甩干设备中的颗粒度分析

甩干设备是半导体清洗工艺后的主要设备,阐述了甩干设备中颗粒产生的各种原因,并进行分析,提出了避免和减少颗粒的解决方案,降低甩干设备带来的颗粒污染.     

二氧化硅工艺中颗粒污染的解决方案

在亚微米的半导体生产制造技术中,二氧化硅工艺中的颗粒污染会造成漏电流形成击穿电压,已经成为产品良率的主要影响因素。文章主要针对目前市面上流行的TEL Alpha-8SE的立式APCVD二氧化硅炉管制造工艺中所遇到的颗粒污染问题进行研究。通过大量的对比性实验,进行排查与分析,并利用各种先进的实验设备和器材,炉管、高倍度电子扫描设备、先进的光学仪器和缺陷分析设备等,找到产生颗粒污染的原因,并且找到解决问题的方案。在减少机台停机时间的同时,提高了机台的使用率,而且改善了颗粒污染的状况,最终获得良率的提升,优化了制造工艺。     

三倍频激光下金属颗粒对熔石英元件损伤阈值的影响

高功率激光器中,金属颗粒作为元件表面污染的一种,对熔石英元件寿命的影响早已得到关注。为了定量得到金属颗粒对熔石英元件损伤阈值的影响,在中国科学院上海光学精密机械研究所薄膜中心的标准损伤测试平台上,对未被污染的以及被3种不同金属颗粒(Al、Cu、Fe)污染的熔石英元件的损伤阈值进行了测量。研究发现,被金属颗粒污染的熔石英元件,损伤阈值会降低为原来的20%～30%;吸收系数高的金属颗粒更容易诱导损伤,损伤形貌与未污染的熔石英损伤形貌也有很大的差别;离线观测样品形貌,可以从微观的角度观察到损伤的概率行为。参考损伤的爆炸模型,粗略地模拟了温度随时间的变化。     

半导体制造中颗粒污染的控制方法研究

首先分析了半导体制造中颗粒污染的来源,然后介绍了用C控制图进行颗粒污染控制的方法及其不足,进而提出了用多元回归分析进行颗粒污染控制的方法及实施.     

电阻炉内气氛对Nd:YAG晶体中散射颗粒的影响——对充入适量CO_2显著减少散射颗粒机理的探讨

本文认为在石墨电阻炉中,散射颗粒主要来自碳、钼及其化合物等杂质的污染,通入的CO_2能和高温中蒸发出来的夹杂在气氛中和熔体表面的碳、钼等固体微粒产生化学反应,生成挥发性的CO、MoO_2、Mo(CO)_6等气态物质而除去,大大减少了炉内材料对熔体的污染,从而减少了晶体的捕获对象,使晶体的散射颗粒显著减少。     

徐州冬季雾霾天气PM1.0单颗粒污染特征分析

本文利用场发射透射电子显微镜(FETEM)及能谱仪(EDS),对2014年元月徐州市区雾霾污染天气下采集的PM1.0进行了单颗粒样本分析.通过电子束辐照损伤实验,分析了无机气溶胶颗粒形态、颗粒模态及颗粒混合态,探讨了复合污染颗粒的形成过程.利用EDS实验,进行了无机气溶胶颗粒物相分析,估算了颗粒相中直接排放源组分及二次污染组分含量.对碱金属及极易挥发的S和N在PM1.0上的富集分布情况进行了分析.实验结果表明:PM1.0直接排放源颗粒与无机水溶性离子组分、可溶有机溶胶组分多呈非均相性内部混合分布特征.采样时段大气环境相对湿度大、温度较低及区域性秸秆焚烧,大量气态污染物凝结或浓缩在直接排放颗粒物表面,造成复合污染颗粒的快速转化,是导致徐州冬季雾霾事件形成的主要原因.     

浅析洁净度与硅片表面性质

分析和研究了硅片颗粒污染情况、洁净室颗粒行为，且计算了硅片表面颗粒沉降量，以确定不同规格硅片相应的生产洁等级。     

浅谈半导体涂胶显影设备生产的洁净度控制

在半导体生产过程中,若生产设备存在杂质污染物会改变或破坏半导体的特性,因此,必须对杂质污染物进行严格控制。基于半导体制造厂对半导体涂胶显影设备中的污染颗粒要求,对半导体涂胶显影设备的零部件清洁过程、装配过程、调试过程、包装过程等环节污染颗粒管控进行介绍,对半导体涂胶显影设备中污染颗粒超标的常见问题进行分析,并提出污染颗粒的把控方法,以期为相关人员提供参考。     

红外探测器内部颗粒物对图像的影响

在高灵敏度的红外光学系统中,来自系统内部的热辐射是影响系统探测性能的重要因素之一。污染颗粒物通常是杂散辐射的主要来源,除了光学元件的表面污染,探测器内部也会存在污染颗粒物。文中主要研究探测器内部颗粒物对焦平面光场分布产生的影响。根据红外辐射及散射原理建立了相应的理论模型,对探测器内部不同温度、不同位置的颗粒物在焦平面上形成的光场分布进行了仿真计算和对比分析,并进行了实验验证。结果表明,探测器内部如有颗粒杂质,在一定的使用环境下,可在探测器焦面上产生黑斑、白斑、黑点白斑等异常现象,而这些异常光场分布会对场景中的红外目标物产生干扰,造成误判,从而影响对目标的准确识别。因此应采用措施以保证探测器内部的洁净度,防止颗粒物的产生。     

基于光纤的润滑油在线监测系统

在分析了油液污染产生的原因及其对机械设备的危害的基础上,利用油液中悬浮颗粒对光线的吸收,结合光纤传感系统的优点设计了油液光纤监测传感器.实验结果表明,该系统可以在一定程度上检测油液的污染度,在机械设备的实时在线监测中具有一定的应用价值.     

对抛光片清洗技术的研究

研究了一种新颖的添加了表面活性剂和HF的RCA的改进工艺,并和标准RCA工艺与目前被广泛采用的稀释RCA工艺进行了比较后指出,改进工艺对金属沾污和表面颗粒的有效去除能力,使0.18um以上的颗粒能够控制在15颗以内,金属沾污能够有效降至109原子cm-2以下(Al略高小于1010cm-2).     

一种改进的消光式颗粒计数传感器

分析了消光式液体颗粒计数传感器的典型结构,并根据Mie理论计算了折射率为1.33的消光系数曲线,说明颗粒粒径在小于2μm时与消光系数呈多值性对应关系,指出这种多值性关系是影响此类计数器不能用于检测小颗粒的主要原因.最后提出一种改进的液体颗粒计数传感器结构,对传感器中光学部分的采光透镜组进行了改造,增加散射光探测器和光源监控探测器.通过计算说明了将散射光探测器安置在45°采光角时的原因,此时的光能与颗粒粒径之间有较好的单值对应关系,还可减少折射率对测量结果的影响.实验对比表明,改进结构的传感器对小于2μm的标准颗粒试样有较好的检测能力,而且多次重复测量结果相近;对大于2μm颗粒的检测能力仍然保持着较高的水平.     

The removal of deformed submicron particles from silicon wafers by spin rinse and megasonics

In order to successfully clean particulate contamination from wafer surfaces, it is necessary to understand the adhesion and deformation between the particles and the substrate in contact. The adhesion and removal mechanisms of deformed submicron particles have not been addressed in many previous studies. Submicron polystyrene latex particles (0.1–0.5 μm) were deposited on silicon wafers and removed by spin rinse and megasonic cleanings. Particle rolling is identified as the major removal mechanism for the deformed submicron particles from silicon wafers. Megasonics provides larger streaming velocity because of the extremely thin boundary layer resulting in a larger removal force that is capable of achieving complete removal of contamination particles.     

Contamination issues in gas delivery for semiconductor processing

The contamination contribution from two functionally similar gas delivery systems supplying a process tool is quantified in this investigation. The conventional gas delivery system consists of single-melt stainless steel tubing (~20 Ra), elastomer components, and the ultraclean gas delivery system consists of double-melt stainless steel (~5 Ra), all metal components. Moisture, oxygen, and hydrocarbon impurities desorbing from the wetted surfaces of the gas delivery system are analyzed using an atmospheric pressure ionization mass spectrometer (APIMS). Particle contamination from components in the gas delivery system is characterized with a condensation nucleus counter (CNC) using static and dynamic testing. Corrosion-induced particulate occurring in the heat-affected-zone (HAZ) near welded portions in tubing is also studied. The moisture contribution of the conventional gas delivery system is a factor of six greater than that from the ultraclean gas delivery system and the oxygen contamination is a factor of three greater. The particle shedding (0.01 μm) in the static mode from the conventional manifold is 20 times greater than that from the ultraclean manifold. The HAZ of the conventional weldment shows aggressive corrosion-induced particulate and loss of the electropolished surface compared to the HAZ of the ultraclean weldment. The effect of the choice of material, components and manufacturing techniques is correlated to the extent of contamination contributed by the gas delivery system     

超大规模集成电路芯片的激光缺陷检测技术

介绍了激光扫描散射检测超大规模集成电路芯片上缺陷的原理，描述了对芯片沾污质粒子与芯片电路图形缺陷的检测方法，并对它们的特点进行了比较。     

Fabrication of Complex Hydrogel Structures Using Suspended Layer Additive Manufacturing (SLAM)

There have been a number of recently reported approaches for the manufacture of complex 3D printed cell‐containing hydrogels. Given the fragility of the parts during manufacturing, the most successful approaches use a supportive particulate gel bed and have enabled the production of complex gel structures previously unattainable using other 3D printing methods. The supporting gel bed provides protection to the fragile printed part during the printing process, preventing the structure from collapsing under its own weight prior to crosslinking. Despite the apparent similarity of the particulate beds, the way the particles are manufactured strongly influences how they interact with one another and the part during fabrication, with implications to the quality of the final product. Recently, the process of suspended layer additive manufacture (SLAM) is demonstrated to create a structure that recapitulated the osteochondral region by printing into an agarose particulate gel. The manufacturing process for this gel (the application of shear during gelation) produced a self‐healing gel with rapid recovery of its elastic properties following disruption. Here, the physical characteristics of the supporting fluid‐gel matrix used in SLAM are explored, and compared to other particulate gel supporting beds, highlighting its potential for producing complex hydrogel‐based parts.     

洁净室气态分子污染物的监测技术

随着微电子工业工序复杂性的增加和产品尺寸的不断缩小,气态分子污染物(AMC)对产品的影响成为洁净室环境控制中重点关注的问题。文章介绍了洁净室中AMC的定义,重点阐述了AMC的监测技术。     

LED用GaAs抛光片清洗技术研究

伴随着LED照明产业的迅猛发展,高质量的GaAs抛光片需求量日益增大.研究了一种有效的直径5.08 cm低阻GaAs免洗抛光片的清洗技术,采用异丙醇低温超声去蜡结合兆声温法清洗工艺,使晶片表面达到了低表面颗粒度、极低表面金属离子浓度,并形成了较薄的富As氧化层表面.表面颗粒度通过Tencor6220测试大于0.3 μm的颗粒少于10个,通过TXRF测试表面金属离子个数均控制在9×1010/cm2以内;通过台阶仪测量表面粗糙度为0.8 nm,通过偏振光椭圆率测量仪测得均一的2 nm厚表面氧化层.     

Rapid inductive fault analysis for high-yield circuits

Inductive fault analysis (IFA) is a powerful tool for estimating yield loss due to faults caused by particulate contamination during processing. The major disadvantage of IFA is that it is essentially an empirical technique and involves the simulation of millions of identical die in order to arrive at meaningful results. This paper demonstrates that the analysis of high-yield circuits can be speeded up considerably by simulating fewer circuits, but using appropriately scaled defect densities.     

Lifetime prediction of electrical connectors under multiple environment stresses of temperature and particulate contamination

Electrical connectors play a significant role in the electronic and communication systems. As they are often exposed in the atmosphere environment, it is extremely easy for them to cause electrical contact failure. It is essential to carry out the reliability modeling and predict the lifetime. In the present work, the accelerated lifetime testing method which is on account of the uniform design method was designed to obtain the degradation data under multiple environmental stresses of temperature and particulate contamination for electrical connectors. Based on the degradation data, the pseudo life can be acquired. Then the reliability model was established by analyzing the pseudo life. Accordingly, the reliability function and reliable lifetime function were set up, and the reliable lifetime of the connectors under the multiple environment stresses of temperature and particulate contamination could be predicted for electrical connectors.