基于Ti-MgF_2金属陶瓷的高效率四层光热转换薄膜的研究（英文）

理论上研究了吸收层材料的光学常数,该常数满足从紫外线到近红外波长范围的四层结构的光子-热转换的高效率。通过使用有效介质近似(EMA)模型,复合材料(金属陶瓷)的光学性能与模拟材料的光学性能非常吻合。此外,提出了使用Ti-MgF_2金属陶瓷作为吸收层的具有高光子-热转换效率的四层膜结构,其在300～1 600 nm的波长范围内具有约95.1%的高吸收率。研究结果为实现高效率的光热转换器件提供了新途径,显示了优良的应用前景。     

基于W-SiO2双金属陶瓷结构的高效率太阳能选择性吸收薄膜的优化和制备

理论优化并成功制备了一种以W-SiO₂双金属陶瓷作为吸收层的太阳能选择性吸收薄膜,同时提高了薄膜在太阳辐射波段的吸收并降低了在红外波段的热辐射。研究了包括金属反射层材料、吸收层金属体积分数等因素对薄膜整体吸收效率的影响。基于对Si和K9玻璃基底上生长的不同金属体积分数的W-SiO₂陶瓷薄膜光学常数的研究,利用磁控溅射方法制备出如下膜系：W （~150 nm） / W-SiO₂ （94 nm, 0.67HVF） / W-SiO₂ （34 nm, 0.27LVF） / SiO₂ （47 nm）。膜系实际测量结果与仿真结果完全吻合,在250～1 500 nm宽光谱波段实现了高达95.3%的吸收率,并且在600 K温度下达到0.124的低热辐射率。该四层膜系结构简单,易于制备,有很强的实际应用前景。     

薄膜光学常数的原位测定

薄膜的光学常数（折射率和消光系数）精度直接影响设计和制造的光学器件的性能。大多数光学常数的测定方法较为复杂,不能直接应用在镀膜过程中。提出了一种薄膜光学常数原位实时测量的方法,通过监测沉积材料的透射率可以快速准确地测量光学常数。测量了高吸收材料Si、低吸收材料Ta₂O₅和超低吸收材料SiO₂的近红外光学常数,用这种方法测得光学常数分别为n=3.22,k=4.6×10^-3,n=2.06,k=1.3×10^-3和n=1.46,k=6.6×10^-5。该方法适用于强吸收材料和弱吸收材料光学常数的测定,为在线精确测量薄膜的光学常数提供了一种有效的方法,对设计和制造高质量的光学器件具有重要意义。     

用热蒸发法制备的Cu2ZnSnS4 薄膜的光电性能

在室温下用真空热蒸发法在玻璃基片上制备Sn/Cu/ZnS 前躯体膜层,然后对其在550C 下在硫气氛中硫化3小时以制得Cu₂ZnSnS₄ (CZTS) 多晶薄膜。对该薄膜进行X射线衍射（XRD）、能量色散X射线光谱（EDX）、紫外可见近红外分光光度计、霍尔测量系统和3D光学显微镜等分析测试。实验结果表明,当[Cu]/([Zn] [Sn]) =0.83和[Zn]/[Sn] =1.15时,该CZTS薄膜在光子能量范围在1.5 - 3.5 eV 时其吸收系数大于4.010₄cm_-1 ,直接带隙为1.47 eV。其载流子浓度、电阻率和迁移率分别为7.9710₁₆ cm_-3, 6.06 Ω.cm, 12.9 cm₂/(V.s), 导电类型为p型。因此,所制备出的CZTS 薄膜适合作为太阳电池的吸收层材料。     

GaInP2/Ge异质结外延材料特性分析

研制了一种基于Ge衬底的异质结热光伏(TPV)电池 ,并且在Ge衬底上用金属有机化学气相沉积(MOCVD)法外延单晶材料GaInP₂和GaAs,对GaInP₂/Ge异质结界面进行了断面扫描电镜(SEM)、X射线衍射(XRD)、电化学电 容电压(ECV)和光致荧光(PL)谱的测试分析,研究了基于 Ge衬底的异质结n-GaInP₂/p-Ge界面的结构、光学和电学特性,得到了高质量、宽禁带 的单晶外延层,与Ge衬底晶格匹配良好,利于更多光子进入到吸收层,为制备高效率TPV电 池打下良好基础。     

InyAl1-yAs线性渐变缓冲层对InP基HEMT材料性能的影响

采用气体源分子束外延（GSMBE）技术,研究了InP衬底上In_yAl_1-yAs线性渐变缓冲层对In_0.66Ga_0.34As/In_yAl_1-yAs高迁移率晶体管（HEMT）材料特性影响。研究了不同厚度和不同铟含量的In_yAl_1-yAs线性渐变缓冲层对材料的表面质量、电子迁移率和二维电子气浓度的影响。结果表明,在300 K（77 K）时,电子迁移率和电子浓度分别为8 570 cm²/（Vs）^-1（23 200 cm²/（Vs）-1）3.255E12 cm^-2（2.732E12 cm^-2）。当In_yAl_1-yAs线性渐变缓冲层厚度为50 nm时,材料的表面形貌得到了很好的改善,均方根粗糙度（RMS）为0.154 nm。本研究可以为HEMT器件性能的提高提供强有力的支持。     

在复合衬底γ-Al2O3/Si(001）上生长GaN

采用分子束外延（MBE）生长方法，使用γ-Al₂O₃材料作为新型过渡层，在Si(001）衬底上获得了没有裂纹的GaN外延层，实验结果表明使用γ-Al₂O₃过渡层有效地缓解了外延层中的应力. 通过生长并测试分析几种不同结构的外延材料，研究了复合衬底γ-Al₂O₃/Si (001）生长GaN情况，得到了六方相GaN单晶材料，实现了GaN c面生长. 预铺薄层Al及高温AlN层可以提高GaN晶体质量，低温AlN缓冲层可以改善GaN表面的粗糙度. 为解决Si(001）衬底上GaN的生长问题提供了有益的探索.     

高频低温漂TC-SAW滤波器的设计

该文设计了一款温度补偿型声表面波（TC-SAW）滤波器,建立了弹性材料及压电材料温度方程,对滤波器的温度场进行仿真分析。通过在压电材料（128°YX-LiNbO₃）上沉积SiO₂作为温度补偿层,降低了滤波器的频率温度系数。为了解决在沉积SiO₂温度补偿层后,谐振器的反谐振频率处出现杂散响应,通过增加电极厚度,降低了谐振器杂散响应对滤波器性能的影响。采用四阶级联提高滤波器的带外抑制。仿真结果表明,设计的TC-SAW滤波器中心频率为2 497 MHz,频率温度系数为-9.89×10^-6/℃,-30~85 ℃工作温度范围内的带内最大插损为1.95 dB,带外抑制大于30 dB,-3 dB损耗带宽大于97 MHz。     

基于二氧化钒相变材料的光电器件激光防护研究

随着激光致盲武器的快速发展，与之对应的激光致盲防护技术逐渐成为了一项重要的研究。相变材料二氧化钒(VO₂)因在合适的热、光、场等激励下发生半导体相与金属相的可逆相变导致光学和电学特性的显著变化而受到激光防护领域的持续关注。使用Drude-Lorentz模型对VO₂的光学常数进行了研究，针对单层二氧化钒在半导体相红外透过率不够高的问题进行了多层膜设计和优化，并实际制作了多层膜系。使用激光器与傅里叶红外光谱仪测试制备的VO₂薄膜，得到了薄膜的相变与防护效果等性能，验证了VO₂良好的激光致盲防护性能，实际测试表明半导体相的透过率大于92%，相变前后多层膜系的红外开关率超过98%。     

退火Cu2O薄膜的结构及光学特性

采用射频(RF)磁控溅射单质金属铜(Cu)靶, 在O₂和Ar的混合气氛下制备了Cu₂O薄 膜,并在N₂气氛下对预沉积的Cu₂O薄膜进行快速光热退火(RTA)处理,研究了 衬底温度及退火温度对Cu₂O 薄膜的生长行为、物相结构、表面形貌及光学性能的影响。结果表明,衬底温度在300℃以 下预沉积的Cu₂O薄膜 为非晶薄膜,退火处理对Cu₂O薄膜的结晶行为有明显影响,在N₂气氛下对Cu₂O薄膜进 行退火处理不影响薄膜的物 相结构;预沉积和退火Cu₂O薄膜在650nm以下波长范围内均有较强 吸收,吸收强度随退火温度的增加而增强,薄 膜在400nm以下波长范围内出现两个由缺陷引起的中间带(IB)吸收行 为,快速热退火处理不能减少或消除薄膜沉积 过程中形成的缺陷态;退火处理影响薄膜的光学带隙Eg,预沉 积薄膜经600℃退火处理,E_g值增大了 0.26eV。     

VOLTE容灾机制研究及优化方案

_{本文首先对VOLTE现网网络结构及容灾机制进行研究分析,发现现存容灾机制中存在的缺点和不确定性,针对其中的问题,针对性地进行了深入研究和分析,创新的提出了1种快速容灾抢通方案,以达到提升VOLTE业务运维能力和用户业务感知的目的。}     

Calculation of energy band gaps in quaternary iii/v alloys

The dielectric theory of electronegativity is applied to the calculation of the compositional dependence of the energy band gap for quaternary III/V alloys of type A_l-xB_xC_1-yD_y and A_1-x-yB_xC_yD. The departure from linearity of E_G versus x and y is taken to be the sum of two terms, the intrinsic or virtual crystal term and the extrinsic term due to effects of aperiodicity which for one type of alloy may occur on both sublattices. Rather than simply treating the quaternary as an average of the bounding ternary systems, as has been common in the past, the intrinsic departure from linearity is calculated by assuming E_h,i,C, and D_av to vary linearly with x and y. The result is a smaller intrinsic deviation from linearity and a much better fit to existing data in the system Ga_1-xIn_xAs_1-y P_y. The calculation is also applied to three systems where no data exist but which are of great interest because of their potential application for the fabrication of lattice matched tandem solar cells: Ga_l-xA1_xAs_l-ySb_y. Ga_1-x-yA1_xIn_yAs, and GaAs_1-x-yP_xSb_y.     

新形势下河北移动全业务支撑策略研究

随着铁塔公司的成立及国家在“宽带中国”“提速降费”等一系列通信领域的重大战略实施,全业务运营越来越成为河北移动保持领先,实现卓越的重要支点。基于此河北移动启动大规模综合业务区建设,由传统传输网围绕基站建设转向全业务支撑。河北移动将综合业务区建设与全业务机房的选取统筹安排,建设综合业务区与全业务机房的联络光缆,将综合业务区光缆网成为承载重要集客数据专线和4G拉远站的载体,合理、有序、迅速实现“一张光缆网”的建设,鼎力支撑全业务及4G的发展。     

Nickel silicidation techniques for strained Si1?xGex, Si1?x?yGexCy, and Si1?yCy alloys material-device applications

A nickel silicide process for Si_1-xGe_x, Si_1-x-yGe_xC_y, and Si_1-yC_y alloy materials compatible with Si technology has been developed. Low-resistivity-phase (12–20 μΘ cm) nickel silicides have been obtained for these alloys with different low sheet-resistance temperature windows. The study shows that thin (15–18 nm) silicide layers with high crystalline quality, smooth silicide surface, and smooth interface between silicide and the underlying material are achievable. The technique could be used to combine the benefits of Ni silicide and Si_1-xGe_x, Si_1-x-yGe_xC_y, and Si_1-yC_y alloys. The technique is promising for Si or Si_1-xGe_x, Si_1-x-yGe_xC_y, and Si_1-yC_y alloy-based metal-oxide semiconductor, field-effect transistors (MOSFETs) or other device applications.     

Low pressure metalorganic chemical vapor deposition of InP and related compounds

The low pressure metalorganic chemical vapor deposition epitaxial growth and characterization of InP, Ga_0.47In_0.53 As and Ga_xIn_1-xAs_yP_1-y, lattice-matched to InP substrate are described. The layers were found to have the same etch pit density (EPD) as the substrate. The best mobility obtained for InP was 5300 cm² V⁻¹S⁻¹ at 300 K and 58 900 cm² V⁻¹ S⁻¹ at 77₂K, and for GaInAs was 11900 cm² V⁻¹ S⁻¹ at 300 K, 54 600 cm² V⁻¹ S⁻¹ at 77 K and 90 000 cm V⁻¹S⁻¹ at 2°K. We report the first successful growth of a GaInAs-InP superlattice and the enhanced mobility of a two dimensional electron gas at a GaInAs -InP heterojunction grown by LP-MO CVD. LP MO CVD material has been used for GaInAsPInP, DH lasers emitting at 1.3 um and 1.5 um. These devices exhibit a low threshold current, a slightly higher than liquid phase epitaxy devices and a high differential quantum efficiency of 60%. Fundamental transverse mode oscillation has been achieved up to a power outpout of 10 mW. Threshold currents as low as 200 mA dc have been measured for devices with a stripe width of 9 um and a cavity length of 300 um for emission at 1.5 um. Values of T in the range 64–80 C have been obtained. Preliminary life testing has been carried out at room temperature on a few laser diodes (λ = 1.5μm). Operation at constant current for severalthousand hours has been achieved with no change in the threshold current.     

Characterization of a rapid thermal anneal TiNxOy/TiSi2 contact barrier

In this paper, the physical and electrical properties of a TiN_xO_y/TiSi₂ dual layer contact barrier are reported. The TiN_xO_y/TiSi₂ barrier was formed by rapidly annealing a Ti thin film on Si in an N₂ ambient. During this process, the Ti film surface reacts with N₂ to form a TiN_xO_y skin layer and the bulk of the Ti film reacts with Si to form an underlying TiSi₂ layer. The influences of rapid thermal anneal (RTA) conditions on the TiN_xO_y layer were investigated by varying the RTA temperature from 600 to 1100° C and cycle duration from 30 to 100 s. It is found that the resulting TiN_xO_y and TiSi₂ layer thicknesses are dependent on RTA temperature and the starting Ti thickness. For a starting Ti thickness of 500Å, 150Å thick TiN_xO_y and 800Å thick TiSi₂ are obtained after an RTA at 900° C for 30 s. The TiN_xO_y thickness is limited by a fast diffusion of Si into Ti to form TiSi₂. When a Ti film is deposited on SiO₂, Ti starts to react with SiO₂ from 600° C and a significant reduction of the SiO₂ thickness is observed after an RTA at 900° C. The resulting layer is composed of a surface TiN_xO_y layer followed by a complex layer of titanium oxide and titanium suicide. In addition, when Ti is depos-ited on TiSi₂, thicker TiN_xO_y and TiSi₂ layers are obtained after RTA. This is because the TiSi₂ layer retards the diffusion of Si from the underlying substrate into the Ti layer. NMOSFETs were fabricated using the TiN_xO_y/TiSi₂ as a contact barrier formed by RTA at 900° C for 30 s and a significant reduction of contact resistance was obtained. In addition, electromigration test at a high current density indicated that a significant improvement in mean time to failure (MTF) has been obtained with the barrier.     

Processing of large YBa2 Cu3Ox domains for levitation applications by a Nd1+x Ba2−x Cu3 Oy-Seeded melt-growth technique

YBa₂Cu₃O_x domains for levitation applications have been produced by a seeding technology that includes Nd_1+x Ba_2−x Cu₃O_y seeds and melt-processing technologies such as conventional melt-textured growth, melt-texturing with PtO₂ and Y₂BaCuO₅ additions, and the new solid-liquid-melt-growth technology. Large domains (∼20 mm) with high levitation forces (F₁ up to 8.2 N) have been produced. The reproducibility of the results is good, and the capability of producing a large number of pellets in a single batch indicates good potential for the production of large amounts of this material.     

Transport properties of thermoelectric materials for coolers

The Seebeck coefficient, thermal conductivity, electrical conductivity and Hall coefficient of cooler grade, p-and n-type ternary alloys of Bi₂Te₃-Sb₂Te₃-Sb₂Se₃ were measured between 10 and 300 K. Between 300 K and about 150 K the temperature dependence of the transport properties can be explained by assuming nondegeneracy and a lattice scattering mechanism. The difference between the temperature dependence of the Hall effect in n-and p-type alloys can be explained by the presence of sub-bands of light and heavy holes in the valence band of p-type alloys.     

基于InP衬底的晶格失配In0.68Ga0.32As的MOCVD生长及其特性研究

采用MOCVD生长技术在InP衬底上成功实现了晶格失配的3μm In0.68 Ga0.32As薄膜生长.通过As组分的改变,利用张应变和压应变交替补偿的InAsxP1-x应变缓冲层结构来释放由于晶格失配所产生的应力,在InP衬底上得到了与In0.68Ga0.32 As晶格匹配的InAsxP1-x“虚拟”衬底,通过对缓冲层厚度的优化,使应力能够在“虚拟”衬底上完全豫弛.通过原子力显微镜(AFM)、高分辨XRD、透射电镜(TEM)和光致发光(PL)等测试分析表明,这种释放应力的方法能够有效提高In0.68 Ga0.32 As外延层的晶体质量.     

The effect of Tl2Te3 on the properties of the solid solution (Sb2Te3)0.75.(Bi2Te3)0.25

The effect on transport properties of the addition of 0.5-5% Tl₂Te₃ to p-type solid solutions of antimony and bismuth tellurides was studied. It was found that the addition of Tl₂Te₃ caused a lessening of the increase of hole concentration as low temperatures were approached, resulting in a slower decrease of the Seebeck coefficient with a decrease in temperature. In partial fulfillment of M.Sc. degree, Hebrew University, Jerusalem. Permanent address, Dept. of Inorganic and Analytical Chemistry, Hebrew University, Jerusalem.