LaNiO3 and Cu3Ge contacts to YBa2Cu3O7-x films

Metallization of high-T_c superconductors using low resistivity metal oxides and Cu-Ge alloys has been investigated on high quality pulsed laser deposited epitaxial YBa₂Cu₃O_7-x (YBCO) films. Epitaxial LaNiO₃ (LNO) thin films have been grown on YBCO films at 700°C using pulsed laser deposition. The specific resistivity of LNO was measured to be 50 μΩ-cm at 300K which decreases to 19 μΩ-cm at 100K indicating good metallicity of the LNO films. The contact resistance of LNO-YBCO thin film interface was found to be reasonably low (of the order of 10^-4Ω-cm² at 77K) which suggests that the interface formed between the two films is quite clean and LNO can emerge as a promising metal electrode-material to YBCO films. A preliminary investigation related to the compatibility of Cu₃Ge alloy as a contact metallization material to YBCO films is discussed. The usage of other oxide based low resistivity materials such as SrRuO₃ (SRO) and SrVO₃ (SVO) for metallization of high-T_c YBCO superconductor films is also discussed.     

Effect of copper and chlorine on the properties of SiO2 encapsulated polycrystalline CdSe films

The effects of different copper doping concentrations on the properties of SiO₂ encapsulated CdSe films have been investigated. Two methods were used to dope the films with copper: ion implantation and diffusion from a surface layer. The room temperature dark resistivity of films annealed in oxygen at 450°C was found to increase as the copper concentration was increased until a maximum resistivity of 10⁸ ohm cm occurred at a copper concentration of 10²⁰ atoms cm⁻³. The room temperature resistivity in the light was found to be independent of the copper concentration and whether the films were annealed in argon or oxygen. During annealing the grains grew from 0.03 μm to 0.3 μm and this growth was independent of the doping or the annealing ambient. The energy levels, carrier mobilities, and microstructure of the annealed films were dependent on the method of doping. The ion implanted films had an additional energy level at 0.33 eV and their mobility was a factor of 4 smaller than films doped by the surface diffusion method, whose mobilities were 20 to 35 cm²V⁻¹ s⁻¹. The addition of chlorine to copper doped films had no effect on either the resistivity or photosensitivity but slowed the response times of the photocurrent by a factor of 10. No energy levels were observed which could be associated with the copper nor was the copper found to affect the density of the observed intrinsic levels at 0.65 and 1.1 eV.     

Synthesis of the PZT films deposited on pt-coated (100) Si substrates for nonvolatile memory applications

Ferroelectric lead-zirconate-titanate (PZT) thin films were deposited by the pulsed laser deposition technique on Pt-coated (100) Si substrates. This study was focused on the investigation of the PZT film growth on (100) Si substrate at varying deposition parameters and electrical characterization of the films including hysteresis loop and fatigue properties by RT66A Standardized Ferroelectric Test System. PZT deposited at higher temperature (575°C in 450 mTorr O₂ partial pressure) showed the best crystalline structure. The remnant polarization and the retained polarization of the ferroelectric capacitors were 13 μC/cm² and 20 μC/cm², respectively. The crystallographic properties of the films were determined using the x-ray diffractometer method. The cross-sectional transmission electron microscope results showed very smooth interfaces among different layers of films.     

Electrical and optical properties of oxygen doped GaN grown by MOCVD using N2O

Oxygen doped GaN has been grown by metalorganic chemical vapor deposition using N₂O as oxygen dopant source. The layers were deposited on 2″ sapphire substrates from trimethylgallium and especially dried ammonia using nitrogen (N₂) as carrier gas. Prior to the growth of the films, an AIN nucleation layer with a thickness of about 300? was grown using trimethylaluminum. The films were deposited at 1085°C at a growth rate of 1.0 μm/h and showed a specular, mirrorlike surface. Not intentionally doped layers have high resistivity (>20 kW/square). The gas phase concentration of the N₂O was varied between 25 and 400 ppm with respect to the total gas volume. The doped layers were n-type with carrier concentrations in the range of 4×10¹⁶ cm⁻³ to 4×10¹⁸ cm⁻³ as measured by Hall effect. The observed carrier concentration increased with increasing N₂O concentration. Low temperature photoluminescence experiments performed on the doped layers revealed besides free A and B exciton emission an exciton bound to a shallow donor. With increasing N₂O concentration in the gas phase, the intensity of the donor bound exciton increased relative to that of the free excitons. These observations indicate that oxygen behaves as a shallow donor in GaN. This interpretation is supported by covalent radius and electronegativity arguments.     

Photovoltaic effect in the impurity absorption region of Si-structures with blocked impurity conductivity

A study is made of the field dependence of the photoconductivity in two-layer Si:Sb-and Si:Bstructures with blocked impurity-band conductivity and different thicknesses of the undoped (blocking) layer. The impurity concentration in the doped (active) layer was ≈10¹⁸ cm⁻³. Measurements were made at temperatures T=4–15 K for high (Φ∼10¹⁶ photons/cm² · s) and low (Φ<10¹⁴ photons/cm² · s) incident photon fluxes. A photovoltaic effect is observed in the Si:B structures with a thin (3 μm) blocking layer. It is found that a photovoltage develops for photons with energies exceeding the ionization energy of boron and its magnitude is independent of the photoexcitation intensity (for Φ>10¹³ photons/cm² · s) and, in the limit of low temperatures, it is close to the activation energy ɛ ₃ for jump conductivity in the active layer. The photovoltaic effect is explained by ballistic transit of the blocking layer by holes emitted from the contact which are then cooled in the active layer, as well as by the presence of a potential barrier ≈ɛ ₃ between the active and blocking layers. These factors are taken into account in a model for describing the major features of the dependence of the photovoltage on temperature and on the photon intensity and energy. Fiz. Tekh. Poluprovodn. 33, 456–463 (April 1999)     

Pulsed laser deposition and processing of wide band gap semiconductors and related materials

The present work describes the novel, relatively simple, and efficient technique of pulsed laser deposition for rapid prototyping of thin films and multi-layer heterostructures of wide band gap semiconductors and related materials. In this method, a KrF pulsed excimer laser is used for ablation of polycrystalline, stoichiometric targets of wide band gap materials. Upon laser absorption by the target surface, a strong plasm a plume is produced which then condenses onto the substrate, kept at a suitable distance from the target surface. We have optimized the processing parameters such as laser fluence, substrate temperature, background gas pressure, target to substrate distance, and pulse repetition rate for the growth of high quality crstalline thin films and heterostructures. The films have been characterized by x-ray diffraction, Rutherford backscattering and ion channeling spectrometry, high resolution transmission electron microscopy, atomic force microscopy, ultraviolet (UV)-visible spectroscopy, cathodoluminescence, and electrical transport measurements. We show that high quality AlN and GaN thin films can be grown by pulsed laser deposition at relatively lower substrate temperatures (750–800°C) than those employed in metal organic chemical vapor deposition (MOCVD), (1000–1100°C), an alternative growth method. The pulsed laser deposited GaN films (∼0.5 μm thick), grown on AlN buffered sapphire (0001), shows an x-ray diffraction rocking curve full width at half maximum (FWHM) of 5–7 arc-min. The ion channeling minimum yield in the surface region for AlN and GaN is ∼3%, indicating a high degree of crystallinity. The optical band gap for AlN and GaN is found to be 6.2 and 3.4 eV, respectively. These epitaxial films are shiny, and the surface root mean square roughness is ∼5–15 nm. The electrical resistivity of the GaN films is in the range of 10⁻²–10² Θ-cm with a mobility in excess of 80 cm²V⁻¹s⁻¹ and a carrier concentration of 10¹⁷–10¹⁹ cm⁻³, depending upon the buffer layers and growth conditions. We have also demonstrated the application of the pulsed laser deposition technique for integration of technologically important materials with the III–V nitrides. The examples include pulsed laser deposition of ZnO/GaN heterostructures for UV-blue lasers and epitaxial growth of TiN on GaN and SiC for low resistance ohmic contact metallization. Employing the pulsed laser, we also demonstrate a dry etching process for GaN and AlN films.     

Heteroepitaxy of HgCdTe(112) infrared detector structures on Si(112) substrates by molecular-beam epitaxy

High-quality, single-crystal epitaxial films of CdTe(112)B and HgCdTe(112)B have been grown directly on Si(112) substrates without the need for GaAs interfacial layers. The CdTe and HgCdTe films have been characterized with optical microscopy, x-ray diffraction, wet chemical defect etching, and secondary ion mass spectrometry. HgCdTe/Si infrared detectors have also been fabricated and tested. The CdTe(112)B films are highly specular, twin-free, and have x-ray rocking curves as narrow as 72 arc-sec and near-surface etch pit density (EPD) of 2 × 10⁶ cm⁻² for 8 μm thick films. HgCdTe(112)B films deposited on Si substrates have x-ray rocking curve FWHM as low as 76 arc-sec and EPD of 3-22 × 10⁶ cm⁻². These MBE-grown epitaxial structures have been used to fabricate the first high-performance HgCdTe IR detectors grown directly on Si without use of an intermediate GaAs buffer layer. HgCdTe/Si infrared detectors have been fabricated with 40% quantum efficiency and R₀A = 1.64 × 10⁴ Ωm₂ (0 FOV) for devices with 7.8 μm cutoff wavelength at 78Kto demonstrate the capability of MBE for growth of large-area HgCdTe arrays on Si.     

Growth and optimization of extremely high-pulse-power graded-index separate confinement heterostructure quantum well AlGaAs/InGaAs diode lasers with broadened waveguides

Material quality is an essential prerequisite and a major challenge for the fabrication of high-power, 980-nm, strained-quantum-well (SQW) InGaAs lasers. We report our work aimed at metal-organic chemical vapor deposition (MOCVD) growth optimization and epitaxial quality analysis of various graded-index separate confinement heterostructure (GRINSCH) QW AlGaAs/InGaAs laser structures. Systematic investigation of doping level control and minimization of oxygen incorporation in AlGaAs were performed. Background oxygen levels of 10¹⁵ cm⁻³ were obtained with n-(Si) and p-(C) doping concentrations as high as 1 × 10¹⁸ cm⁻³ and 3 × 10¹⁸ cm⁻³, respectively, for Al_0.4Ga_0.6As layers. Double-crystal x-ray (DCXR), room-temperature photoluminescence (PL) mapping, Hall effect measurements, and secondary ion-mass spectroscopy (SIMS) techniques were used to evaluate material quality. A record, multimode, pulsed output power of 52.1 W has been obtained from 100-μm × 2-mm broad-stripe lasers made from these materials. The devices demonstrate low threshold current, low cavity losses, and kink-free light-current characteristics.     

Physical properties of sprayed antimony doped tin oxide thin films: Role of thickness

Transparent conducting antimony doped tin oxide (Sb:SnO₂) thin films have been deposited onto preheated glass substrates using a spray pyrolysis technique by varying the quantity of spraying solution. The structural, morphological, X-ray photoelectron spectroscopy, optical, photoluminescence and electrical properties of these films have been studied. It is found that the films are polycrystalline in nature with a tetragonal crystal structure having orientation along the (211) and (112) planes. Polyhedrons like grains appear in the FE-SEM images. The average grain size increases with increasing spraying quantity. The compositional analysis and electronic behaviour of Sb:SnO₂ thin films were studied using X-ray photoelectron spectroscopy. The binding energy of Sn3d_5/2 for all samples shows the Sn⁴ bonding state from SnO₂. An intensive violet luminescence peak near 395 nm is observed at room temperature due to oxygen vacancies or donor levels formed by Sb⁵ ions. The film deposited with 20 cc solution shows 70% transmittance at 550 nm leading to the highest figure of merit (2.11 × 10^-3 Ω^-1). The resistivity and carrier concentration vary over 1.22 × 10^-3 to 0.89 × 10^-3Ωcm and 5.19 × 10²⁰ to 8.52 × 10²⁰ cm^-3, respectively.     

Optical properties of thick-film GaN grown by hydride vapor phase epitaxy on MgAl2O4 substrate

A hydride vapor phase epitaxy was employed to grow the 10∼240 μm thick GaN films on a (111) MgAl₂O₄ substrate. The GaN films on a MgAl₂O₄ substrate revealed characteristics of photoluminescence (PL) in impurity doped GaN, which may be due to the out-diffusion and auto-doping of Mg from the MgAl₂O₄ substrate during GaN growth. The PL peak energy of neutral donor bound exciton emission and the frequency of Raman E₂ mode were decreased by increasing the GaN thickness, due to the residual strain relaxation in the epilayers. The dependence of Raman E₂ mode of GaN films on residual strain can be estimated as Δ ω/Δ σ=3.93 (cm⁻¹/GPa).     

Acceptor and donor doping of AlxGa1−xN thin film alloys grown on 6H-SiC(0001) substrates via metalorganic vapor phase epitaxy

Thin films of Si-doped Al_xGa_1−xN (0.03≤x≤0.58) having smooth surfaces and strong near-band edge cathodoluminescence were deposited at 0.35–0.5 μm/h on on-axis 6H-SiC(0001) substrates at 1100°C using a 0.1 μm AlN buffer layer for electrical isolation. Alloy films having the compositions of Al_0.08Ga_0.92N and Al_0.48Ga_0.52N exhibited mobilities of 110 and 14 cm²/V·s at carrier concentrations of 9.6×10¹⁸ and 5.0×10¹⁷ cm⁻³, respectively. This marked change was due primarily to charge scattering as a result of the increasing Al concentration in these random alloys. Comparably doped GaN films grown under similar conditions had mobilities between 170 and ∼350 cm²/V·s. Acceptor doping of Al_xGa_1−xN for x≤0.13 was achieved for films deposited at 1100°C. No correlation between the O concentration and p-type electrical behavior was observed.     

Pulsed-magnetron-sputtered low-temperature indium tin oxide films for flat-panel display applications

In this paper, indium tin oxide (ITO) thin films were prepared by unipolar and bipolar direct current (DC)-pulsed magnetron sputtering in a mixture of argon and oxygen onto unheated glass substrates. The target of ITO with 10 wt.% tin is used. The influences of polar modes (unipolar and bipolar); output frequencies (0 to 33 kHz); and times and off times on the optical, electrical, and structural properties of ITO films are investigated. The correlations between the deposition parameters and the film properties are discussed. It is found that the resistivity with 10⁻³ Θ-cm and transmittance with ≥90% of amorphous ITO films can be prepared by the reactive bipolar DC-pulsed sputtering with t _on ⁻ between 45 μs and 85 μs (i.e., t _on ⁻ /t _on ⁺ is 9–17), and t _on ⁺ , t _off ⁻ and t _off ⁺ are constant at 5 μs, 10 μs, and 5 μs, respectively. An optimal condition, based on the polar mode and frequency of reactive-pulsed sputtering, for obtaining the high transmittance and low resistivity of ITO films is suggested.     

Molecular beam epitaxial growth and characterization of lead telluride for laser diodes

The characteristics of PbTe films grown by molecular beam epitaxy (MBE) have been investigated. These films were grown on (100) oriented Tl-doped PbTe substrates under UHV conditions (~5×l0⁻⁹ Torr during deposition). Substrate surface contamination levels were studied with Auger electron spectroscopy. Oxygen, the dominant impurity observed, is rapidly thermally desorbed from PbTe, but is stable on Pb_1−xSn_xTe up to at least 410°C. Carrier concentration and mobility were measured with the Van der Pauw technique. The electron mobility increased strongly with increasing film thickness, varying from 4,000 to 14,000 cm²/volt-sec as the thickness increased from 2.0 to 7.3 μn. The film surface also became smoother with increasing film thickness. These results suggest the need for a buffer layer in a laser structure. Lasers grown with 6 μm thick buffer layers have exhibited extremely low threshold current densities (40 A/cm² at 13 K) and very high junction resistancearea products at zero-bias (0.7 Ω−cm² at 77 K), indicative of very high junction quality.     

The effect of O<Subscript>2</Subscript> ambient annealing on the microstructure of Cu(Mg) in the form of a Cu(Mg)/SiO<Subscript>2</Subscript>/Si multilayer

The effect of annealing in an O₂ ambient on Cu(Mg)/SiO₂/Si multilayer films was investigated. As-deposited Cu(Mg)/SiO₂/Si multilayer samples with film thicknesses in the 1,000–3,000 ? range were annealed for 30 min in oxygen ambients at pressures ranging from vacuum to 100 mtorr. The results showed that annealing in an 8-mtorr O₂ ambient significantly decreased the electrical resistivity of a 1,000 ? sample from 10.5 μΩ-cm to 3.7 μΩ-cm. Annealing in the O₂ ambient enhanced Mg diffusion to the surface in comparison to vacuum annealing. Furthermore, O₂ ambient annealing leads to excessive grain growth. However, the effect of O₂ ambient annealing on resistivity is less when the thickness of the film increases.     

Status of MBE technology for the flexible manufacturing of HgCdTe focal plane arrays

A robust process has been developed for the reproducible growth of in-situ doped Hg_1−xCd_xTe:As alloys by molecular beam epitaxy. Net hole concentrations in excess of 5 x 10¹⁷ cm⁻³, with peak mobilities >200 cm2/Vs were measured in Hg_0.74Cd_0.26Te:As films. The p-type layers were twin-free and consistently exhibit narrow x-ray rocking curves (<40 arc sec). The reproducible growth of small lots of p-on-n LWIR detector structures has been established. For a typical lot consisting of 13 layers, the average x-value of the n-type base layer was 0.226 with a standard deviation of 0.003. The lateral compositional uniformity across a 2.5 cm × 2.5 cm wafer was × = +- 0.0006. High performance p-on-n LWIR diodes were fabricated that exhibited R_oA_o values (0-fov at 78K) as large as 350 Q cm2 at 10.4 μm.     

Analysis of reactor geometry and diluent gas flow effects on the metalorganic vapor phase epitaxy of AIN and GaN thin films on α(6H)-SiC substrates

The influence of diluent gas on the metalorganic vapor phase epitaxy of AlN and GaN thin films has been investigated. A computational fluid dynamics model using the finite element method was employed to improve film uniformity and to analyze transport phenomena. The properties of AlN and GaN thin films grown on α(6H)-SiC(0001) substrates in H₂ and N₂ diluent gas environments were evaluated. Thin films of AlN grown in H₂ and N₂ had root mean square (rms) roughness values of 1.5 and 1.8 nm, respectively. The surface and defect microstructures of the GaN thin films, observed by scanning and transmission electron microscopy, respectively, were very similar for both diluents. Low temperature (12K) photoluminescence measurements of GaN films grown in N₂ had peak intensities and full widths at half maximum equal to or better than those films grown in H₂. A room temperature Hall mobility of 275 cm²/V·s was measured on 1 μm thick, Si-doped, n-type (1×10¹⁷ cm⁻³) GaN films grown in N₂. Acceptor-type behavior of Mg-doped GaN films deposited in N₂ was repeatably obtained without post-growth annealing, in contrast to similar films grown in H₂. The GaN growth rates were ∼30% higher when H₂ was used as the diluent. The measured differences in the growth rates of AlN and GaN films in H₂ and N₂ was attributed to the different transport properties of these mixtures, and agreed well with the computer model predictions. Nitrogen is shown to be a feasible alternative diluent to hydrogen for the growth of AlN and GaN thin films.     

Effect of annealing temperature of Bi1.5Zn1.0Nb1.5O7 gate insulator on performance of ZnO based thin film transistors

The bottom-gate structure ZnO based thin film transistors (ZnO-TFTs) using Bi_1.5Zn_1.0Nb_1.5O₇ (BZN) thin films as gate insulator were fabricated on Pt/SiO₂/Si substrate by radio frequency magnetic sputtering. We investigated the effect of annealing temperature at 300, 400, and 500℃ on the performance of BZN thin films and ZnO-TFTs. XRD measurement confirmed that BZN thin films were amorphous in nature. BZN thin films annealed at 400℃ obtain the high capacitance density of 249 nF/cm², high dielectric constant of 71, and low leakage current density of 10^-7 A/cm² on/off current ratio and field effect mobility of ZnO-TFTs annealed at 400℃ are approximately one order of magnitude and two times, respectively higher than that of ZnO-TFTs annealed at 300℃. When the annealing temperature is 400℃, the electrical performance of ZnO-TFTs is enhanced remarkably. Devices obtain a low sub-threshold swing of 470 mV/dec and surface states density of 3.21×10¹²cm^-2.     

Influence of oxygen on the photoluminescence intensity of erbium (at 1.54 µm) in erbium-doped a-Si:H films

The influence of oxygen on the photoluminescence (PL) of erbium (at 1.54 μm) in erbium-doped hydrogenated amorphous silicon (c-Si〈Er〉) is investigated. The a-Si:H〈Er〉 films studied are fabricated by cosputtering Si and Er targets using the technology of dc silane decomposition in a magnetic field. The oxygen concentration is varied from 10¹⁹ to 10²¹ cm⁻³ by increasing the partial pressure of oxygen in the chamber. It is shown that, as in the case of erbium-doped crystalline silicon (c-Si〈Er〉), oxygen has an effect on the intensity of the 1.54 μm photoluminescence in a-Si:H〈Er〉 films. The values of the erbium and oxygen concentrations at which the maximum Er PL intensity is observed are two orders of magnitude higher than in crystalline silicon. The increase in the Er PL intensity at room temperature and the weaker temperature dependence of the Er PL in comparison to c-Si〈Er,O〉 attest to the prospect of using a-Si:H〈Er〉 films in optoelectronic applications. Fiz. Tekh. Poluprovodn. 32, 1384–1389 (November 1998)     

Characterization of Mg-doped InP grown by MOCVD using a bis(methylcyclopentadienyl)magnesium dopant source

The use of bis(methylcyclopentadienyl)magnesium (MCp₂Mg) as ap-dopant source for MOCVD-grown InP has been investigated. The Mg incorporation was nonlinear. The relationship between the H₂ flow through the MCp₂Mg bubbler and the Mg concentra-tion in the epilayers suggested that when [Mg] <20 ppb in the reactor it was mostly depleted from the gas mixture, probably by means of reaction with O₂ or H₂O, but at higher concentrations a large fraction of the Mg diffusing to the epilayers was incor-porated. For concentrations >10¹⁹ cm^s-3 the layer morphology deteriorated and stacking faults were observed by TEM, at a density greater than 10⁹ cm^s−2. Significant diffusion of Mg into the substrates during the growth was observed, with diffusion depths up to 0.1 μm at a concentration of 10¹⁹ cm^s−3 in S-doped, and up to 32 μm at 10¹⁷ cm^s-3 in Fe-doped substrates. These concentrations correspond to the S and Fe doping level in those substrates, and the results are explained in terms of the formation of a complex between the S or Fe dopants and the diffusing Mg, which immobilizes the latter species. At [Mg] >10¹⁸ cm^s−3, the net hole concentration, measured by means of electrochemical C-V pro-filing, decreases with increasing [Mg], indicating significant self compensation. Com-pensation at high [Mg] was also suggested by the effect of excitation power density on the peak shift of the donor to acceptor transition observed during photoluminescence measurements at 7 K.     

Effect of oxygen on the properties of encapsulated polycrystalline CdSe films

This paper presents a comprehensive study of the effects of annealing silicon dioxide encapsulated CdSe films in oxygen on the microstructure, resistivity, photosensitivity and energy levels. The energy levels were investigated by using the independent methods of thermally stimulated current, photocurrent spectral response, and Hall measurements. The film structure is wurtzite with grains of average size 0.35 μm, which extend through the thickness of the films. Annealing the films in oxygen at 450°C increases the resistivity from 10 ohm cm to 10⁶ ohm cm. The electron mobility, which has an activation energy of 0.08 eV, remains constant at about 100 cm² V⁻¹ s⁻¹ during the anneal steps. The change in the resistivity is due to a combination of thermal rearrangement and oxygen diffusing uniformly into the films. Various energy levels ranging from 0.11 eV to 1.3 eV were detected and the density of all these decreased on annealing.