共查询到18条相似文献,搜索用时 125 毫秒
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超声波在陶瓷基片化学镀铜中的作用研究 总被引:3,自引:0,他引:3
采用了将超声辅助化学镀铜工艺与传统化学镀铜工艺对比的方法,研究了超声波辅助处理在陶瓷基片化学镀铜(包括前处理)中的作用,结果表明:超声波辅助处理影响化学镀铜的全过程,具体体现为:超声波辅助除油及粗化处理有利于形成致密、表面平整度高的铜层、超声波辅助敏化和活化处理使铜层表面的平整度下降,超声波辅助处理对化学镀中铜的均匀沉积不利。同时分析了超声波辅助处理对沉积速率及铜层显微硬度的影响。 相似文献
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在多层印制板制造过程中,传统孔金属化工艺使用很长时间,大致分成三大步:第一步基体镀前处理:为获得良好的化学镀铜层提供必备的基体表面。第二步活化处理:在清洁的基体表面上形成催化中心,在化学镀铜过程中起到“活化种”的作用,使不导电的基体表面能沉积上铜镀层。第三步就是化学镀铜。 相似文献
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化学镀铜工艺中内层铜的可靠性 总被引:1,自引:0,他引:1
文章作者Crystal Li是罗门-哈斯电子材料亚洲有限公司(香港)电路板技术集团的研究技师。文章主要介绍化学镀铜过程中-目前做通孔或盲孔金属化最常用的制程,可能会影响PcB互联缺陷的一些因素。印制电路板的绝缘材料,其热膨胀系数高于铜材料。因此当焊接使温度升高时,介质的延展大大超过铜的延展。因此,导致增加的应力加到了内层互连的各个表面上。镀铜的通孔和内层铜之间必须要有非常强的结合力,才能使PCB成功地发挥其作用。如果化学镀铜和铜之间或内层化学镀铜和电解铜之间的结合力非常差,热应力就会导致互连缺陷(ICD)发生。 相似文献
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在多层印制板制造过程中,为了保证内层板与半固化片粘接可靠,内层板的铜箔表面都要经过氧化处理。然而,氧化处理后的铜箔表面经酸性溶液或加成法的化学镀铜溶液作用常常发生粉红圈现象。为了防止粉红圈的发生和提高粘接力,日立化成有限公司已开发出一种叫做K—6的化学镀铜溶液。 一、K—6化学镀铜溶液的组成成份和工作条件 K—6的组成成份与普通的加成法化学镀铜溶液的组成成份大致相同。K—6中含有一种特殊的添加剂—K—6添加剂,K—6添 相似文献
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In this study, W and tungsten nitride films were fabricated by reactive sputtering in a N2/Ar atmosphere, the native oxide growth on the surface of the tungsten nitride films was investigated by X-ray photoelectron spectroscopy (XPS). It was found that tungsten nitride films were the mixture of W and W2N sputtered in atmospheres of 3 mTorr argon and at the N2 partial pressure from 0.1 to 2.0 mTorr. The ratio of W and W2N in films was changed with the nitrogen partial pressure in sputtered chamber. Surface oxidations of the W film and tungsten nitride films advanced with time. Electrochemical measurement shows that all reduction-oxidation (redox) potentials of tungsten and tungsten nitrides were lower than that of copper film in electroless copper solution. And so, electroless-plated copper could be deposited on the surface of tungsten nitride films when the substrates were immersed into electroless copper plating solution without any pretreatment. Tungsten nitride films are appropriate for ULSI Cu interconnections using electroless Cu deposition. 相似文献
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在Ag导电胶上化学镀铜工艺 总被引:1,自引:0,他引:1
概述了由Ag导电胶形成的Ag导电膜上的化学镀铜工艺,其特征在于采用新的活化工艺取代传统的Pd催化剂,可以在Ag导电膜上形成均匀致密,无镀层扩展和优良附着性的化学镀铜层,特别适用于印制板的Ag导电胶上选择性化学镀铜。 相似文献
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Electroless plating of copper on AZ31 magnesium alloy substrates 总被引:1,自引:0,他引:1
Chemical surface preparation for copper film on magnesium alloy by both electroless plating and organic coatings was studied. Organic coating was made by immersing the samples into an organosilicon heat-resisting varnish. A subsequent metallization process verified the applicability of this method. In this method, the organic coating acted as an interlayer between the substrate and copper film. When the reaction started, copper deposited directly onto the interlayer surface. X-ray diffraction and SEM analysis were used to understand the composition and morphology of the interlayer and copper film. The copper film has a rather perfect crystalline structure. And the result of the cross-cut test indicates the adhesion between the substrate is good enough. The potentiodynamic polarization curves for corrosion studies of coated magnesium alloys were performed in a corrosive environment of 3.5 wt% NaCl at neutral pH 7. The result reveals that compared with the substrate, the corrosion resistance of the coated AZ31 magnesium alloys increases distinctly. Moreover, the copper film has perfectly antibacterial and decorative properties. The method proposed in this work is environmentally friendly: non-toxic chemicals are used. In addition, this provides a new concept for plating the metals, which are considered difficult to plate due to high reactivity. 相似文献
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Electroless cobalt films have been obtained by deposition using a plating bath containing two reducing agents: dimethylamineborane (DMAB) and sodium hypophosphite. This formulation allows spontaneous activation on copper followed by auto catalytic electroless plating. CoWBP and CoBP films are proposed as diffusion barriers and encapsulation layers, for copper lines and via contacts for ULSI interconnect applications. The crystalline structure, chemical composition and oxidation states of the elements were studied, as well as the electrical resistivity, topography and morphology of the films. The film composition was characterized as a function of the solution composition; the barrier properties of the films were tested and an oxidation resistance study was conducted. The films were characterized and the results show that they can be applied as capping layers for ULSI copper metallization. 相似文献
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Alexandre Garcia Jérôme Polesel‐Maris Pascal Viel Serge Palacin Thomas Berthelot 《Advanced functional materials》2011,21(11):2096-2102
The “ligand induced electroless plating (LIEP) process” is a simple process to obtain localized metal plating onto flexible polymers such as poly(ethylene terephtalate) and polyvinylidene fluoride sheets. This generic and cost‐effective process, efficient on any common polymer surface, is based on the covalent grafting by the GraftFast process of a thin chelating polymer film, such as poly(acrylic acid), which can complex copper ions. The entrapped copper ions are then chemically reduced in situ and the resulting Cu0 species act as a seed layer for the electroless copper growth which, thus, starts inside the host polymer. The present work focuses on the application of the LIEP process to the patterning of localized metallic tracks via two simple lithographic methods. The first is based on a standard photolithography process using a positive photoresist masking to prevent the covalent grafting of PAA in designated areas of the polymer substrate. In the second, the patterning is performed by direct printing of the mask with a commercial laser printer. In both cases, the mask was lifted off before the copper electroless plating step, which provides ecological benefits, since only the amount of copper necessary for the metallic patterning is used. 相似文献
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Leung E.S.W. Winco Kam-Chuen Yung 《Electronics Packaging Manufacturing, IEEE Transactions on》2004,27(2):115-124
The laser-assisted seeding (LAS) mechanism should be able to plate microvias with a high aspect ratio that may not be feasible by conventional electroless plating due to the small via geometry. In particular, the plating of microvias with a high aspect ratio close to one is difficult due to the limited accessibility of chemical solution to the via internal wall surface in conventional plating technology. LAS is a promising alternative. The objectives of this paper are to report the deposition mechanism of a thin copper film layer (laser-assisted seeding) on printed circuit board (PCB) microvias dielectric and to study the quality and reliability of the microvias produced by this mechanism. Results find that the microvias produced by LAS have acceptable quality and are as reliable as that formed by conventional electroless plating technology. The hole wall of the microvia was covered with deposited copper, and the thickness of which was found related to some LAS parameters. A set of experimental best LAS processing conditions is also given. 相似文献