deformation effectively during a developing process using experimental and analytical approaches. 相似文献
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针对助航灯具的发光特性,提出了一种测试助航灯具出射光强分布的方法。使用线阵CCD作为光电传感器,采集、获取各个方向灯具的光强信号,利用A/D芯片和USB接口芯片实现数据的转化和实时传输。通过改进的Delaunay三角剖分线算法和B样条曲线平滑处理算法的结合,提出了一种快速生成等光强曲线的算法,给出了Matlab软件获得等光强曲线的方法。通过对PAPI灯出射光强的测试及其等光强曲线的拟合,验证了该测试装置可以较好地实现光强测试,所提算法绘制的曲线平滑、速度快。 相似文献
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Microfabrication techniques for chemical/biosensors 总被引:1,自引:0,他引:1
Hierlemann A. Brand O. Hagleitner C. Baltes H. 《Proceedings of the IEEE. Institute of Electrical and Electronics Engineers》2003,91(6):839-863
Microfabrication processes for chemical and biochemical sensors are reviewed. Standard processing steps originating from semiconductor technology are detailed, and specific micromachining steps to fabricate three-dimensional mechanical structures are described. Fundamental chemical sensor principles are briefly abstracted and corresponding state-of-the-art examples of microfabricated chemical sensors and biosensors are given. The advantages and disadvantages of either fabricating devices in IC fabrication technology with additional microfabrication steps, or of using custom-designed nonstandard microfabrication process flows are debated. Finally, monolithic integrated chemical and biological microsensor systems are presented, which include transducer structures and operation circuitry on a single chip. 相似文献