金属-铁电体-GaN结构研究

以铁电体Pb(Zr0.53Ti0.47)O3取代传统绝缘栅氧化物制备了GaN基金属-绝缘层-半导体(MIS)结构.由于铁电体具有较强的极化电场和高介电常数,GaN基金属-铁电体-半导体(MFS)结构的电容-电压特性与其他GaN基MIS结构相比较得到了显著的提高.GaN基MFS结构中GaN激活层达到反型时的偏压小于5V,这和硅基电子器件和集成电路的工作电压一致,而且结果表明GaN层的载流子浓度比其背景载流子浓度减小了一个数量级.因此,GaN基MFS结构对于GaN基场效应晶体管的实际应用具有重要的意义.     

GaN基MFS结构C-V特性研究

采用溶胶-凝胶法(Sol-Gel)在n型GaN衬底上制备了PZT铁电薄膜及其相应的金属-铁电体-半导体(MFS)结构,测量了该MFS结构的C-V特性,从理论上分析了所制备的MFS结构的阈值特性.阈值电压的实验与理论分析结果吻合较好.采用PZT铁电薄膜作为GaN基MFS结构的栅介质,利用其高介电常数和较强的极化电场可以显著降低GaN基MFS器件的工作电压.     

GaN基p-i-n型紫外探测器钝化工艺研究

钝化层膜系的选择及其工艺的优化对降低GaN基紫外探测器的漏电流和提升其可靠性是至关重要的。文章采用多种钝化层：等离子体增强化学气相沉积生长的Si₃N₄(PECVD-Si₃N₄)、电感耦合等离子体化学气相沉积生长的Si₃N₄(ICPCVD-Si₃N₄)和SiO₂(ICPCVD-SiO₂)以及等离子原子层沉积生长的Al₂O₃(PEALD-Al₂O₃),分别制备了GaN基金属-绝缘体-半导体(MIS)器件，并对MIS器件的电流-电压(I-V)和电容-电压(C-V)特性进行了对比研究。采用PECVD-Si₃N₄作为钝化层的GaN基MIS器件具有较低的漏电流；在双层PECVD-Si₃N₄钝化层中插入PEAL...     

p型InGaN/GaN超晶格N面GaN基LED的光电特性

随着氮(N)面GaN材料生长技术的发展,基于N面GaN衬底的高亮度发光二极管(LED)的研究具有重要的科学意义.研究了具有高发光功率的N面GaN基蓝光LED的新型结构设计,通过在N面LED的电子阻挡层和多量子阱有源层之间插入p型InGaN/GaN超晶格来提高有源层中的载流子注入效率.为了对比N面GaN基LED优异的器件性能,同时设计了具有相同结构的Ga面LED.通过对两种LED结构的电致发光特性、有源层中能带图、电场和载流子浓度分布进行比较可以发现,N面LED在输出功率和载流子注入效率上比Ga面LED有明显的提升,从而表明N面GaN基LED具有潜在的应用前景.     

发蓝光的发光二极管

日本某公司技术研究所研制成功发蓝光的氮化镓(GaN)发光二极管,其结构为金属-绝缘体-半导体(MIS).这种器件以蓝宝石为衬底,外延生长一层GaN膜.由于两者的晶格常数约差30%,故粘复性差,成品率不高.为此,该公司采用高温热处理工艺解决了这个问题,并使位错和陷阱之类的晶体缺陷大大减     

溶胶-凝胶法制备Bi2O3-ZnO-Nb2O5薄膜及GaNMIS结构C-V特性

采用溶胶-凝胶法制备出高介电常数的Bi2O3-ZnO-Nb2Os(BZN)薄膜.总结出适合作为GaN金属-绝缘层-半导体场效应晶体管(MIS FET)栅介质的BZN薄膜的原料配比、烧结温度和保温时间等工艺参数,解决了原料溶解、粘稠度、浸润度等工艺问题.同时,结合半导体工艺制造出以BZN薄膜为绝缘介质的GaN MIS结构,通过测量到的高频C-V特性曲线,得到薄膜的相对介电常数为91,MIS结构的强反型电压为-3.4V,平带电压为-1.9V.     

溶胶-凝胶法制备Bi2O3-ZnO-Nb2O5薄膜及GaNMIS结构C-V特性

采用溶胶-凝胶法制备出高介电常数的Bi2O3-ZnO-Nb2Os(BZN)薄膜.总结出适合作为GaN金属-绝缘层-半导体场效应晶体管(MIS FET)栅介质的BZN薄膜的原料配比、烧结温度和保温时间等工艺参数,解决了原料溶解、粘稠度、浸润度等工艺问题.同时,结合半导体工艺制造出以BZN薄膜为绝缘介质的GaN MIS结构,通过测量到的高频C-V特性曲线,得到薄膜的相对介电常数为91,MIS结构的强反型电压为-3.4V,平带电压为-1.9V.     

8英寸Si衬底上高质量AlGaN/GaN HEMT结构的生长

在8英寸(1英寸=2.54 cm)的Si衬底上采用金属有机化学气相沉积(MOCVD)生长了高质量、无龟裂的GaN薄膜和AlGaN/GaN高电子迁移率晶体管(HEMT)结构.通过调节应力调控层的结构,厚度为5 μm的GaN膜层翘曲度低于50 μm.采用X射线衍射(XRD)对GaN薄膜的(002)和(102)衍射峰进行扫描,其半峰全宽(FWHM)分别为182和291 arcsec.透射电子显微镜(TEM)截面图显示GaN外延层的位错密度达到了3.5×107/cm2,证实了在大尺寸Si衬底上可以制作高质量的GaN薄膜.AlGaN/GaN HEMT结构的二维电子气浓度和载流子迁移率分别为9.29×1012/cm2和2 230 cm2/(V·s).基于这些半绝缘AlGaN/GaNHEMT结构所制作的功率电子器件的输出电流可达20 A,横向击穿电压可达1 200 V.     

MIS结构降低源漏极接触电阻的研究进展

介绍了降低金属氧化物半导体场效应晶体管中金属/半导体接触电阻的一种新型的方法,在金属与半导体之间插入一层薄的电介质形成金属-界面层-半导体(metal-interfacial layer-semiconductor,MIS)结构以降低金属/半导体接触电阻。回顾了降低接触电阻的工艺发展历程与趋势,综述了MIS结构的基础物理模型与计算模拟的方法,总结了MIS结构实验研究的最新进展,讨论了MIS结构的局限性与不足之处,并展望了MIS结构在未来的发展方向。     

GaN基紫外探测器发展概况

基于宽禁带半导体材料的GaN基紫外探测器由于具有探测波长可调、工艺兼容性好、结构可多型化等优点,已成为近年来的研究热点。介绍了四种不同结构类型的紫外探测器:光导型、肖特基势垒、金属-半导体-金属、p-i-n结,并回顾了GaN基紫外探测器的的研究历程。     

Fast optical detecting media based on semiconductor nanostructures for recording images obtained using charges of free photocarriers

Available published data on the properties of optical recording media based on semiconductor structures are reviewed. The principles of operation, structure, parameters, and the range of application for optical recording media based on MIS structures formed of photorefractive crystals with a thick layer of insulator and MIS structures with a liquid crystal as the insulator (the MIS LC modulators), as well as the effect of optical bistability in semiconductor structures (semiconductor MIS structures with nanodimensionally thin insulator (TI) layer, M(TI)S nanostructures). Special attention is paid to recording media based on the M(TI)S nanostructures promising for fast processing of highly informative images and to fabrication of optoelectronic correlators of images for noncoherent light.     

磁控溅射AlN介质的14W/mm AlGaN/GaN MIS-HEMT

介绍了一种采用磁控溅射AlN介质作为绝缘层的的SiC衬底AlGaN/GaN MIS-HEMT.器件研制中采用了凹槽栅和场板结构.采用MIS结构后,器件击穿电压由80 V提高到了180 V以上,保证了器件能够实现更高的工作电压.在2 GHz、75 V工作电压下,研制的200μm栅宽AlGaN/GaNMIS-HEMT输出功率密度达到了14.4 W/mm,器件功率增益和功率附加效率分别为20.51 dB和54.2%.     

磁控溅射AlN介质MIS栅结构的AlGaN/GaN HEMT

报道了一种X波段输出功率密度达10.4W/mm的SiC衬底AlGaN/GaN MIS-HEMT。器件研制中采用了MIS结构、凹槽栅以及场板,其中MIS结构中采用了磁控溅射的AlN介质作为绝缘层。采用MIS结构后,器件击穿电压由80V提高到了180V以上,保证了器件能够实现更高的工作电压。在8GHz、55V的工作电压下,研制的1mm栅宽AlGaN/GaN MIS-HEMT输出功率达到了10.4W,此时器件的功率增益和功率附加效率分别达到了6.56dB和39.2%。     

Metal–Insulator–Semiconductor Coaxial Microfibers Based on Self‐Organization of Organic Semiconductor:Polymer Blend for Weavable,Fibriform Organic Field‐Effect Transistors

With the increasing importance of electronic textiles as an ideal platform for wearable electronic devices, requirements for the development of functional electronic fibers with multilayered structures are increasing. In this paper, metal–polymer insulator–organic semiconductor (MIS) coaxial microfibers using the self‐organization of organic semiconductor:insulating polymer blends for weavable, fibriform organic field‐effect transistors (FETs) are demonstrated. A holistic process for MIS coaxial microfiber fabrication, including surface modification of gold microfiber thin‐film coating on the microfiber using a die‐coating system, and the self‐organization of organic semiconductor–insulator polymer blend is presented. Vertical phase‐separation of the organic semiconductor:insulating polymer blend film wrapping the metal microfibers provides a coaxial bilayer structure of gate dielectric (inside) and organic semiconductor (outside) with intimate interfacial contact. It is determined that the fibriform FETs based on MIS coaxial microfiber exhibit good charge carrier mobilities that approach the values of typical devices with planar substrate. It additionally exhibits electrical property uniformity over the entire fiber surface and improved bending durability. Fibriform organic FET embedded in a textile is demonstrated by weaving MIS coaxial microfibers with cotton and conducting threads, which verifies the feasibility of MIS coaxial microfiber for use in electronic textile applications.     

Capacitive Properties of Metal–Insulator–Semiconductor Systems Based on an HgCdTe nBn Structure Grown by Molecular Beam Epitaxy

Journal of Communications Technology and Electronics - The capacitance–voltage (CV) curves of metal–insulator–semiconductor (MIS) systems based on an HgCdTe nBn structure grown by...     

Induced optical reflectivity by local variation of conductivity inMIS structures

Calculations based on theoretical models of metal-insulator-semiconductor structures show that moderate applied potentials can cause sufficiently large induced inversion charge carrier densities at the semiconductor surface to yield reflectivities approaching 100% at the insulator-semiconductor interface. Using p-type silicon as the semiconductor material, positive gate potentials up to 10 V applied to the metal give reflectivities from approximately 15 to nearly 100%. The dependent of doping concentration, insulator thickness, and gate voltage are shown     

Graphene/SiO2/p‐GaN Diodes: An Advanced Economical Alternative for Electrically Tunable Light Emitters

Advanced materials that combine novel functionality and ease of applicability are central to the development of light‐emitting diodes (LEDs), which is of ever increasing commercial importance. Here a new metal‐insulator‐semiconductor (MIS) LED structure that combines economical fabrication with novel device properties is reported. The presented MIS‐LED consists of a graphene electrode on p‐GaN substrate separated by an insulating SiO₂ layer. It is found that the MIS‐LED possesses a unique tunability of the electroluminescence spectra depending on the bias conditions. Tunnel injection from graphene into the p‐GaN can explain the difference in luminescence spectra under forward and reverse bias. The demonstrated MIS‐LED expands the use of graphene and also possibly allows the direct integration of light emitters with other circuit elements.     

High-voltage MIS-gated GaN transistors

Transistors with a high electron mobility based on AlGaN/GaN epitaxial heterostructures are promising component types for creating high-power electronic devices of the next generation. This is due both to a high charge-carrier mobility in the transistor channel and a high electric durability of the material making it possible to achieve high breakdown voltages. For use in power switching devices, normally off GaN transistors operating in the enrichment mode are required. To create normally off GaN transistors, the subgate region on the basis of p-GaN doped with magnesium is more often used. However, optimization of the p-GaN epitaxial-layer thickness and doping level makes it possible to achieve a threshold voltage close to V _th = +2 V for the on-mode of GaN transistors. In this study, it is shown that the use of a subgate MIS (metal–insulator–semiconductor) structure involved in p-GaN transistors results in an increase in the threshold voltage for the on-mode to V _th = +6.8 V, which depends on the subgate-insulator thickness in a wide range. In addition, it is established that the use of the MIS structure results in a decrease in the initial transistor current and the gate current in the on mode, which enables us to decrease the energy losses when controlling powerful GaN transistors.     

Analytical investigation of surface potential and related properties of metal/insulator/III–V semiconductor capacitors

An analytical study of the effect of an applied gate bias on the potential and electron density in the semiconductor of metal/insulator/III–V semiconductor (III–V MIS) capacitors is carried out. For this, Poisson's equation is rewritten to a form amenable to analytical study. Si₃N₄ is used as an insulator layer for the MIS capacitors. In order to highlight the advantages of III–V MIS capacitors over metal-SiO₂---Si (MOS) capacitors, the ideal case free from interface traps is considered and theoretical results are obtained also for MOS capacitors. The calculated results strongly demonstrate the superiority of InGaAs MIS and GaAs MIS capacitors to Si MOS capacitors and pinpoint the situation in which the interface states are present.