回路热管换热性能的实验研究

为研究回路热管(LHP)的换热性能,制作了简单的回路热管换热性能测试装置。采用不锈钢为回路热管的材料,500目铜丝网为吸液芯,实验研究了回路热管不同功率下对启动时间和热管热阻的影响。研究结果表明,回路热管的功率增大,启动时间越短,热阻也相应的减小;同时,回路热管冷凝器入口和储液室入口的温度在LHP启动后,会呈现相反的温度波动。研究结果为回路热管散热器的应用提供了理论依据和方便的测试手段。     

大功率LED散热回路热管的实验研究

大功率LED热问题是制约大功率 LED的稳定性、可靠性和寿命的技术瓶颈之一,有效的低热阻封装LED热设计是提高LE D性能的关键。本文提 出一种应用于大功率LED散热的铜-水回路热管(LHP),研究了加热方 式、充液率、风压和倾角 等对LHP均温性、起动性和热阻等的影响。研究结果表明:在输入功率为30W时,LHP的启动时间约为 6.5min;热阻范围为0.48～1.62K/W;在热 负荷为30W时,蒸发器的温度可以稳定控制在75℃以下;蒸发器表 面均温差被控制在1.6℃以下;LHP的最佳的充液率为60%;冷凝器侧 风压在一定范围内(小于130Pa)时,冷凝器侧风压力越大,LED产 品的散热性能越好。     

回路热管传热特性的测试与分析

回路热管(LHP)是一种利用工质蒸发和冷凝的相变传递热量的高效传热装置。为研究LHP的换热特性,制作了简单的LHP传热性能测试装置。LHP原材料采用不锈钢,工质为二次蒸馏水,毛细吸液芯为500目的铜丝网。实验研究了热负荷及倾斜角度对回路热管传热特性的影响,结果表明,LHP的启动时间和阻值随着加热功率的增加而降低,而随着倾斜角度的单调增大,LHP的启动时间和阻值则呈现先减小后增大的趋势,表现出优越的传热特性。研究结果为LHP在不同安装场合条件下的运用提供一定的实验依据,同时也为现代电子设备散热问题提供了的一种解决途径。     

适用于大功率光电芯片散热的一体化平板热管

为解决大功率光电芯片散热问题,构造了一种新结构一体化平板热管。利用超轻多孔泡沫金属作为毛细吸液芯,以水、丙酮和乙醇为工质,在不同充液比、加热功率和倾角条件下对新结构热管的热性能进行了研究,结果表明,这种新结构平板热管不仅消除了热管与散热片间的接触热阻,而且使整个散热翅片也处于均温状态,当功率达到380W、热流密度超过445 W/cm2时,热管仍具有较好的均温特性,且热阻较小,可达0.04℃/W。在3种工质中,水是最佳工质选择,且当充液比为30%时具有较好的效果。实验表明,以泡沫金属为吸液芯的新结构一体化平板热管具有很好的传热性能,并扩展了承载大热流密度的能力。     

应用于大功率LED器件的回路热管散热研究

为解决大功率LED的散热问题,提出一种应用于大功率LED散热的微型回路热管,研究了充液率和倾斜角度对热管冷却大功率LED的启动性能、结温和热阻等特性的影响.研究结果表明:热管的最佳充液率为60％,系统的总热阻为7.5 K/W,此时对应的热管的热阻为1.6 K/W;热管的启动时间约为6.5 min,LED的结点温度被控制在42℃以下,很好地满足了大功率LED的结温稳定性要求.     

大功率LED太阳花散热器的结构优化

对一款大功率LED太阳花散热器(RHS)进行了热阻建模、工作温度测量和软件仿真。依据传热学基本原理建立热阻模型,采用数字温度表进行温度测量,借助专业电子产品热分析软件Icepak进行模拟仿真。在误差允许的范围内,散热器温度的实验值与理论值保持一致,证明了利用Icepak进行软件仿真的可行性与可靠性。在此基础上,运用控制变量法,以散热器最高工作温度为目标,利用Icepak软件对散热器的肋片数量、铝板直径和铝板厚度进行优化,为该散热器的结构优化提供了参考。     

压电泵驱动闭式水冷回路实验研究

设计了一种压电泵驱动闭式水冷回路传热系统,压电泵采用双腔串联结构,在150 V驱动电压下,泵水流量达330 mL/min。为了分析水蒸气对压电泵驱动闭式水冷回路传热性能影响,该文采用实验方法研究了不同充液率下压电泵驱动水冷回路的启动和稳态工作特点。实验结果表明,闭式回路内压电泵在充液率大于0.895时才能启动。当充液率大于0.930时,少量气相的存在对压电泵及传热系统的工作性能影响较小,系统传热热阻小于0.2 ℃/W。     

LED简灯热管散热器的试验研究及性能评价

为获得基于自然对流的异型热管散热器用于LED筒灯的工作性能,研制了热管散热器试验件,并进行了试验研究。结果表明：热管散热器启动性能良好,启动时间约为33min;散热器具有较好的均温性能,40W时蒸发面最大温差为4．7℃;在试验条件下,热源表面最高温度不超过70℃;加热功率对接触热阻、扩散热阻和热管热阻基本无影响,而翅片换热热阻随加热功率的增加而减小。基于试验所得结果,并通过热阻网络分析,论证了异型热管散热器可满足LED筒灯散热的需求。     

基于烟囱效应的LED太阳花与梳状散热器对比

为了提高LED的散热性能,基于烟囱效应原理,对比了LED梳状散热器和太阳花散热器的散热效果。通过Solidworks建立实体模型,通过其插件Flow Simulation对建立的模型进行热仿真。在保持散热器质量不变的前提下,研究了不同烟囱高度对配备梳状散热器和太阳花散热器的LED芯片最高温度的影响。并对烟囱高度为40 mm的太阳花散热器进行了实验验证,经实验测量,此时LED芯片的最高温度为81℃,与模拟结果只相差1.28℃,证实了模拟的正确性。仿真表明:在烟囱效应下,LED太阳花散热器的散热效果要强于梳状散热器,并且当烟囱高度大于45 mm时,二者的温度差随着烟囱高度的增加不断扩大。     

并行多通道大功率LED回路热管散热器

为解决大功率LED散热问题,构造了一种一体化并 行多通道大功率LED回路热管散热器。利用水作为工质,在不同加热功率、不同倾斜角以及 不同充液比条件下对该新结构热管散热器的热性 能进行了研究。结果表明,这种新结构热管散热器不仅能使散热器上下底板处于均温状态, 而且当芯片加 热功率达到200W时,芯片加热面中心最高温度不超过71.8℃;倾斜角度对热管换热性能影响不大;在一 定加热功率范围内,新结构热管散热器的热阻随加热功率的增大而减小,当芯片加热功率达 到240W时, 热阻最小,最小可达0.19K/W。构造的一体化并行多通道大功率LED 回路热管散热器具有很好的传热性能,并提高了承载高热流密度的能力。     

基于热管散热的人功率LED热特性测量与分析

提出了一种新型结构的同路热管,建立了回路热管性能测试试验装置.在相同的测试条件下,研究了热负荷、倾角等对回路热管的起动特性和均温特性、热阻等传热性能的影响.试验结果表明,热管散热器的热阻在0.21 K/W～2.6 K/W之间,且整个散热器具有均匀的温度分布.与当前的LED散热器相比,这种结构的热管散热器具有散热效率高、结构紧凑、加工方便、热阻小、重量轻、成本低等特点,可以满足大功率LED散热的要求.     

Thermal analysis of high power LED package with heat pipe heat sink

The goal of this study is to improve the thermal characteristics of high power LED (light-emitting diode) package using a flat heat pipe (FHP). The heat-release characteristics of high power LED package are analyzed and a novel flat heat pipe (FHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of high power LED package with flat heat pipe heat sink have been investigated experimentally. The obtained results indicate that the junction temperature of LED is about 52 °C for the input power of 3 W, and correspondingly the total thermal resistance of LED system is 8.8 K/W. The impact of the different filling rates and inclination angles of the heat pipe to the heat transfer performance of the heat pipe should be evaluated before such a structure of heat pipe cooling system is used to cool high power LED system.     

1D and Q2D thermal resistance analysis of micro channel structure and flat plate heat pipe

Heat pipes and two-phase heat transfer devices are widely used in electronics cooling, and the thermal resistance is a key issue to ensure the system performance and reliability. In this study, the traditional one dimensional (1D) and quasi-two dimensional (Q2D) methods were utilized to analyze the thermal resistance of the previous boiling experiments of evaporator tests with silicon (Si) and copper (Cu) micro channel structures as well as the existing flat-plate heat pipe tests with aluminum micro channels as wick structures. The temperature distributions and variations under different test conditions were collected, and the 1D and Q2D methods were applied to calculate the overall thermal resistance for evaporator tests and heat pipe tests and compared with the experimental data. The results showed that the Q2D method can predict the overall thermal resistance for the evaporator region and the whole heat pipe with a higher accuracy because the spreading resistance was significant and should be considered under small heater area (hot spot) conditions. Detailed distributions of thermal resistance and the calculated errors of each test sample under different heat loads were presented and compared. For present tests, the Q2D method can reach a lower average error (about 10%) and is recommended for calculations. Furthermore, the spreading resistance of Q2D method is further applied to calculate the selected test cases to investigate the wall thickness effects. The spreading resistance of the selected evaporator tests and heat pipe tests may decrease and increase, respectively, as wall thickness increases due to different evaporative heat transfer conditions. The present results demonstrate the applicability of the Q2D methods for both evaporator and heat pipe tests, and the present analyses can be a reference for future thermal management and electronic cooling designs.     

Experimental study on high-power LEDs integrated with micro heat pipe

Micro heat pipe (MHP) is applied to implement the efficient heat transfer of light emitting diode (LED) device. The fabrication of MHP is based on micro-electro-mechanical-system (MEMS) technique, 15 micro grooves were etched on one side of silicon (Si) substrate, which was then packaged with aluminum heat sink to form an MHP. On the other side of Si substrate, three LED chips were fixed by die bonding. Then experiments were performed to study the thermal performance of this LED device. The results show that the LED device with higher filling ratio is better when the input power is 1.0 W; with the increase of input power, the optimum filling ratio changes from 30% to 48%, and the time reaching stable state is reduced; when the input power is equal to 2.5 W, only the LED device with filling ratio of 48% can work normally. So integrating MHP into high-power LED device can implement the effective control of junction temperature.     

一种回路热管对大功率LED散热的研究

针对大功率LED散热能力较其它照明灯具差这一问题,研制了一种应用在多芯片大功率LED散热上的回路热管装置,并研究了热负荷、倾角等对热管的起动性、均温性和热阻等的影响。试验结果表明,所设计的热管散热器的热阻在0.48～1.47K/W之间;在蒸发器倾斜角为0°和30°时,蒸发器的均温性分别被控制在1.5℃和4.3℃以内。因此,将这种结构的热管应用在大功率LED散热系统中时,首先应该对蒸发器倾斜角度对系统散热性能的影响进行测试评估。     

LED筒灯复合结构热管散热器的数值模拟

为解决LED筒灯使用单纯自然对流散热扩散热阻过大、温度分布不均的问题,提出一种基于平板热管和热虹吸管的复合结构热管散热器,并用数值模拟的方法研究了热功率、翅片高度、翅片数目、辐射换热对该散热器性能的影响。模拟结果表明应用于LED筒灯的复合结构热管散热器的热阻随着热功率的增加而减小,翅片高度和翅片数目存在一个最优值,使得散热器温度和热阻最小,自然对流情况下不可忽视辐射换热的作用。