金离子注入二氧化锆薄膜的单极电阻转变特性研究

The resistive switching characteristics of Au＋-implanted ZrO2 films are investigated. The Au/Cr/Au＋ -implanted-ZrO2/n＋-Si sandwiched structure exhibits reproducible unipolar resistive switching behavior. After 200 write-read-erase-read cycles, the resistance ratio between the high and low resistance states is more than 180 at a readout bias of 0.7 V. Additionally, the Au/Cr/Au＋-implanted-ZrO2/n＋-Si structure shows good retention characteristics and nearly 100% device yield. The unipolar resistive switching behavior is due to changes in the film conductivity related to the formation and rupture of conducting filamentary paths, which consist of implanted Au ions.     

Unipolar resistive switching of Au+-implanted ZrO2 films

The resistive switching characteristics of Au+-implanted ZrO2 films are investigated.The Au/Cr/Au+-implanted-ZrO2/n+-Si sandwiched structure exhibits reproducible unipolar resistive switching behavior.After 200 write-read-erase-read cycles,the resistance ratio between the high and low resistance states is more than 180 at a readout bias of 0.7 V. Additionally,the Au/Cr/Au+-implanted-ZrO2/n+-Si structure shows good retention characteristics and nearly 100% device yield.The unipolar resistive switching behavior is due to changes in the film conductivity related to the formation and rupture of conducting filamentary paths,which consist of implanted Auions.     

Multilevel resistive switching and nonvolatile memory effects in epoxy methacrylate resin and carbon nanotube composite films

A novel multilevel resistive switching was observed in epoxy methacrylate resin (EMAR) and carbon nanotubes (CNTs) composite films fabricated by spin coating method. The fabricated devices demonstrated the rewritable nonvolatile memory characteristics. More significantly, the memory device based on EMAR+CNTs composite exhibits multilevel stable conductivity states with stable intermediate resistance states in response to the applied voltage. By setting different compliance current and content of CNTs in composite film, the multilevel ON-states and even the multilevel OFF-states have been observed in our memory device. As fabricated devices exhibited multilevel resistive switching with stable resistance ratio between different resistance states having good data retention and endurance characteristics. It offers a novel design strategy for solution processable multilevel data storage.     

A New Emitter Switched Thyristor (EST) employing Trench Segmented p-base

A new emitter switched thyristor (EST) employing trench segmented p-base, which successfully improves the forward I-V and switching characteristics with decreasing the device active area, is proposed and verified experimentally with using shallow trench process of novel junction termination extension (JTE) method. The latching current of EST is determined by the p-base resistance of upper npn transistor. Floating n+emitter of conventional EST is enlarged to obtain large base resistance. However, the proposed EST increases the p-base resistance with shorter floating n+ emitter than that of conventional one. Shallow trench in floating emitter region forms the highly resistive p-base region under the bottom of trench. The experimental results show that the shortened floating n+ emitter and lowered latching current of proposed EST decrease experimentally the forward voltage drop by 17.7% and snap-back phenomenon with small active area. The breakdown voltage of series lateral MOSFET of proposed EST is increased from 7 to 14 V due to the trench filled with oxide which results in vertical redistribution of electric field, therefore current saturation capability and forward biased safe operating area (FBSOA) of proposed EST are enhanced. The simulation results show that the switching operation is performed successfully at the blocking voltage of 600 V and Eoff of the proposed one is reduced by 3.7%. The measured inductive load switching characteristics also shows that Eoff of proposed one is improved by 7.2%.     

Self‐Limited Switching in Ta2O5/TaOx Memristors Exhibiting Uniform Multilevel Changes in Resistance

To facilitate the development of memristive devices, it is essential to resolve the problem of non‐uniformity in switching, which is caused by the random nature of the filamentary switching mechanism in many resistance switching memories based on transition metal oxide. In addition, device parameters such as low‐ and high‐state resistance should be regulated as desired. These issues can be overcome if memristive devices have switching limits for both the low‐ and high‐resistance states and if their resistance values are highly controllable. In this study, a method termed self‐limited switching for uniformly regulating the values of both the low‐ and high‐resistance states is suggested, and the circuit configuration required for the self‐limited switching is established in a Ta₂O₅/TaO_x memristive structure. A method of improving the uniformity of multi‐level resistance states in this memristive system is also proposed.     

Polarisation-switching-induced resistance change in ferroelectric Mg-doped LiNbO/sub 3/ single crystals

Reversible resistance change at room temperature by polarisation switching is reported in ferroelectric single crystals. Resistance switching up to six orders of magnitude in Mg-doped LiNbO/sub 3/ was found. The resistance change is caused by the polarisation switching and increases with Mg concentration. Based on these results, continuous switching properties and memory behaviours were demonstrated.     

改进型三值RTD量化器的设计

共振隧穿二极管RTD本身所特有的负阻微分特性使其成为天然的多值器件。介绍了三值RTD和三值RTD+HEMT的伏安特性以及三值RTD量化器和开关序列的工作原理,以RTD开关序列模型为指导思想设计出改进型三值RTD量化器电路,比原电路结构简单,仿真结果验证了设计的正确性。该设计方法不仅可以用于实现更简单和更灵活的三值RTD量化器,还能用于更高值的多值RTD逻辑电路的设计中。     

电阻制动斩波器控制策略的仿真

机车处于电阻制动工况时,为保证中间环节直流电压不超过允许工作电压,必须对置于中间环节的电阻制动斩波器进行控制。传统上是采用滞环比较控制策略进行控制,但该控制方法中的IGBT的开关频率一般不会固定,如果IGBT的开关频率不固定,极有可能导致检测电压中混杂具有较宽的频谱范围的谐波,这样会增加检测电压中滤波器设计的难度,这一点是滞环比较控制方法较为局限的地方。本文分析对比了PI控制、前馈+PI控制和直接占空比控制三种控制策略的优缺点,结合仿真和现场经验,提出直接占空比控制策略在现场应用中达到控制目标的前提下,安全度更高。     

Highly sustainable mechanical/electrical resistance switching behaviors via one-dimensional Ag/TiO2 core-shell resistive switchable materials in flexible composite

Composite-based resistance switching random access memory (ReRAM) has great potential for application in flexible and wearable electronics. However, its large operating parameters and low reliability still have some limitations in realizing practical applications, which is derived from its high dependence on the orientation and dispersion of the filler in the composite layer. Here, we proposed a novel composite system that does not depend heavily on the orientation or dispersion of the fillers within the composite film of the ReRAM device. The AgNW/TiO₂ core-shell nanowires inducing superb resistance switching behavior were fabricated. The composite resistance switching (RS) film was prepared by mixing the one-dimensional core-shell particles and poly (vinyl alcohol) (PVA) dielectric matrix. The composite RS film exhibited remarkable resistance switching behavior with extremely low/uniform operating voltage (V_set ~ 0.13 ± 0.013 V, and V_reset ~ −0.10 ± 0.012 V), and the reliable switching behavior was maintained for up to ~200,000 mechanical deformation cycles under 3 mm of bending radius. To evaluate the resistance switching mechanism of the composite-type ReRAM, the structural analysis and device modeling were performed.     

Voltage-Polarity-Independent and High-Speed Resistive Switching Properties of V-Doped SrZrO3 Thin Films

In this paper, nonpolar resistive switching behavior is reported for the first time in a SZO-based memory device. The electrode materials used which have different conductivities affect the resistive switching properties of the device. The Al/V:SZO-LNO/Pt device shows nonpolar switching behavior, whereas the Al/V:SZO/LNO device has bipolar switching property. The resistance ratios of these two devices are quite distinct owing to the difference between the resistance of low resistance states. The Al/V:SZO-LNO/Pt device with lower resistive switching voltages (mnplus7 V turn on and mnplus2 V turn off) and higher resistance ratio is more suitable for practical applications compared to the Al/V:SZO/LNO device. The switching speed of the Al/V:SZO-LNO/Pt device is 10 ns, which is the fastest speed that has ever been reported. The conduction mechanisms, nondestructive readout property, retention time, and endurance of this device are also reported in this paper.     

基于聚乙烯咔唑的非挥发型阻变存储特性分析

采用聚乙烯咔唑作为活性层构建了ITO/PVK/Al的三明治结构阻变存储元件,并对其阻变特性进行了测量。结果表明其具有明显的非挥发型双稳态阻变特性, 具有WORM存储特性。该元件具有良好的数据保持能力和耐久能力,开关态电流比可达103,且具有较低的阈值转换电压。分别对低阻态和高阻态的载流子传输机制进行了拟合, 低阻态为欧姆传导机制,高阻态为空间电荷限制电流发射机制。根据载流子传输机制, 对阻变特性进行了解释。     

The new switching effect in liquid selenium

Liquid selenium shows above 720°C a reversible switching from higher to lower conductance effected by an electric field. Below 720°C liquid selenium switches first to higher and then to lower conductance. After switching to low conductance, a voltage controlled negative resistance is observed. By means of a single pulse technique the current oscillograms of the switchings (switching to high conductance, to low conductance and multi-switching) are investigated. The influence of magnetic field upon the switching (delay time and threshold voltage) is investigated. An electronic explanation for the switching and the influence of the magnetic field on it is given.     

Layered (C6H5CH2NH3)2CuBr4 Perovskite for Multilevel Storage Resistive Switching Memory

Although there have been attempts to use non‐lead based halide perovskite materials as insulating layers for resistive switching memory, the ratio of low resistance state (LRS) to high resistance state (HRS) ( = ON/OFF ratio) and/or endurance is reported to be mostly lower than 10³. Resistive switching memory characteristics of layered (BzA)₂CuBr₄ (BzA = C₆H₅CH₂NH₃) perovskite with high ON/OFF ratio and long endurance are reported here. The X‐ray diffraction (XRD) pattern of the deposited (BzA)₂CuBr₄ layer shows highly oriented (00l) planes perpendicular to a Pt substrate. An Ag/PMMA/(BzA)₂CuBr₄/Pt device shows bipolar switching behavior. A forming step at around +0.5 V is observed before the repeated bipolar switching at the SET voltage of +0.2 V and RESET voltage of ‐0.3 V. The ON/OFF ratio as high as =10⁸ is monitored along with an endurance of ≈2000 cycles and retention time over 1000 s. The high ON/OFF ratio enables multilevel storage characteristics as confirmed by changing the compliance currents. Ohmic conduction at the LRS and Schottky emission at HRS are involved in electrochemical metallization process. The bipolar resistive switching property is retained after storing the device at ambient condition under relative humidity of about 50% for 2 weeks, which indicates that (BzA)₂CuBr₄ is stable memory material.     

Breakdown voltage and reverse recovery characteristics offree-standing GaN Schottky rectifiers

Schottky rectifiers with implanted p⁺ guard ring edge termination fabricated on free-standing GaN substrates show reverse breakdown voltages up to 160 V in vertical geometry devices. The specific on-state resistance was in the range 1.7-3.0 Ω·cm ², while the turn-on voltage was ~1.8 V. The switching performance was analyzed using the reverse recovery current transient waveform, producing an approximate high-injection, level hole lifetime of ~15 ns. The bulk GaN rectifiers show significant improvement in forward current density and on-state resistance over previous heteroepitaxial devices     

A silicon double switching inversion-controlled switch formultiple-valued logic applications

A device with the structure of metal/thin insulator/crystalline silicon (n⁺-p)/thin insulator/metal (MISSIM) has been demonstrated to possess a double switching characteristics, which is expected to generate multiple stable states easier than the conventional resonant tunneling devices with multiple negative resistance for multiple-valued logic applications. Based on current-voltage measurements with or without light irradiation, and under the negative gate-biased condition, the operation mechanism of the MISSIM structure is proposed and illustrated in detail     

Resistance switching of the nonstoichiometric zirconium oxide for nonvolatile memory applications

The resistance switching behavior and switching mechanism of nonstoichiometric zirconium oxide thin films were investigated for nonvolatile memory application. The Pt/ZrO/sub x//p/sup +/-Si sandwich structure fabricated by reactive sputtering shows two stable resistance states. By applying proper bias, resistance switching from one to another state can be obtained. The composition in ZrO/sub x/ thin films were confirmed from X-ray photoelectron spectroscope (XPS) analysis, which showed three layers such as top stoichiometric ZrO/sub 2/ layer with high resistance, transition region with medium resistance, and conducting ZrO/sub x/ bulk layer. The resistance switching can be explained by electron trapping and detrapping of excess Zr/sup +/ ions in transition layer which control the distribution of electric field inside the oxide, and, hence the current flow.     

Theory of switching phenomena in metal/semi-insulator/n-p silicon devices

The theory of switching is presented for a structure consisting of a p⁺-n junction and a metal electrode separated from the N-section of the p⁺-n junction by a semi-insulating (leaky) layer.

When a negative bias is applied to the electrode, the section of the n-layer under the electrode goes into deep depletion. In this mode, the current through the device is limited by generation in the deeply depleted region. This is the high-impedance or OFF state of the device.

At a sufficiently high voltage, the switching voltage, V_s, the p⁺-n junction is turned on by either avalanching in the n-layer or by the deep-depletion region extending through to the p⁺-n region (punch-through). When the junction turns on, the n-section goes from deep-depletion towards inversion. Thus, the voltage across the device decreaseswith a concomitant increase in the current through the device. This is the switching mode. The switching voltage may be tailored by varying the doping and/or width of the n-section.

Following switching, the device comes into the steady-state when the current through the insulating layer is equal to the current flowing across the p⁺-n junction. The I-V characteristic of this highly conducting (ON state) mode is determined principally by the I-V characteristic of the semi-insulating film. By suitable choice of material this portion of the characteristic can approach zero dynamic impedance, i.e. a near-vertical characteristic, characterized by a low holding voltage. Capacitance and switching characteristics of the device are also discussed.     

Lateral insulated-gate bipolar transistor (LIGBT) with a segmentedanode structure

A novel lateral insulated-gate bipolar transistor (LIGBT) structure, called the segmented anode LIGBT, is presented. In this structure, the anode, which is responsible for the injection of minority carriers for conductivity modulation, is implemented using segments of p ⁺ and n⁺ diffusions along the device width. This segmented design of the anode structure results in higher switching speed and reduction in device size. Depending on the value of the specific ON resistance, experimental results show that the segmented anode LIGBT has from 20% to 250% reduction in turn-off time as compared to the shorted anode LIGBT     

Resistive switching effects of HfO2 high-k dielectric

Resistive switching behavior of HfO₂ high-k dielectric has been studied as a promising candidate for emerging non-volatile memory technology. The low resistance ON state and high resistance OFF state can be reversibly altered under a low SET/RESET voltage of ±3 V. The memory device shows stable retention behavior with the resistance ratio between both states maintained greater than 103. The bipolar nature of the voltage-induced hysteretic switching properties suggests changes in film conductivity related to the formation and removal of electronically conducting paths due to the presence of oxygen vacancies induced by the applied electric field. The effect of annealing on the switching behavior was related to changes in compositional and structural properties of the film. A transition from bipolar to unipolar switching behavior was observed upon O₂ annealing which could be related to different natures of defect introduced in the film which changes the film switching parameters. The HfO₂ resistive switching device offers a promising potential for high density and low power memory application with the ease of processing integration.     

Investigation of the Properties of Ba-Substituted La0.7Sr0.3−x Ba x MnO3 Perovskite Manganite Films for Resistive Switching Applications

La_0.7Sr_0.3?x Ba _x MnO₃ (LSBMO: x = 0.09, 0.18, and 0.27) thin films were prepared on Pt-coated Si substrates using a radiofrequency magnetron sputtering technique at a substrate heating temperature of 450°C. The effects of varying the amount of substituted Ba²⁺ on the physical, chemical, and electrical properties of the perovskite manganite films were systematically investigated. X-Ray diffraction showed that the growth orientation and crystallinity of films were not affected by the amount of substituted Ba cations. Raman spectroscopy was used to determine the tilt of MnO₆ octahedra and the Jahn–Teller-type distortion variation of the manganite films. The change in covalent characteristics of Mn–O bonds with increasing amounts of Ba²⁺ substituent was analyzed by x-ray photoelectron spectroscopy, specifically to examine the effects of bond characteristics on the resistive switching properties of LSBMO. The resistance of the LSBMO films increased with increasing Ba²⁺ content due to an increase in the covalent nature of Mn–O bonds. The resistive switching ratio increased with increasing Ba²⁺ amount, and relationships among resistive switching, Jahn–Teller distortion, and Mn–O bond character of LSBMO films were interpreted.