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二频机抖激光陀螺温度漂移补偿的初步研究 总被引:5,自引:1,他引:4
从实验上研究了二频机抖陀螺的零偏和温度的关系。通过重复性温度实验,利用最小二乘法得到了拟合曲线表达式。结果表明,二频机抖陀螺的零偏和温度具有较好的线性关系和重复性,可以通过温度补偿来提高陀螺的精度。 相似文献
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机抖激光陀螺捷联惯导系统的温度补偿方法 总被引:1,自引:0,他引:1
分析了系统温度对机抖激光陀螺捷联惯性导航系统的影响因素,介绍了降低和补偿捷联系统温度误差的4种方法.通过重复性温度实验,利用逐步回归法分析了激光陀螺零偏与温度的关系:通过多项式拟合,分别得到了加速度计的零偏、标度因子和IF转换电路的温度补偿模型,并在捷联系统中得到应用.对其中的两种方法进行了实验研究和导航测试,并对两种方法的补偿效果进行了对比.结果表明:通过温度实验得到惯性器件的温度补偿模型对其温度误差进行实时补偿是捷联系统最理想的补偿方法.补偿后系统定位测试1 h的圆概率误差(CEP)优于0.3 n mile/h.达到国内先进水平. 相似文献
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温度是影响激光陀螺精度的主要因素之一,对温度引起的机抖激光陀螺漂移进行精确建模,对提高激光陀螺捷联惯导系统的精度具有十分重要的意义。介绍了机抖激光陀螺的温度特性,建立了基于改进人工鱼群算法(Improved Artificial Fish Swarm Algorithm,IAFSA)的机抖激光陀螺温度补偿模型,给出了IAFSA 建模的详细步骤和方法, 对传统的逐步回归方法和IAFSA 进行了比较。结果表明:IAFSA可以对温度引起的激光陀螺漂移进行精确建模,补偿后的激光陀螺零偏不稳定性达到0.001 85()/h,比传统的逐步回归方法建模精度提高了15.5%,得到的温度补偿模型可以对陀螺的零偏进行实时补偿,设计了两种典型的温度试验,获得了满意的补偿效果。 相似文献
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Through the addition of BN as a sintering aid, Y-doped BaTiO3-based positive temperature coefficient resistors (PTCR) can be fabricated at temperatures below 1200‡C, which is much lower
than is required when conventional sintering aids such as silica or A12O3, SiO2, and TiO2 (AST) are used. In comparison with the PTCR containing SiO2, the low-temperature-fired thermistor shows an enhanced PTC effect and a much higher temperature of resistivity maximum.
Electrical properties of the BN-added BaTiO3, (Ba,Sr)TiO3, and (Ba,Pb)TiO3 ceramics were discussed. 相似文献
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近年来海水入侵造成各地沿海滩涂出现了大面积生态退化,对滩涂温度的有效测量有利于监控滩涂海水入侵的情况解决生态平衡问题;通过对光纤光栅结构的特殊设计解决了基底热胀冷缩产生的应变对温度的测量,实现了传感器的解耦;光纤光栅传感器的重复性实验和标定实验,结果表明温度传感器的灵敏度在10.21 pm/℃以上,线性度达到了99 %以上,精度为0.2 ℃,分辨率达到0.1 ℃,传感器具有良好的性能;在现场试验中,将3个光纤光栅传感器串联组成2000 m的传感器系统对滩涂的温度进行测量,数据表明该传感器可以在实际温度测量中进行使用。 相似文献
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大部分晶体振荡器生产厂家的数据手册不会兼顾所有使用者的需要,特别是温补晶体振荡器的频率温度稳定度指标,多数情况下,数据手册所列指标往往只适应于某一类典型的应用场合或只符合生产厂家与其某几个主要用户的验收规则,所以只有充分理解频率温度稳定度的不同定义方法、与频率温度稳定度相关的其他频率温度特性指标、不同的环境温度测试方法,才能正确制定符合自己使用要求的频率温度稳定度指标,不加分析地简单套用频率温度 相似文献
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《Electron Devices, IEEE Transactions on》1976,23(1):64-66
A computer analysis of the temperature dependence of emitter junction voltage under an assumed nonuniform temperature distribution is presented, which demonstrates a temperature averaging effect when using junction voltage as an indicator of junction temperature. 相似文献
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针对传统的非接触式真温反演算法存在反演速度慢和精度低等问题,提出新的基于亮度温度模型的约束真温反演算法(constrained true temperature inversion algorithm,CTTIA)。 在建模过程中,发现发射率和亮度温度存在内在联系:由亮度温度到发射率的普适规律和由发射率到亮度温度的普适规律。通过仿真实验发现当发射率的样本数量巨大时,CTTIA不但可以为实验提供理论指导,还可大大提升发射率样本的选取效率。在1 800 ℃和2 000 ℃两个温度点下建立9个波长通道对被测目标进行测量计算。结果表明,CTTIA与二次测量算法 (second measurement method,SMM) 相比,精度基本相同,反演时间最高节约了82%。说明该方法的研究是非常关键且重要的,是很有研究价值的。 相似文献
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以红外辐射理论及红外热像仪测温原理为基础,为解决环境高温物体对红外测温的影响,提出反射温度补偿和入射温度补偿两种方法。分析了两种温度补偿方法的理论可行性和实际操作方案并具体进行实验测温对比。对4个硫化矿样本分别应用两种补偿方法同未经补偿的红外测温进行实验测温对比研究,分析结果显示:经过温度补偿后,相对误差明显小于未经补偿的红外测温,且反射温度补偿法较入射温度补偿法更为精确,验证了两种温度补偿方法的可用性及精确性。两种补偿方法在保证测量精度的同时拓宽了普通红外热像仪的应用范围,保证了硫化矿自燃红外预测数值精度。 相似文献
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Chuang R.W. Lee C.C. 《Components and Packaging Technologies, IEEE Transactions on》2002,25(3):453-458
A two-step fluxless bonding process adopted to produce high temperature silver-indium joints (80 wt% silver and 20 wt% indium) at relatively low process temperature of 206/spl deg/C has been developed. After annealing the joint continuously for 26 h at 145/spl deg/C, its melting temperature increases to 765-780/spl deg/C, as confirmed by a de-bonding test. The technique thus developed provides a viable alternative to packaging many high temperature devices running at 350/spl deg/C and above. The bonding quality of the Ag-In joints produced was examined using scanning acoustic microscopy. The joint cross-section was also studied using a scanning electron microscope equipped with an energy dispersive X-ray (EDX) spectroscope to find the local microstructure and composition. The results have shown that the joint is nearly void-free and uniform in thickness ranging from 7.2 to 7.8 /spl mu/m. The annealed sample joint, as determined by EDX, is mainly composed of AgIn/sub 2/, Ag/sub 2/In, and AuIn/sub 2/ grains embedded in an Ag-rich Ag-In alloy matrix. During joint formation, the intermetallic compound AgIn/sub 2/, in particular, prevents the indium layer from oxidation, and therefore, no flux is needed. In addition, low process temperatures help to reduce the thermal stresses developed in the bonded structure due to thermal expansion mismatch. Finally, reliability tests were conducted on three sets of annealed joints using a high temperature oven running continuously at 500/spl deg/C for 10, 100, and 1000 h each. Scanning acoustic microscopy (SAM) images on these samples confirmed that the joints have an excellent survivability in a high temperature environment. 相似文献
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Ying Lu Zuying Zhang Wei Guo 《Journal of Infrared, Millimeter and Terahertz Waves》1996,17(9):1567-1571
Based on the transmission-line theory, this paper describes a new procedure to calculate the radiation from layered media with nonuniform temperature profile. The result is compared with those obtained through the incoherent method and the analysis of the electromagnetic fields. 相似文献