Microstructures of epitaxial YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// thick films grown by photoassisted metal-organic chemical vapor deposition

Epitaxial, high-quality YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// (YBCO) thick films were grown by a photoassisted metal-organic chemical vapor deposition technique with a single liquid precursor delivery system, and characterized by X-ray diffraction (XRD), scanning electron microscopy, and low-high-resolution transmission electron microscopy techniques. Very dense and single-crystal-like film structure was observed in all of these YBCO thick films. Large precipitates on these thick films were identified as BaCu/sub 3/O/sub 4/, sprinkled only at surface of these YBCO thick films. YBCO thick films with high crystalline and superconductive quality were confirmed by data of XRD analyses and superconductivity measurements. At the same time, the reason why epitaxial YBCO thick films with high-quality single-crystal-like structure can be grown up to about 4.5 /spl mu/m thick is illustrated from the point of view of photoactivation. It is also found that these thick films were optimally oxygenated with their superconductive properties in concern.     

Wide-band superconducting microstrip delay line

This paper describes the design, fabrication, and testing of a novel microstrip superconducting delay line. The structure of the delay line is a double-spiral meander line. The device is patterned from a YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta//(YBCO) thin film deposited on both sides of a 2-in-diameter LaAlO/sub 3/ substrate with a thickness of 0.25 mm. It exhibits low insertion loss up to 20 GHz. At 10 GHz, the measured attenuation is 0.031 dB/ns at 30 K, 0.049 dB/ns at 60 K, and 0.118 dB/ns at 77 K. The magnitudes of the ripples are below 2 dB across the entire band. The total delay at low frequency is approximately 29 ns.     

A 310/spl deg//3.6-dB K-band phaseshifter using paraelectric BST thin films

Ferro- and para-electric BaSrTiO/sub 3/ (/spl epsiv//sub r//spl sim/350 and tg/spl delta//spl sim/5/spl times/10/sup -2/ at 0V) thin films were deposited by low-cost sol-gel techniques. Subsequently, the films were used for fabricating coplanar waveguide phaseshifters using tunable finger-shaped capacitors. A 310/spl deg/ phaseshift was obtained at 30GHz and 35V of tuning voltage with 3.6dB of insertion loss yielding a figure of merit of 85/spl deg//dB.     

InGaAs-InP DHBTs for increased digital IC bandwidth having a 391-GHz f/sub /spl tau// and 505-GHz f/sub max/

InP-In/sub 0.53/Ga/sub 0.47/As-InP double heterojunction bipolar transistors (DHBT) have been designed for use in high bandwidth digital and analog circuits, and fabricated using a conventional mesa structure. These devices exhibit a maximum 391-GHz f/sub /spl tau// and 505-GHz f/sub max/, which is the highest f/sub /spl tau// reported for an InP DHBT-as well as the highest simultaneous f/sub /spl tau// and f/sub max/ for any mesa HBT. The devices have been aggressively scaled laterally for reduced base-collector capacitance C/sub cb/. In addition, the base sheet resistance /spl rho//sub s/ along with the base and emitter contact resistivities /spl rho//sub c/ have been lowered. The dc current gain /spl beta/ is /spl ap/36 and V/sub BR,CEO/=5.1 V. The devices reported here employ a 30-nm highly doped InGaAs base, and a 150-nm collector containing an InGaAs-InAlAs superlattice grade at the base-collector junction. From this device design we also report a 142-GHz static frequency divider (a digital figure of merit for a device technology) fabricated on the same wafer. The divider operation is fully static, operating from f/sub clk/=3 to 142.0 GHz while dissipating /spl ap/800 mW of power in the circuit core. The circuit employs single-buffered emitter coupled logic (ECL) and inductive peaking. A microstrip wiring environment is employed for high interconnect density, and to minimize loss and impedance mismatch at frequencies >100 GHz.     

AlGaN/GaN/InGaN/GaN DH-HEMTs with an InGaN notch for enhanced carrier confinement

We report an AlGaN/GaN/InGaN/GaN double heterojunction high electron mobility transistors (DH-HEMTs) with high-mobility two-dimensional electron gas (2-DEG) and reduced buffer leakage. The device features a 3-nm thin In/sub x/Ga/sub 1-x/N(x=0.1) layer inserted into the conventional AlGaN/GaN HEMT structure. Assisted by the InGaN layers polarization field that is opposite to that in the AlGaN layer, an additional potential barrier is introduced between the 2-DEG channel and buffer, leading to enhanced carrier confinement and improved buffer isolation. For a sample grown on sapphire substrate with MOCVD-grown GaN buffer, a 2-DEG mobility of around 1300 cm/sup 2//V/spl middot/s and a sheet resistance of 420 /spl Omega//sq were obtained on this new DH-HEMT structure at room temperature. A peak transconductance of 230 mS/mm, a peak current gain cutoff frequency (f/sub T/) of 14.5 GHz, and a peak power gain cutoff frequency (f/sub max/) of 45.4 GHz were achieved on a 1/spl times/100 /spl mu/m device. The off-state source-drain leakage current is as low as /spl sim/5 /spl mu/ A/mm at V/sub DS/=10 V. For the devices on sapphire substrate, maximum power density of 3.4 W/mm and PAE of 41% were obtained at 2 GHz.     

InGaAs/InP DHBTs with 120-nm collector having simultaneously high f/sub /spl tau//, f/sub max//spl ges/450 GHz

InP/In/sub 0.53/Ga/sub 0.47/As/InP double heterojunction bipolar transistors (DHBT) have been designed for increased bandwidth digital and analog circuits, and fabricated using a conventional mesa structure. These devices exhibit a maximum 450 GHz f/sub /spl tau// and 490 GHz f/sub max/, which is the highest simultaneous f/sub /spl tau// and f/sub max/ for any HBT. The devices have been scaled vertically for reduced electron collector transit time and aggressively scaled laterally to minimize the base-collector capacitance associated with thinner collectors. The dc current gain /spl beta/ is /spl ap/ 40 and V/sub BR,CEO/=3.9 V. The devices operate up to 25 mW//spl mu/m/sup 2/ dissipation (failing at J/sub e/=10 mA//spl mu/m/sup 2/, V/sub ce/=2.5 V, /spl Delta/T/sub failure/=301 K) and there is no evidence of current blocking up to J/sub e//spl ges/12 mA//spl mu/m/sup 2/ at V/sub ce/=2.0 V from the base-collector grade. The devices reported here employ a 30-nm highly doped InGaAs base, and a 120-nm collector containing an InGaAs/InAlAs superlattice grade at the base-collector junction.     

Long-wavelength In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As large-area avalanche photodiodes and arrays

Large-area (500-/spl mu/m diameter) mesa-structure In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiodes (APDs) are reported. The dark current density was /spl sim/2.5/spl times/10/sup -2/ nA//spl mu/m/sup 2/ at 90% of breakdown; low surface leakage current density (/spl sim/4.2 pA//spl mu/m) was achieved with wet chemical etching and SiO/sub 2/ passivation. An 18 /spl times/ 18 APD array with uniform distributions of breakdown voltage, dark current, and multiplication gain has also been demonstrated. The APDs in the array achieved 3-dB bandwidth of /spl sim/8 GHz at low gain and a gain-bandwidth product of /spl sim/120 GHz.     

Distributed phase shifter with pyrochlore bismuth zinc niobate thin films

A monolithic Ku-band phase shifter employing voltage tunable Bi/sub 1.5/Zn/sub 1.0/Nb/sub 1.5/O/sub 7/ (BZN) thin film parallel plate capacitors is reported. BZN films were deposited by radio frequency magnetron sputtering on single-crystal sapphire substrates. A nine-section distributed coplanar waveguide loaded-line phase-shifter structure was designed. A differential phase shift of 175/spl deg/ was achieved with a maximum insertion loss of 3.5 dB at 15 GHz, giving a figure of merit /spl sim/50/spl deg//dB. To the best of our knowledge, this is the first demonstration of a monolithic tunable microwave circuit using BZN thin films.     

High-temperature thermal stability performance in /spl delta/-doped In/sub 0.425/Al/sub 0.575/As--In/sub 0.65/Ga/sub 0.35/As metamorphic HEMT

We report, to our knowledge, the best high-temperature characteristics and thermal stability of a novel /spl delta/-doped In/sub 0.425/Al/sub 0.575/As--In/sub 0.65/Ga/sub 0.35/As--GaAs metamorphic high-electron mobility transistor. High-temperature device characteristics, including extrinsic transconductance (g/sub m/), drain saturation current density (I/sub DSS/), on/off-state breakdown voltages (BV/sub on//BV/sub GD/), turn-on voltage (V/sub on/), and the gate-voltage swing have been extensively investigated for the gate dimensions of 0.65/spl times/200 /spl mu/m/sup 2/. The cutoff frequency (f/sub T/) and maximum oscillation frequency (f/sub max/), at 300 K, are 55.4 and 77.5 GHz at V/sub DS/=2 V, respectively. Moreover, the distinguished positive thermal threshold coefficient (/spl part/V/sub th///spl part/T) is superiorly as low as to 0.45 mV/K.     

DRAM plate electrode bias optimization for reducing leakage current in UV-O/sub 3/ and O/sub 2/ annealed CVD deposited Ta/sub 2/O/sub 5/ dielectric films

A new plate biasing scheme is described which allowed the use of 65% higher supply voltage without increasing the leakage current for the UV-O/sub 3/ and O/sub 2/ annealed chemical-vapor-deposited tantalum pentaoxide dielectric film capacitors in stacked DRAM cells. Dielectric leakage was reduced by biasing the capacitor plate electrode to a voltage lower than the conventionally used value of V/sub cc//2. Ta/sub 2/O/sub 5/ films with 3.9 nm effective gate oxide, 8.5 fF//spl mu/m/sup 2/ capacitance and <0.3 /spl mu/A/cm/sup 2/ leakage at 100/spl deg/C and 3.3 V supply are demonstrated.<>     

Superconducting quantum interference devices: State of the art and applications

Superconducting quantum interference devices (SQUIDs) are sensitive detectors of magnetic flux. A SQUID consists of a superconducting loop interrupted by either one or two Josephson junctions for the RF or dc SQUID, respectively. Low transition temperature (T/sub c/) SQUIDs are fabricated from thin films of niobium. Immersed in liquid helium at 4.2 K, their flux noise is typically 10/sup -6//spl Phi//sub 0/ Hz/sup -1/2/, where /spl Phi//sub 0//spl equiv/h/2e is the flux quantum. High-T/sub c/ SQUIDs are fabricated from thin films of YBa/sub 2/Cu/sub 3/O/sub 7-x/, and are generally operated in liquid nitrogen at 77 K. Inductively coupled to an appropriate input circuit, SQUIDs measure a variety of physical quantities, including magnetic field, magnetic field gradient, voltage, and magnetic susceptibility. Systems are available for detecting magnetic signals from the brain, measuring the magnetic susceptibility of materials and geophysical core samples, magnetocardiography and nondestructive evaluation. SQUID "microscopes" detect magnetic nanoparticles attached to pathogens in an immunoassay technique and locate faults in semiconductor packages. A SQUID amplifier with an integrated resonant microstrip is within a factor of two of the quantum limit at 0.5 GHz and will be used in a search for axions. High-resolution magnetic resonance images are obtained at frequencies of a few kilohertz with a SQUID-based detector.     

Composite right/left-handed transmission line based compact resonant antennas for RF module integration

Several electrically small resonant antennas employing the composite right/left-handed transmission line (CRLH-TL) are presented for integration with portable RF modules. The proposed antenna designs are based on the unique property of anti-parallel phase and group velocity of the CRLH-TL at its fundamental mode. In this mode, the propagation constant increases as the frequency decreases, therefore, a small guided wavelength can be obtained at a lower frequency to provide the small /spl lambda//sub g//2 resonant length used to realize a compact antenna design. Furthermore, the physical size and the operational frequency of the antenna depend on the unit cell size and the equivalent transmission line model parameters of the CRLH-TL, including series inductance, series capacitance, shunt inductance and shunt capacitance. Optimization of these parameters as well as miniaturization techniques of the physical size of unit cell is investigated. A four unit-cell resonant antenna is designed and tested at 1.06 GHz. The length, width and height of the proposed antenna are 1/19/spl lambda//sub 0/, 1/23/spl lambda//sub 0/ and 1/83/spl lambda//sub 0/, respectively. In addition, a compact antenna using a 2-D three by three mushroom like unit cell arrangement is developed at 1.17 GHz, showing that an increased gain of 0.6 dB and higher radiation efficiency can be achieved over the first prototype antenna. The same design is applied in the development of a circularly polarized antenna operating at 2.46 GHz. A 116/spl deg/ beamwidth with axial ratio better than 3 dB is observed. The physical size of the proposed mushroom type small antenna and the circularly polarized antenna is 1/14/spl lambda//sub 0/ by 1/14/spl lambda//sub 0/ by 1/39/spl lambda//sub 0/ and 1/10/spl lambda//sub 0/ by 1/10/spl lambda//sub 0/ by 1/36/spl lambda//sub 0/, respectively.     

Highly linear Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMTs

We report an Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMT with enhanced linearity. By engineering the channel region, i.e., inserting a 6-nm-thick AlGaN layer with 5% Al composition in the channel region, a composite-channel HEMT was demonstrated. Transconductance and cutoff frequencies of a 1 /spl times/100 /spl mu/m HEMT are kept near their peak values throughout the low- and high-current operating levels, a desirable feature for linear power amplifiers. The composite-channel HEMT exhibits a peak transconductance of 150 mS/mm, a peak current gain cutoff frequency (f/sub T/) of 12 GHz and a peak power gain cutoff frequency (f/sub max/) of 30 GHz. For devices grown on sapphire substrate, maximum power density of 3.38 W/mm, power-added efficiency of 45% are obtained at 2 GHz. The output third-order intercept point (OIP3) is 33.2 dBm from two-tone measurement at 2 GHz.     

Room-temperature self-organised In/sub 0.5/Ga/sub 0.5/As quantum dot laser on silicon

The first room-temperature operation of In/sub 0.5/Ga/sub 0.5/As quantum dot lasers grown directly on Si substrates with a thin (/spl les/2 /spl mu/m) GaAs buffer layer is reported. The devices are characterised by J/sub th//spl sim/1500 A/cm/sup 2/, output power >50 mW, and large T/sub 0/ (244 K) and constant output slope efficiency (/spl ges/0.3 W/A) in the temperature range 5-95/spl deg/C.     

A Catalog of Low Power Loss Parameters and High Power Thresholds for Partially Magnetized Ferrites

The low power loss and high power threshold properties have been measured on a number of candidate ferrite phase-shifting materials. The low power loss is characterized by /spl mu//sub 0/', the imaginary part of the diagonal component of the permeability tensor for the completely demagnetized state. /spl mu/sub 0/' was measured from 3.0 to 16.8 GHz. The high power properties are characterized by the parallel pump threshold at a bias field correspontig to H/sub i/ /spl equiv/ 0 and to 4/spl pi/M /spl equiv/ 4/spl pi/M/sub s/. The threshold was measured between 3.0 and 16.8 GHz. For the purposes of computer calculation /spl mu//sub 0/' and h/sub crit/ were fit to an equation of the form A (/spl gamma/4/spl pi/M/sub s/ / /spl omega/)/sup N/. Translating /spl mu//sub 0/' and h/sub crit/ to /spl Delta/H/sub eff/ and /spl Delta/H/sub k/ gives the YIG plus Al as the lowest loss and lowest threshold materials followed by the Gd garnets and MgMn spinels. The Ni spinels are very Iossy.     

Diamond FET using high-quality polycrystalline diamond with f/sub T/ of 45 GHz and f/sub max/ of 120 GHz

Using high-quality polycrystalline chemical-vapor-deposited diamond films with large grains (/spl sim/100 /spl mu/m), field effect transistors (FETs) with gate lengths of 0.1 /spl mu/m were fabricated. From the RF characteristics, the maximum transition frequency f/sub T/ and the maximum frequency of oscillation f/sub max/ were /spl sim/ 45 and /spl sim/ 120 GHz, respectively. The f/sub T/ and f/sub max/ values are much higher than the highest values for single-crystalline diamond FETs. The dc characteristics of the FET showed a drain-current density I/sub DS/ of 550 mA/mm at gate-source voltage V/sub GS/ of -3.5 V and a maximum transconductance g/sub m/ of 143 mS/mm at drain voltage V/sub DS/ of -8 V. These results indicate that the high-quality polycrystalline diamond film, whose maximum size is 4 in at present, is a most promising substrate for diamond electronic devices.     

Temperature-compensated film bulk acoustic resonator above 2 GHz

Two different types of temperature-compensated film bulk acoustic resonators (FBARs) are designed, fabricated, and tested. One is formed by integrating FBAR with a surface-micromachined air-gap capacitor, which passively reduces the FBAR's temperature coefficient of frequency (TCF) by about 40 ppm//spl deg/C at 2.8 GHz. With this approach, zero TCF would easily have been achieved if the FBARs were built on AlN rather than ZnO. The other type of temperature compensated FBAR is built on a surface-micromachined SiO/sub 2/ cantilever that is released by XeF/sub 2/ vapor etching of silicon. The Al-ZnO-Al-SiO/sub 2/ FBAR is measured to have a TCF of -0.45 ppm//spl deg/C (between 85/spl deg/C and 110/spl deg/C) at 4.4 GHz.     

SOI technology for radio-frequency integrated-circuit applications

This paper presents a silicon-on-insulator (SOI) integration technology, including structures and processes of OFF-gate power nMOSFETs, conventional lightly doped drain (LDD) nMOSFETs, and spiral inductors for radio frequency integrated circuit (RFIC) applications. In order to improve the performance of these integrated devices, body contact under the source (to suppress floating-body effects) and salicide (to reduce series resistance) techniques were developed for transistors; additionally, locally thickened oxide (to suppress substrate coupling) and ultra-thick aluminum up to 6 /spl mu/m (to reduce spiral resistance) were also implemented for spiral inductors on high-resistivity SOI substrate. All these approaches are fully compatible with the conventional CMOS processes, demonstrating devices with excellent performance in this paper: 0.25-/spl mu/m gate-length offset-gate power nMOSFET with breakdown voltage (BV/sub DS/) /spl sim/ 22.0 V, cutoff frequency (f/sub T/)/spl sim/15.2 GHz, and maximal oscillation frequency (f/sub max/)/spl sim/8.7 GHz; 0.25-/spl mu/m gate-length LDD nMOSFET with saturation current (I/sub DS/)/spl sim/390 /spl mu/A//spl mu/m, saturation transconductance (g/sub m/)/spl sim/197 /spl mu/S//spl mu/m, cutoff frequency /spl sim/ 25.6 GHz, and maximal oscillation frequency /spl sim/ 31.4 GHz; 2/5/9/10-nH inductors with maximal quality factors (Q/sub max/) 16.3/13.1/8.95/8.59 and self-resonance frequencies (f/sub sr/) 17.2/17.7/6.5/5.8 GHz, respectively. These devices are potentially feasible for RFIC applications.     

Integrated high-/spl kappa/ (/spl kappa/ /spl sim/19) MIM capacitor with Cu/low-/spl kappa/ interconnects for RF application

We demonstrate a high-performance metal-high /spl kappa/ insulator-metal (MIM) capacitor integrated with a Cu/low-/spl kappa/ backend interconnection. The high-/spl kappa/ used was laminated HfO/sub 2/-Al/sub 2/O/sub 3/ with effective /spl kappa/ /spl sim/19 and the low-/spl kappa/ dielectric used was Black Diamond with /spl kappa/ /spl sim/2.9. The MIM capacitor (/spl sim/13.4 fF//spl mu/m/sup 2/) achieved a Q-factor /spl sim/53 at 2.5 GHz and 11.7 pF. The resonant frequency f/sub r/ was 21% higher in comparison to an equivalently integrated Si/sub 3/N/sub 4/-MIM capacitor (/spl sim/0.93 fF//spl mu/m/sup 2/) having similar capacitance 11.2 pF. The impacts of high-/spl kappa/ insulator and low-/spl kappa/ interconnect dielectric on the mechanism for resonant frequency improvement are distinguished using equivalent circuit analysis. This letter suggests that integrated high-/spl kappa/ MIM could be a promising alternative capacitor structure for future high-performance RF applications.     

IF-sampling fourth-order bandpass /spl Delta//spl Sigma/ modulator for digital receiver applications

Bandpass modulators sampling at high IFs (/spl sim/200 MHz) allow direct sampling of an IF signal, reducing analog hardware, and make it easier to realize completely software-programmable receivers. This paper presents the circuit design of and test results from a continuous-time tunable IF-sampling fourth-order bandpass /spl Delta//spl Sigma/ modulator implemented in InP HBT IC technology for use in a multimode digital receiver application. The bandpass /spl Delta//spl Sigma/ modulator is fabricated in AlInAs-GaInAs heterojunction bipolar technology with a peak unity current gain cutoff frequency (f/sub T/) of 130 GHz and a maximum frequency of oscillation (f/sub MAX/) of 130 GHz. The fourth-order bandpass /spl Delta//spl Sigma/ modulator consists of two bandpass resonators that can be tuned to optimize both wide-band and narrow-band operation. The IF is tunable from 140 to 210 MHz in this /spl Delta//spl Sigma/ modulator for use in multiple platform applications. Operating from /spl plusmn/5-V power supplies, the fabricated fourth-order /spl Delta//spl Sigma/ modulator sampling at 4 GSPS demonstrates stable behavior and achieves a signal-to-(noise + distortion) ratio (SNDR) of 78 dB at 1 MHz BW and 50 dB at 60 MHz BW. The average SNDR performance measured on over 250 parts is 72.5 dB at 1 MHz BW and 47.7 dB at 60 MHz BW.