基于半解析谱元法的各向异性介质PBG结构传输特性的研究

将精细积分方法与谱单元法结合,对含有各向异性介质的波导介质层光子带隙(PBG)结构的传输特性进行了研究.从矢量波动方程相对应的单变量变分形式出发,对含有各向异性介质波导横截面采用谱单元进行离散,引入对偶变量,将单变量变分原理导入到哈密顿体系,利用精细积分法求出出口刚度矩阵.数值算例将半解析谱元法与常规有限元法、半解析有限元法进行了比较,表明本文方法具有高精度、高效率的特点,而且计算精度随着谱单元阶数的增加呈指数增长.     

均匀有耗涂层目标的电磁散射分析

采用表面电场和磁场积分方程及矩量法计算了涂层导体/介质目标的双站雷达散射截面,介质是均匀各向同性有耗的.首先利用等效原理建立介质/导体表面的电磁场积分方程,然后采用伽略金法将积分方程组转化为矩阵,求解出涂层表面的等效电磁流后,就可计算目标的散射场.通过对均匀有耗涂层导体球利用解析法[1]和矩量法两种方法进行计算,验证了本文方法的准确性.     

手征介质填充双平板中导模的反射和透射特性

用多模网络与严格模匹配相结合的方法,对纵向填充一层、两层和多层手征介质的双平板中导模的反射和透射特性进行了分析和求解.分析中在横截面采用等效传输线,在纵向采用多模传输线方法,并且利用结构的对称性使得问题简化.对各种不同情形进行了数值计算,讨论了手征参数和波导结构的尺寸对反射和透射特性的影响.     

多层电厚微带天线的阻抗特性

本文提出了一种多层介质电厚微带天线的一种分析方法。从无界空间中的电并矢格林函数出发,导出了分层介质中任意一点具有任意取向的水平电偶极子场的表达式。以此为基础,利用Richmond反作用积分方程,建立了关于贴片上电流分布的积分方程。通过适当选取电流基函数,使本方法适用于电厚介质微带天线。应用Galerkin方法建立矩阵方程。借助于计算机求解该矩阵方程,可得到天线的各项特性。文中用实例进行了验证。     

双层频率选择表面电磁特性数值模拟研究

给出了一种分析有介质加载的不同栅格外形双层频率选择表面电磁特性的数值模拟方法.介质分离区内前向波和反向波分别关于相应的频率选择表面是周期的,确定了矢量传输及衰减模的表述形式.应用电磁场边界条件获得不同Floquet模系数的矩阵表达式,推导出一组耦合的积分方程,利用矩量法求解得到结构的电磁散射特性.模拟结果表明,由于层间介质内电磁场衰减模的耦合,双层FSS结构的电磁传输特性较单层有很大的改善.     

复杂非均匀介质中多偶极层激励的位场分析

本文利用半解析－半数值混合地复杂非均匀介质中单个和多个偶极层所激励的位场进行高效数值求解，并与有限元法结果及实验数据进行了对比验证，获得了满意的一致。该方法已被用于自然电位响应问题的精细建模与求解。     

一种解任意横截面柱形薄壳体电磁屏蔽问题的新方法

本文给出了求解任意横截面柱形薄壳体电磁屏蔽问题的一种新方法 .在平均边界条件的基础上 ,利用单层标量波函数法向量导数的间断性定理 ,得到了任意横截面柱形薄壳体电磁屏蔽问题的积分方程组 .利用边界元法对该积分方程组进行了求解 ,通过与精确边界条件下的解比较 ,发现两种结果符合很好 .本文中的方法简便易行 ,足可准确描述柱形薄壳体外两侧电磁场的分布情况     

高效求解任意非常规目标电磁散射的 修正电场积分方程方法

本文研究了一种可以高效求解任意非常规目标电磁散射的修正电场积分方程方法.借助磁场积分方程主值项的提取,加入到传统电场积分方程中,将传统的一次迭代求解过程转变成逐渐逼近真解的内外两层迭代.其外层迭代不断刷新电流,最终得到精确解.加入磁场主值项的修正电场积分方程显著降低了条件数,同时保留了原电场积分方程普适性强,可用于处理任意非常规目标的优点.对于每一外层迭代步中电流的求解,本文采用了加速矩阵矢量相乘的多层快速非均匀平面波算法,形成高效的内层迭代求解.数值结果表明,该方法在保证精度的同时,可以显著降低问题的求解时间.     

双层FSS结构电性能研究

提出了一种研究不同栅格及单元外形并有介质加载的双层频率选择表面(FSS)电性能的理论分析方法.通过确定双层FSS之间介质内传输波和反射波分别对相应的FSS具有周期性而得到矢量Floquet传输模和衰减模表达形式,应用切向电磁场边界条件推导出一组耦合积分方程,利用矩量法求解得到结构的电磁特性.以Y形缝隙作为FSS谐振单元,计算结果表明,双层FSS结构通过层间电磁场衰减模的耦合能够修正频率响应曲线,电性能较单层有很大的改善.     

三维导体介质复合结构电磁辐射与散射的MLFMA分析

利用多层快速多极子方法(MLFMA)分析三维导体介质复合结构的电磁辐射与散射特性.根据等效原理,介质表面构造Poggio-Miller-Chang-Harrington-Wu(PMCHW)方程,导体表面建立电场积分方程(EFIE).分析了含介质目标MLFMA算法中远区组矩阵矢量相乘运算以及有耗媒质空间中格林函数的平面波展开.利用该方法研究了涂敷目标电磁散射特性以及天线罩对直线阵天线辐射特性的影响.MLFMA的应用降低了计算量和存储量,实现了对电大尺寸目标快速、准确的求解.     

新型前栅极CNT-FED的研究

传统的前栅极场致发射显示板由于介质层和栅极的制作在生成或制作阴极场致发射源之后，在制造过程中容易破坏场致发射源；另外阴极发射对介质层厚度、阳极电压和调制极开口等参数非常敏感，所以器件的发射均匀性难以保证。为了解决这些问题，引入了类似HOP玻璃的结构。阴极上只需要丝印碳纳米管，无需制作介质层和栅极，解决了场致发射源被破坏的问题。阴极与栅极之间真空取代了介质层，由于真空的绝缘性能高于介质层，所以阴极与栅极之间的距离可以减小，栅极的调制效果更显著。由于玻璃的平整度高于一般方法制作的介质层的平整度，所以器件的发射均匀性比较好。     

Equivalent Surface Impedance of an Infinite Periodic Array of Slot Impedance Loads with Dielectric Coating

The problem of plane-wave excitation of an infinite array of slot impedance loads with a dielectric layer is considered in order to determine the equivalent surface impedance. The solution of the problem is found by the method of integral equations, solved numerically by the Krylov–Bogolyubov method, which reduces the integral equation to a system of linear algebraic equations. The numerical results are presented in the form of dependences of the equivalent surface impedance on the geometric dimensions of the structure at fixed values of the period of the array, the angle of incidence, and the thickness of the dielectric layer. It is shown that the equivalent surface impedance can be controlled by varying the width of the slot and the strip conductor. The dependences obtained are compared with the characteristics of an array of slot impedance loads without a dielectric layer.     

衬底结构特征对硅基螺旋电感性能的影响

使用三维电磁场模拟的方法对不同硅衬底结构螺旋电感进行了模拟和分析.通过改变衬底的电导率、隔离层的厚度以及隔离层的材料、衬底引入硅锗合金层等模拟,分析了电感性能的变化.结果表明随着电导率的减小,电感的性能会增强,但改善的幅度会逐渐减小.厚的SiO2隔离层有利于减小衬底损耗,但是会给工艺增加难度.采用低k材料作为隔离层是改善电感性能的一种比较理想的方法.     

Anisotropy Characteristics of Magnetostatic Surface Wave Propagating in YIG/Dielectric/Metal Layered Structure

The anisotropy of magnetostatic surface wave (MSSW) propagating in finite width YIG/dielectric/metal layered structure is analyzed. This problem is solved by finding the rigorous solution of each layer from Maxwell equation and the appropriate transmission Green's function matrix (G). From the relationship of Green's function matrixes of dielectric layer and ferrite layer, the dispersion equation is obtained.The MSSW filter is designed to verify the dispersion characteristics. The experiment results are in good agreement with the calculating data from the model.     

Nonuniform Layer Model of a Millimeter-Wave Phase Shifter (Comments)

In the above paper, Butler et al. have investigated theoretically the propagation characteristics of the dielectric waveguide with plasma layer created by an exponentially absorbed optical beam. They have solved numerically the complex wave equation by using a multipoint boundary-value differential equation solver. On the other hand, we have already treated the same nonuniform layer model by using a multilayer staircase method [2]. In this approach, the actual permittivity profile of the waveguide is approximated by the finite number of steps. The wave equation is solved for each step and the complex propagation constant is determined so as to satisfy the boundary conditions at all interfaces. The mathematical formulation is very simple and an accurate solution can be obtained by increasing the number of steps M. The details of the method can be found in [3] and [4].     

Transmission theory of a parallel-two-wire-transmission-linecovered with three layer media

A parallel-two-wire-transmission-line covered by a three layer media has particular transmission characteristics. It is expected that this type of line might therefore be applied to new microwave circuits and antennas. Such lines have been analyzed by solving Laplace equations as a two dimensional boundary value problem. However, at higher frequencies, it is not appropriate to explain these particular properties using the quasi-TEM mode analysis. Transmission theory for these lines has to be solved using a rigorous three dimensional analysis. in this paper, we describe a new three dimensional analysis technique that is used to obtain more accurate propagation constants by considering the E_Z, H_Z components of the field. The assumed current distribution of the parallel-two-wire-line system is Fourier expanded over the angular coordinate &thetas;, and the boundary value problem is solved by the mode matching technique. It is found that mainly hybrid modes are transmitted via this type of transmission system and that the propagation constant varies discontinuously at frequencies where the dipole mode can exist on the three layer dielectric media itself. Numerical results are presented and compared with experimental data     

A radar absorbing structure on the basis of conducting grids

The problem of reflection of a normally incident electromagnetic wave from a periodic structure of conducting grids with square cells, placed into a dielectric layer lying on a metallic mirror, is solved. It is shown that, with an appropriate choice of parameters, this structure can be low-reflecting in a wide frequency range. It is established that, if the grids are sufficiently fine, such a structure has a frequency-dependent reflection coefficient, which is similar to a structure with conducting films instead of the grids. The results of the work can be used to create low-reflection coatings used for various purposes in microwave technology.     

Dielectric deposition process for Cu/SiO2 integration in a dual damascene interconnection architecture

A challenge to integrate Cu in device interconnections is to avoid Cu diffusion into silicon active zone that could seriously damage device performance, and into interlevel dielectric that could induce shorts or degrade dielectric performance. This paper relates the integration of Cu-CVD with SiO₂. Structures studied are SiO₂ deposited on Cu-CVD, and SiO₂/SiN/Cu structure: a thin SiN layer is deposited on Cu before SiO₂ to act as diffusion barrier and as an etch stop during the interconnect structure patterning. Both SiO₂ and SiN dielectric processes are made in plasma-enhanced chemical vapor deposition processes, from SiH₄ precursor with addition of, respectively, N₂O or NH₃. Cu contamination is shown to occur during the dielectric deposition onto Cu, and is enhanced by the fluorine presence in the deposition chamber. Deposition processes were evaluated in order to lower Cu contamination in the dielectric bulk. On an other hand, a noticeable degradation in Cu layer resistance was evidenced after dielectric deposition due to copper contamination during the dielectric deposition process. This issue can be addressed by the optimization of the dielectric deposition process.     

电流返回路径分解的信号完整性分析方法

提出了一种适用于高速互连电路的信号完整性快速仿真方法。根据电流返回路径 不同,该方法将有过孔的三维互连结构分解为电源平面对阻抗模型和微带线模型,先单独分 析两种模型特性,再级联以求解整个互连结构特性。与全波仿真方法相比,本方法在保证准 确度的前提下可将仿真时间从95 min降低至1 min以内。分析了电路板参数、去耦电容和短 路孔对信号完整性的影响,结果表明插入损耗由电源平面结构在过孔位置处的自阻抗决定。 在工程设计中,可采用减小电源平面对结构厚度、添加去耦电容和选择适当的过孔位置等方 法提高信号完整性